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Western Digital and Ingrasys Partner to Launch High-Performance Storage Solution for AI Workflows
By combining Ingrasys' world-class manufacturing capabilities expertise in GPU servers, and Western Digital's expertise in NVMe-oF and fabric-attached storage, the two companies are enabling more flexible disaggregated infrastructure that unlocks new levels of efficiency, scalability, and performance for data centers tackling the challenges of AI at scale. The Ingrasys TOR EBOF, targeted for 2027 availability, represents a cutting-edge integration of networking and storage technologies. This innovative TOR switch features embedded storage capabilities enabled by Western Digital's next-generation RapidFlex Fabric bridge device supporting 100G Ethernet and NVMe™/PCIe® Gen6 drive slots for E3.S/L SSD devices. At its core, the TOR switch is powered by the NVIDIA Spectrum™-4 switch ASIC, ensuring high-performance switching. The switch also offers flexibility with 400/800GbE cabling options making it a robust solution for future data center needs.
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Western Digital Unveils New Storage Innovations to Power AI Architectures at Computex 2025
Flexibility and Choice: Now Qualifying Multiple SSD Vendors Western Digital's Platforms business now offers customers enhanced flexibility and choice in building their storage infrastructure. By supporting a multi-SSD vendor strategy, Western Digital has currently qualified SSDs with leading providers such as DapuStor, Kioxia, Phison, Sandisk and ScaleFlux with additional vendors in the qualification process. This approach empowers both Western Digital and its customers to leverage preferred suppliers while optimizing for performance, cost, and supply chain resilience. By qualifying multiple SSD vendors, Western Digital ensures that customers have access to the best possible options for their storage infrastructure, reinforcing its commitment to innovation and excellence in the industry. "As workloads grow more complex and AI accelerates infrastructure demands, the future will be defined by those who can scale smarter, move faster, and deploy with confidence," said Kurt Chan, vice president and general manager, Western Digital's Platforms Business. "With OCCL 2.0 and our latest Platform innovations, we're not just keeping up -- we're setting the pace for what modern, disaggregated, and software-defined data centers can achieve. We remain deeply committed to enabling open, flexible architectures that empower customers to build scalable infrastructure tailored to their evolving data needs."
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Western Digital and Ingrasys Establish Long-term Collaboration to Deliver High-Performance, Fabric-Attached Disaggregated Storage for AI Workflows
Western Digital (Nasdaq: WDC) and Ingrasys, a subsidiary of Foxconn Technology Group, the world's largest electronics manufacturer, today announced a strategic collaboration to deliver a new flagship Top-of-Rack (TOR) switch with embedded storage. This new TOR EBOF (Ethernet Bunch of Flash) will provide distributed storage at the network edge for lower latency storage access, reducing the need for separate storage networks and avoiding trips to centralized storage arrays. In this joint effort, Ingrasys will manufacture the high-density TOR EBOF, leveraging Western Digital's RapidFlex™ NVMe-oF™ bridge technology. Western Digital will collaborate with Ingrasys on the architecture and lead the go-to-market efforts to promote NVMe-oF disaggregated storage solutions for cloud service providers (CSPs) and storage OEMs. This collaboration marks a significant milestone in the rapidly expanding AI market, accelerating the adoption of fabric-attached disaggregated storage to meet the ever-growing demands of AI workflows. By combining Ingrasys' world-class manufacturing capabilities expertise in GPU servers, and Western Digital's expertise in NVMe-oF and fabric-attached storage, the two companies are enabling more flexible disaggregated infrastructure that unlocks new levels of efficiency, scalability, and performance for data centers tackling the challenges of AI at scale. The Ingrasys TOR EBOF, targeted for 2027 availability, represents a cutting-edge integration of networking and storage technologies. This innovative TOR switch features embedded storage capabilities enabled by Western Digital's next-generation RapidFlex Fabric bridge device supporting 100G Ethernet and NVMe™/PCIe® Gen6 drive slots for E3.S/L SSD devices. At its core, the TOR switch is powered by the NVIDIA Spectrum™-4 switch ASIC, ensuring high-performance switching. The switch also offers flexibility with 400/800GbE cabling options making it a robust solution for future data center needs. Western Digital's RapidFlex NVMe-oF fabric bridge device is a pioneering solution in fabric-attached storage, offering low-power, extreme performance and flexibility for modern data centers. As the only NVMe-oF bridge device that is based on extensive levels of hardware acceleration and removes firmware from the performance path, the I/O read and write payload flows through the adapter with minimal latency and direct Ethernet connectivity. This differentiated approach facilitates seamless, high-performance integration of NVMe SSDs into