China builds EUV prototype in secret 'Manhattan Project' to achieve semiconductor independence

Reviewed byNidhi Govil

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Chinese scientists have completed a prototype EUV lithography machine capable of producing cutting-edge AI chips, built by former ASML engineers through reverse-engineering. The breakthrough, achieved years ahead of expectations despite Western export controls, marks a major step toward semiconductor self-sufficiency with working chips targeted by 2028-2030.

China Completes Prototype EUV Lithography Machine in High-Security Shenzhen Lab

In a development that challenges years of Western export controls, Chinese scientists have successfully built a prototype machine capable of producing advanced semiconductor chips that power artificial intelligence, smartphones, and military systems. The prototype EUV lithography machine, completed in early 2025 and now undergoing testing in a high-security Shenzhen laboratory, fills nearly an entire factory floor and represents what sources describe as China's 'Manhattan Project' for semiconductor independence

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The machine was built by a team of former ASML engineers who reverse-engineered the Dutch semiconductor giant's extreme ultraviolet lithography machines. According to two people with knowledge of the project, the prototype is operational and successfully generating extreme ultraviolet light, though it has not yet produced working chips

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. This development arrives years ahead of analyst predictions, with ASML CEO Christophe Fouquet stating in April that China would need "many, many years" to develop such technology.

Former ASML Engineers Drive Reverse-Engineering Effort

The breakthrough centers on EUV lithography, a technology that sits at the heart of what has become a technological Cold War. These machines use beams of extreme ultraviolet light to etch circuits thousands of times thinner than a human hair onto silicon wafersβ€”a capability currently monopolized by the West. The smaller the circuits, the more powerful the AI chips become, making this technology indispensable for manufacturing the most advanced chips designed by companies like Nvidia and AMD and produced by chipmakers such as TSMC, Intel, and Samsung

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Until now, only ASML, headquartered in Veldhoven, Netherlands, has mastered EUV technology. Its machines cost around $250 million each, and the company built its first working prototype in 2001. ASML told Reuters it took nearly two decades and billions of euros in R&D spending before producing its first commercially-available chips in 2019

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. The availability of parts from older ASML machines on secondary markets has allowed China to build a domestic prototype, accelerating the timeline significantly.

China Semiconductor Strategy Targets 2028-2030 for Working Chips

The Chinese government has set an ambitious goal of producing working chips on the prototype machine by 2028, according to sources close to the project. However, those involved say a more realistic target is 2030β€”still years earlier than the decade analysts believed it would take China to match the West on chips

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. China still faces major technical challenges, particularly in replicating the precision optics that Western suppliers produce.

The breakthrough marks the culmination of a six-year government initiative to achieve semiconductor self-sufficiency, one of President Xi Jinping's highest priorities. While China's semiconductor goals have been public, the Shenzhen EUV project has been conducted in secret. The project falls under the country's semiconductor strategy, run by Xi Jinping confidant Ding Xuexiang, who heads the Communist Party's Central Science and Technology Commission

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Huawei Coordinates Massive Network of Engineers and Research Institutes

Chinese electronics giant Huawei plays a central role coordinating a web of companies and state research institutes across the country involving thousands of engineers, according to three sources. "The aim is for China to eventually be able to make advanced chips on machines that are entirely China-made," one source explained. "China wants the United States 100% kicked out of its supply chains"

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Source: Reuters

Source: Reuters

This coordinated effort represents a direct challenge to Western military dominance and technological leadership. The development of domestic EUV lithography machines would allow China to produce cutting-edge AI chips without relying on Western technology or navigating export restrictions that have sought to keep the country at least a generation behind in chipmaking capabilities.

Western Export Controls Face Test as China Accelerates Timeline

Starting in 2018, the United States began pressuring the Netherlands to block ASML from selling EUV systems to China. The restrictions expanded in 2022, when the Biden administration imposed sweeping export controls designed to cut off China's access to advanced semiconductor technology. The controls targeted not just EUV systems but also older deep ultraviolet (DUV) lithography machines that produce less-advanced chips, aiming to maintain Western technological superiority

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ASML's EUV systems are currently available to U.S. allies including Taiwan, South Korea, and Japan. No EUV system has ever been sold to a customer in China, ASML confirmed. The U.S. State Department said the Trump Administration has strengthened enforcement of export controls on advanced semiconductor manufacturing equipment and is working with partners "to close loopholes as technology advances"

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ASML responded to the news by acknowledging that "it makes sense that companies would want to replicate our technology, but doing so is no small feat." The existence of this prototype suggests that Western efforts to maintain a technological monopoly on lithography machines may face greater challenges than anticipated. The race for semiconductor independence now enters a critical phase as China works to overcome remaining technical hurdles in precision optical systems and silicon wafers processingβ€”challenges that could determine whether the supply chain for AI chips fundamentally shifts in the coming years.

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