MediaTek Unveils Dimensity 7400 Series: Bringing Advanced AI and Gaming to Mid-Range Smartphones

New MediaTek Chips Bring Improved Gaming, AI, 5G to Midrange Phones

The Dimensity 7400 and 7400X chipsets use a 4nm process and feature an eight-core CPU, with four high-performance Arm Cortex-A78 cores (up to 2.6GHz) and four power-efficient Cortex-A55 cores (up to 2.0GHz). MediaTek claims these chips consume 14% to 36% less power during gaming compared with unnamed competitors. The 7400 series also includes MediaTek Advanced Gaming Technology 3.0, promising smoother gameplay, better graphics, reduced lag, and power optimizations for longer gaming sessions. MediaTek says the 7400 series' new Neural Processing Unit (NPU) delivers 15% better performance than the Dimensity 7300. Its image signal processor (ISP) leverages AI for improved photography, including Google Ultra HDR support, enhanced contrast, and more vibrant colors. The ISP should also produce sharper images in low-light conditions. These chips also support dual displays, making them prime candidates for foldable phones. They also feature Wi-Fi 6E and carrier aggregation for faster, more reliable download and upload speeds. MediaTek 6400 The Dimensity 6400 chipset packs two high-performance Arm Cortex-A76 cores (up to 2.5GHz) and six power-efficient Cortex-A55 cores (up to 2.0GHz), though it uses a 6nm process. MediaTek says this chip is 19% more efficient when gaming compared with unspecified competitive chipsets. For smoother gameplay, the 6400 includes MediaTek's Bluetooth Wi-Fi HyperCoex Technology, which can reduce gaming latency by up to 90%. It also enhances photo quality with advanced noise reduction and supports cameras up to 108MP. On the display side, the 6400 enables True Color Accuracy, allowing screens to render more lifelike colors. Devices powered by the Dimensity 6400 are already available, while smartphones featuring the Dimensity 7400 and 7400X are expected to hit the market in the first quarter of 2025.

MediaTek Dimensity 7400 and Dimensity 6400 Makes Improved Gaming, Connectivity and AI Performance More Accessible