disaggregated architectures, allowing for efficient scaling of storage resources independently from compute. "Together with Ingrasys, we continue to accelerate the shift toward disaggregated infrastructure by co-developing cutting-edge, fabric-attached solutions designed for the data demands of AI and modern workloads. This collaboration brings together two leaders in storage infrastructure modernization to deliver flexible, scalable architectures that unlock new levels of efficiency and performance for our customers," said Kurt Chan, vice president and general manager, Western Digital Platforms Business. "Our collaboration with Western Digital reflects a shared commitment to long-term innovation and customer-centric design. By combining our expertise in scalable system integration with Western Digital's leadership in storage technologies, we're building a foundation for future-ready, fabric-attached solutions that will meet the evolving demands of AI and disaggregated infrastructure. This partnership is just the beginning of what we believe will be a lasting journey of co-innovation," said Benjamin Ting, president of Ingrasys. "The collaboration between Western Digital and Ingrasys brings together the high-performance storage and scalable system transformation needed to fully unlock the potential of accelerated computing. As AI and data-intensive workloads push infrastructure limits, this joint effort is set to deliver the performance, low latency, and disaggregated scalability that next-generation data centers require," said Gilad Shainer, senior vice president of networking at NVIDIA. Meet Western Digital at Computex: Experience the Future of Data Infrastructure Visit Western Digital's at Computex in Taipei. Find us at booth J1303a in Hall 1 Storage and Management Solutions at the Taipei Nangang Exhibition Center from May 2023. About Ingrasys Ingrasys, a subsidiary of Foxconn Technology Group, is a global leader in cloud infrastructure and AI computing solutions. The company delivers high-performance servers, storage systems, AI accelerators, and rack-scale platforms with advanced liquid cooling. Backed by a vertically integrated supply chain and engineering expertise, Ingrasys drives AI innovation to empower the next generation of sustainable data centers. Learn more at www.ingrasys.com. About Western Digital Western Digital empowers the systems and people who rely on data. Consistently delivering massive capacity, high quality and low TCO, Western Digital is trusted by hyperscale cloud providers, enterprise data centers, content professionals and consumers around the world. Core to its values, the company recognizes the urgency to combat climate change and is on a mission to design storage technologies that not only meet today's data demands but also contribute to a more climate-conscious future. Follow Western Digital on LinkedIn and learn more at www.westerndigital.com.
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Western Digital Advances Ecosystem Collaboration, Innovation for AI Acceleration, Disaggregated Storage and SDS at Computex 2025
From Expanded Open Composable Compatibility Lab Capabilities to New Storage Platforms and Broader SSD Qualifications, Western Digital is the Partner of Choice for Interoperability and Customer-centric Designs for Modern Datacenter Architectures Western Digital (Nasdaq: WDC) is redefining what's possible in storage infrastructure for AI/ML, disaggregated storage and software-defined storage (SDS) for CSPs, enterprises and STaaS providers. From massive-capacity, reliable JBODs (Just a Bunch of Disks) to ultra-fast EBOF (Ethernet Bunch of Flash) NVMe-oF™ disaggregated storage solutions for AI, the company's Platforms Business delivers world-class HDD- and SSD-based solutions that power today's most demanding workloads. As AI, ML and data-heavy workloads continue to accelerate, organizations face growing pressure to build flexible storage infrastructures that are scalable, efficient and sustainable. Traditional systems may struggle to keep pace with modern demands. Giving customers the flexibility to scale and the freedom to avoid vendor lock-in, Western Digital is announcing the expansion of the company's Open Composable Compatibility Lab (OCCL); a new Ultrastar® Data102 ORv3 JBOD and an OpenFlex® Data24 4100 with single-port SSDs; as well as new SSD qualifications for its OpenFlex Data24 NVMe-oF storage platform. Open Lab. Smarter Infrastructure. OCCL 2.0 is Here. Western Digital's Open Composable Compatibility Lab (OCCL) in Colorado Springs accelerates industry-wide interoperability for fabric-attached devices and software-defined storage. Designed for CSPs and enterprise customers, the OCCL serves as a vendor-neutral proving ground to simulate real-world environments and workloads -- providing critical insights into system compatibility, interoperability, energy efficiency, and performance optimization. For modern NVMe-oF architectures, OCCL provides testing across disaggregated compute, storage and networking to help customers scale more efficiently, reduce costs, and deploy with greater confidence. Key enhancements include: Solutions Architectures: OCCL 2.0 will generate detailed solutions architectures, offering guidance on deploying and managing composable disaggregated infrastructure effectively. Disaggregated Storage Best Practices: OCCL 