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Tenstorrent, Hyundai-backed BOS unveil automotive AI chips
SEOUL, Dec 12 (Reuters) - Canadian startup Tenstorrent and BOS Semiconductors, a South Korean chip startup backed by Hyundai Motor Group, unveiled on Thursday artificial intelligence (AI) chips used for in-vehicle infotainment and autonomous driving. As autos increasingly become 'computers on wheels', demand has grown for AI chips to handle high performance workloads necessary for complex features. The chips are the industry's first "automotive chiplet AI accelerator", Park Jae-hong, founder of BOS Semiconductors, told Reuters. Chiplets - small chips combined into a large system like LEGO blocks - allow automakers to customise the system to meet their needs and reduce costs by updating specific functionalities, he said. Park said BOS Semiconductors is in talks with unidentified German automakers to supply the products, called "Eagle-N", which will debut at the Consumer Electronics Show in January and go into production in late 2026. BOS will carve out the niche market as it challenges chip giants such as Qualcomm (QCOM.O), opens new tab in automotive AI chips, he said. Park previously worked for Samsung Electronics (005380.KS), opens new tab, where he developed chips for Apple (AAPL.O), opens new tab and Tesla (TSLA.O), opens new tab. It will be produced using one of Samsung's advanced manufacturing processes, known as 5nm. Tenstorrent is headed by Jim Keller, a former Apple chip designer who also oversaw Tesla's efforts to design a chip for autonomous driving. Tenstorrent has attracted investors such as Hyundai Motor Group, Samsung and Jeff Bezos' family office. Reporting by Hyunjoo Jin; Editing by Muralikumar Anantharaman Our Standards: The Thomson Reuters Trust Principles., opens new tab Suggested Topics:Artificial IntelligenceADAS, AV & SafetySoftware-Defined VehicleSustainable & EV Supply ChainEV Strategy
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Tenstorrent, Hyundai-backed BOS unveil automotive AI chips
SEOUL (Reuters) - Canadian startup Tenstorrent and BOS Semiconductors, a South Korean chip startup backed by Hyundai Motor Group, unveiled on Thursday artificial intelligence (AI) chips used for in-vehicle infotainment and autonomous driving. As autos increasingly become 'computers on wheels', demand has grown for AI chips to handle high performance workloads necessary for complex features. The chips are the industry's first "automotive chiplet AI accelerator", Park Jae-hong, founder of BOS Semiconductors, told Reuters. Chiplets - small chips combined into a large system like LEGO blocks - allow automakers to customise the system to meet their needs and reduce costs by updating specific functionalities, he said. Park said BOS Semiconductors is in talks with unidentified German automakers to supply the products, called "Eagle-N", which will debut at the Consumer Electronics Show in January and go into production in late 2026. BOS will carve out the niche market as it challenges chip giants such as Qualcomm in automotive AI chips, he said. Park previously worked for Samsung Electronics, where he developed chips for Apple and Tesla. It will be produced using one of Samsung's advanced manufacturing processes, known as 5nm. Tenstorrent is headed by Jim Keller, a former Apple chip designer who also oversaw Tesla's efforts to design a chip for autonomous driving. Tenstorrent has attracted investors such as Hyundai Motor Group, Samsung and Jeff Bezos' family office. (Reporting by Hyunjoo Jin; Editing by Muralikumar Anantharaman)
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Canadian startup Tenstorrent and Hyundai-backed BOS Semiconductors have introduced innovative AI chips for in-vehicle infotainment and autonomous driving, marking a significant advancement in automotive technology.
Canadian startup Tenstorrent and South Korean chip startup BOS Semiconductors have unveiled groundbreaking artificial intelligence (AI) chips designed for in-vehicle infotainment and autonomous driving. This development comes as automobiles increasingly transform into 'computers on wheels', driving up demand for AI chips capable of handling high-performance workloads required for complex features
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.Park Jae-hong, founder of BOS Semiconductors, has announced that these chips represent the industry's first "automotive chiplet AI accelerator"
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. The innovative chiplet technology allows for small chips to be combined into a larger system, much like LEGO blocks. This approach offers automakers the flexibility to customize systems according to their specific needs while reducing costs by enabling updates to specific functionalities2
.The new AI chips, dubbed "Eagle-N", are set to make their debut at the Consumer Electronics Show in January, with production slated to begin in late 2026. BOS Semiconductors is currently in discussions with unnamed German automakers regarding the supply of these chips
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. The company aims to carve out a niche in the market, positioning itself as a challenger to established chip giants like Qualcomm in the automotive AI chip sector2
.The Eagle-N chips will be manufactured using Samsung's advanced 5nm process, leveraging cutting-edge semiconductor technology
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. This collaboration highlights the intricate relationships within the tech industry, as Park Jae-hong previously worked at Samsung Electronics, where he developed chips for major players like Apple and Tesla2
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Tenstorrent, the Canadian partner in this venture, is led by Jim Keller, a former Apple chip designer who also oversaw Tesla's efforts to design chips for autonomous driving. The startup has attracted significant investment from industry heavyweights, including Hyundai Motor Group, Samsung, and Jeff Bezos' family office
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. This backing from major players in the tech and automotive sectors underscores the potential impact of these new AI chips on the future of automotive technology.The introduction of these advanced AI chips signifies a major step forward in the automotive industry's evolution towards more intelligent and connected vehicles. As cars continue to incorporate more complex features and autonomous capabilities, the demand for high-performance AI chips is expected to grow. This development could potentially reshape the competitive landscape in the automotive semiconductor market, challenging established players and opening up new possibilities for innovation in vehicle design and functionality.
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