Latest power-efficient chipsets complement full Dimensity portfolio of best-in-class mobile SoCs MediaTek announced a trio of new ultra-efficient chipsets designed to be an integral part of the industry-leading MediaTek Dimensity family, offering exceptional experiences for high-tech and mainstream mobile devices to complement the flagship and premium offerings of the Dimensity 9400 and 8400. The Dimensity 7400 and 7400X are geared to deliver advanced gaming and AI camera technology to consumers, and the Dimensity 6400 provides fantastic performance and enhanced 5G in an accessible package. Both Dimensity 7400 chipsets integrate an octa-core CPU with 4X Arm Cortex-A78 cores operating up to 2.6GHz and 4X Arm Cortex-A55 cores up to 2.0GHz, plus an Arm Mali-G615 MC2 GPU. Built on TSMC's 4nm process node, the Dimensity 7400 and 7400X run super efficiently, using between 14% to 36% less power when gaming compared to competitive chipsets. In addition, the SoCs feature MediaTek Advanced Gaming Technology (MAGT) 3.0 support for improved graphics performance, AI optimizations that adjust game settings based on the device's workload, reduced input lag for quicker response, and advanced power savings so users can enjoy longer gaming sessions. "With our Dimensity 7400 and Dimensity 6400 chipsets, MediaTek is proving once again that it has the capability to bring incredible smartphone experience to more affordable price ranges," said Dr. Yenchi Lee, General Manager of MediaTek's Wireless Communications Business. "Whether gaming, using the latest AI applications, or taking photos and videos, users can enjoy the significant performance and impressive energy efficiency that they have come to expect from the Dimensity family." To boost the performance of AI applications, Dimensity 7400 and Dimensity 7400X integrate MediaTek's NPU 6.0, with a 15% upgrade in performance over the Dimensity 7300. Offering premium multimedia capabilities with an Imagiq 950 high-end signal processor (ISP), Dimensity 7400 and 7400X support advanced AI camera features for capturing stunning images, even in low lighting. The chips also have Google Ultra HDR support for higher dynamic range, vivid colors, and better contrast for photos and videos. This ensures that photos and videos retain their quality when uploading from a user's smartphone to social media. Additional features of the Dimensity 7400 and Dimensity 7400X include: Support for dual display flip phones (7400X) to give OEMs more design flexibility. 5G R16 modem with 3CC carrier aggregation (3CC-CA) that leverages MediaTek's UltraSave 3.0+ technologies to provide 20% lower power compared to the competition. Tri-band Wi-Fi 6E support for fast and reliable multi-gigabit wireless connectivity. MediaTek Dimensity 6400 The newest entry in the Dimensity 6000 series of affordable chipsets enhances the latest 5G connectivity features to make them accessible to more people around the world. The Dimensity 6400 utilizes an octa-core CPU with 2X Arm Cortex-A76 cores operating up to 2.5GHz and 6X Arm Cortex-A55 cores up to 2.0GHz, plus an Arm Mali-G57 MC2 GPU. Built on TSMC's 6nm process node, Dimensity 6400 runs super efficiently, using up to 19% less power when gaming compared to competitive chipsets. Key features of the chipset include: MediaTek Bluetooth Wi-Fi HyperCoex Technology which reduces gaming latency by up to 90% for a smoother gaming experience. Release 16 Sub-6 5G Modem supports 2CC-CA for improved connectivity. Up to 33% faster downlink and 18% faster uplink speeds compared to competitors. Enables billion-color displays with real 10-bit images and videos for vivid visuals and supports True Color Accuracy for improved color correction, generating more accurate and lifelike visuals. 108MP camera sensors enhanced with MediaTek and Arcsoft's multi-frame noise reduction (MFNR) and low pass noise reduction (LPNR) for sharper selfies and portraits. The first smartphones powered by the MediaTek Dimensity 7400 and 7400X will be available in Q1 2025; Dimensity 6400 is currently available. To learn more about MediaTek's Dimensity portfolio, please visit: https://i.mediatek.com/mediatek-5g. ### About MediaTek Inc. MediaTek Incorporated (TWSE: 2454) is a global fabless semiconductor company that enables nearly 2 billion connected devices a year. We are a market leader in developing innovative systems-on-chip (SoC) for mobile, home entertainment, connectivity and IoT products. Our dedication to innovation has positioned us as a driving market force in several key technology areas, including highly power-efficient mobile technologies, automotive solutions and a broad range of advanced multimedia products such as smartphones, tablets, digital televisions, 5G, Voice Assistant Devices (VAD) and wearables. MediaTek empowers and inspires people to expand their horizons and achieve their goals through smart technology, more easily and efficiently than ever before. We work with the brands you love to make great technology accessible to everyone, and it drives everything we do. Visit www.mediatek.com for more information.

MediaTek's Dimensity 7400 series fills in the blanks with AI for more users

AI is becoming an integral part of how we interact with our devices, and it only truly becomes useful if the vast majority of phones can take advantage of those models. The Dimensity 7400 series from MediaTek offers a better dedicated NPU and heavy improvements to gaming at its level. The Dimensity 7400 and 7400X are both brand-new from MediaTek. Where the existing Dimensity 9400 and 8400 are obtainable in high-end smartphones, the 7400 series will likely sit in the high to middle range of devices. MediaTek is also announcing the Dimensity 6400, which will sit below that and bring some of its own improvements to the market as a whole. The Dimensity 7400 and 7400X bring an octa-core CPU with four Arm cortex-A78 and four Cortex-A55 cores. The structure also has room for a Mali-G615 MC2 GPU, which comes into play where the chips supposedly shine. Both SoCs are built on a 4nm process and boast power efficiency while gaming. MediaTek is utilizing a proprietary 6th-gen NPU. According to MediaTek, its performance is 15% better than the 7300's. If that's true, that's a big jump in AI, considering that there tend to be diminishing returns after a certain point. This positions the Dimensity 7400 series as a contender for mid-range devices that bring AI to more users beyond just the high-end flagships. There seem to be a couple of differences between the 7400 and 7400X. The 7400X is compatible with dual-display flip devices. Beyond that, the two SoCs are very similar. MediaTek's Dimesnity 6400 is also an important release. It has half the number of Cortex-A76 cores and two more A55 cores, which offers decent performance at a lower cost. The phones it finds itself in are likely going to be budget devices that aim to offer users the essentials. The SoC prioritizes 5G connectivity and some gaming. MediaTek notes that the Dimensity 7400 and 7400X will be found in devices starting in Q1 2025, while the Dimensity 6400 is now available.

MediaTek Dimensity 7400 Series SoC for Mid-Range Devices, Foldables Launched

MediaTek claims up to 36 percent lower power consumption in gaming MediaTek on Tuesday launched two new chipsets for mobile devices. The chips, dubbed Dimensity 7400 and Dimensity 7400X, target smartphones with different form factors. The Taiwan-based chipmaker says its new processors are developed for mainstream devices to complement its flagship and premium offerings, such as the Dimensity 9400. As per the company, the Dimensity 7400 is a successor to last year's Dimensity 7300 while the Dimensity 7400X is built for powering foldable mobile experiences. MediaTek's new chips have an octa-core architecture and feature an integrated neural processing unit (NPU) which powers the artificial intelligence (AI) capabilities on mobile devices. The new Dimensity 7400 series chips build upon the launch of the Dimensity 6400 processor for mid-range devices launched by the company last week. MediaTek says Android devices powered by its latest Dimensity 740 and Dimensity 7400X SoCs are expected to be available in the market by Q1 2025. According to MediaTek, the Dimensity 7400 series chipsets have similar specifications, with the only differentiating factor being their target devices. The Dimensity 7400 is built for normal devices while the Dimensity 7400X is expected to power those with foldable form factors. The chips have an octa-core architecture built on TSMC's 4nm process node. They feature four Arm Cortex-A78 cores with a peak clock speed of 2.6GHz and four Arm Cortex-A55 cores operating at 2.0GHz, complemented by an Arm Mali-G615 MC2 graphics processing unit (GPU). Courtesy of its architecture, MediaTek claims its new chips consume 14 to 36 percent less power when gaming compared to other competing processors. They also come with MediaTek Advanced Gaming Technology (MAGT) 3.0 support which delivers improved graphics performance, AI optimisations for adjusting gaming performance, reduced input lag, and advanced power savings. Building upon the AI capabilities offered by its predecessor, the Dimensity 7400 and Dimensity 7400X chips also integrate MediaTek's NPU 6.0 which is said to bring a 15 percent performance boost in AI applications. The company says devices running these chipsets will support up to LPDDR5 RAM and up to UFS 3.1 storage. Smartphones equipped with the Dimensity 7400 series chips will be able to support up to 200-megapixel camera sensors, leveraging the built-in MediaTek Imagiq 950 12-bit HDR ISP. It features an advanced hardware engine which is claimed to enhance the image quality with motion compensated noise reduction (MCNR), hardware face detection (HWFD), and video HDR. It supports video capture and playback in up to 4K resolution at 30 frames per second (fps). The chip supports on-device displays with either a full HD+ resolution at 144Hz or a wide full HD+ resolution at 120Hz. For connectivity, the Dimensity 7400 SoCs bring MediaTek's 5G R16 modem with up to 3.27Gbps downlink speeds and support for Wi-Fi 6E and Bluetooth 5.4. As per the company, the modem has 3CC carrier aggregation (3CC-CA) that leverages MediaTek's UltraSave 3.0+ technologies to provide a 20 percent lower power consumption compared to the competing chipsets. The MediaTek Dimensity 7400 series chips also support satellite systems such as QZSS, Galileo, Beidou, GLONASS, NavIC, and GPS.

MediaTek Dimensity 7400 and Dimensity 6400 Makes Improved Gaming, Connectivity and AI Performance More Accessible

Enter your email to get Benzinga's ultimate morning update: The PreMarket Activity Newsletter Latest power-efficient chipsets complement full Dimensity portfolio of best-in-class mobile SoCs HSINCHU, Feb. 24, 2025 /PRNewswire/ -- MediaTek announced a trio of new ultra-efficient chipsets designed to be an integral part of the industry-leading MediaTek Dimensity family, offering exceptional experiences for high-tech and mainstream mobile devices to complement the flagship and premium offerings of the Dimensity 9400 and 8400. The Dimensity 7400 and 7400X are geared to deliver advanced gaming and AI camera technology to consumers, and the Dimensity 6400 provides fantastic performance and enhanced 5G in an accessible package. Both Dimensity 7400 chipsets integrate an octa-core CPU with 4X Arm Cortex-A78 cores operating up to 2.6GHz and 4X Arm Cortex-A55 cores up to 2.0GHz, plus an Arm Mali-G615 MC2 GPU. Built on TSMC's 4nm process node, the Dimensity 7400 and 7400X run super efficiently, using between 14% to 36% less power when gaming compared to competitive chipsets. In addition, the SoCs feature MediaTek Advanced Gaming Technology (MAGT) 3.0 support for improved graphics performance, AI optimizations that adjust game settings based on the device's workload, reduced input lag for quicker response, and advanced power savings so users can enjoy longer gaming sessions. "With our Dimensity 7400 and Dimensity 6400 chipsets, MediaTek is proving once again that it has the capability to bring incredible smartphone experience to more affordable price ranges," said Dr. Yenchi Lee, General Manager of MediaTek's Wireless Communications Business. "Whether gaming, using the latest AI applications, or taking photos and videos, users can enjoy the significant performance and impressive energy efficiency that they have come to expect from the Dimensity family." To boost the performance of AI applications, Dimensity 7400 and Dimensity 7400X integrate MediaTek's NPU 6.0, with a 15% upgrade in performance over the Dimensity 7300. Offering premium multimedia capabilities with an Imagiq 950 high-end signal processor (ISP), Dimensity 7400 and 7400X support advanced AI camera features for capturing stunning images, even in low lighting. The chips also have Google Ultra HDR support for higher dynamic range, vivid colors, and better contrast for photos and videos. This ensures that photos and videos retain their quality when uploading from a user's smartphone to social media. Additional features of the Dimensity 7400 and Dimensity 7400X include: Support for dual display flip phones (7400X) to give OEMs more design flexibility.5G R16 modem with 3CC carrier aggregation (3CC-CA) that leverages MediaTek's UltraSave 3.0+ technologies to provide 20% lower power compared to the competition.Tri-band Wi-Fi 6E support for fast and reliable multi-gigabit wireless connectivity. MediaTek Dimensity 6400 The newest entry in the Dimensity 6000 series of affordable chipsets enhances the latest 5G connectivity features to make them accessible to more people around the world. The Dimensity 6400 utilizes an octa-core CPU with 2X Arm Cortex-A76 cores operating up to 2.5GHz and 6X Arm Cortex-A55 cores up to 2.0GHz, plus an Arm Mali-G57 MC2 GPU. Built on TSMC's 6nm process node, Dimensity 6400 runs super efficiently, using up to 19% less power when gaming compared to competitive chipsets. Key features of the chipset include: MediaTek Bluetooth Wi-Fi HyperCoex Technology which reduces gaming latency by up to 90% for a smoother gaming experience.Release 16 Sub-6 5G Modem supports 2CC-CA for improved connectivity.Up to 33% faster downlink and 18% faster uplink speeds compared to competitors.Enables billion-color displays with real 10-bit images and videos for vivid visuals and supports True Color Accuracy for improved color correction, generating more accurate and lifelike visuals.108MP camera sensors enhanced with MediaTek and Arcsoft's multi-frame noise reduction (MFNR) and low pass noise reduction (LPNR) for sharper selfies and portraits. The first smartphones powered by the MediaTek Dimensity 7400 and 7400X will be available in Q1 2025; Dimensity 6400 is currently available. To learn more about MediaTek's Dimensity portfolio, please visit: https://i.mediatek.com/mediatek-5g. ### About MediaTek Inc. MediaTek Incorporated (TWSE: 2454) is a global fabless semiconductor company that enables nearly 2 billion connected devices a year. We are a market leader in developing innovative systems-on-chip (SoC) for mobile, home entertainment, connectivity and IoT products. Our dedication to innovation has positioned us as a driving market force in several key technology areas, including highly power-efficient mobile technologies, automotive solutions and a broad range of advanced multimedia products such as smartphones, tablets, digital televisions, 5G, Voice Assistant Devices (VAD) and wearables. MediaTek empowers and inspires people to expand their horizons and achieve their goals through smart technology, more easily and efficiently than ever before. We work with the brands you love to make great technology accessible to everyone, and it drives everything we do. Visit www.mediatek.com for more information. Contact Information: Kevin Keating pr@mediatek.com View original content:https://www.prnewswire.com/news-releases/mediatek-dimensity-7400-and-dimensity-6400-makes-improved-gaming-connectivity-and-ai-performance-more-accessible-302383809.html SOURCE MediaTek Inc. Market News and Data brought to you by Benzinga APIs