2.0 will highlight best practices for disaggregated storage, helping organizations to maximize efficiency and scalability. Industry Expertise: OCCL 2.0 will continue to be a source of thought leadership, sharing strategic insights and innovations in the field of composable infrastructure. SSD Partner Benchmarking: OCCL 2.0 will include comprehensive results from benchmarking tools to evaluate the performance of SSD partners, ensuring optimal storage solutions. These advancements will further solidify OCCL's role as a leading lab in the industry for creating partnerships with customers and suppliers, benchmarking for establishing architectural control points, and driving forward the adoption and implementation of new open ecosystems to replace proprietary architectures. OCCL 2.0's growing list of ecosystem participants include: Arista Networks, Broadcom, DapuStor, Graid Technology Inc., Ingrasys, Intel, Kioxia, MinIO, NVIDIA, OSNexus, PEAK:AIO, Phison, Sandisk, ScaleFlux, ThinkParQ Gmbh/BeeGFS, and Xinnor. New Product Enhancements for Cloud and Enterprise Workloads At Computex, Western Digital is also introducing the new OpenFlex Data24 4100 EBOF to its Data24 4000 series, complementing the already available Data24 4200 dual-port SSD model. The Data24 4100 is designed for cloud-like environments where high availability is not a primary requirement. It uses single-port SSDs where performance is optimized via a single connection to each SSD and redundancy is provided by mirroring the storage system. This new addition ensures that customers have access to the best options for optimizing their storage infrastructure. The Data24 4100 is expected to be available in CQ3 2025. The new Ultrastar® Data102 3000 ORv3 JBOD is designed to meet the increasing data demands of cloud data centers. In alignment with the broader Open Compute Project (OCP) initiative, the Data102 3000 ORv3 is designed to meet the Open Rack v3 (ORv3) specification, which focuses on rack design and power supply regulation. Complying with Rack Geometry Option 1, this future-ready solution is designed to deliver improved power efficiency, better airflow, and enhanced system manageability over the prior generation design. Additionally, the ORv3 version of the Ultrastar Data102 3000 leverages common building blocks from the 3000 series such as controllers, enclosures, and Customer Replaceable Units (CRUs), and complies with FIPS 140-3 Level 3 and TAA standards, making it a robust and reliable choice for modern data centers. The Data102 3000 is expected to be available in CQ4 2025. Flexibility and Choice: Now Qualifying Multiple SSD Vendors Western Digital's Platforms business now offers customers enhanced flexibility and choice in building their storage infrastructure. By supporting a multi-SSD vendor strategy, Western Digital has currently qualified SSDs with leading providers such as DapuStor, Kioxia, Phison, Sandisk and ScaleFlux with additional vendors in the qualification process. This approach empowers both Western Digital and its customers to leverage preferred suppliers while optimizing for performance, cost, and supply chain resilience. By qualifying multiple SSD vendors, Western Digital ensures that customers have access to the best possible options for their storage infrastructure, reinforcing its commitment to innovation and excellence in the industry. "As workloads grow more complex and AI accelerates infrastructure demands, the future will be defined by those who can scale smarter, move faster, and deploy with confidence," said Kurt Chan, vice president and general manager, Western Digital's Platforms Business. "With OCCL 2.0 and our latest Platform innovations, we're not just keeping up -- we're setting the pace for what modern, disaggregated, and software-defined data centers can achieve. We remain deeply committed to enabling open, flexible architectures that empower customers to build scalable infrastructure tailored to their evolving data needs." Meet Us at Computex: Experience the Future of Data Infrastructure Visit Western Digital at Computex in Taipei. Find us at booth J1303a in Hall 1 Storage and Management Solutions at the Taipei Nangang Exhibition Center from May 20-23. Western Digital's OpenFlex Data 24 NVMe-oF data storage platform, RapidFlex™ NVMe-oF controllers, Ultrastar Data102 hybrid storage platform and the Ultrastar Transporter will be on display. About Western Digital Western Digital empowers the systems and people who rely on data. Consistently delivering massive capacity, high quality and low TCO, Western Digital is trusted by hyperscale cloud providers, enterprise data centers, content professionals and consumers around the world. Core to its values, the company recognizes the urgency to combat climate change and is on a mission to design storage technologies that not only meet today's data demands but also contribute to a more climate-conscious future. Follow Western Digital on LinkedIn and learn more at www.westerndigital.com.
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Western Digital and Ingrasys partner to develop innovative storage solutions for AI workloads, including a new Top-of-Rack switch with embedded storage, while Western Digital expands its ecosystem collaboration and product offerings.
Western Digital and Ingrasys, a subsidiary of Foxconn Technology Group, have announced a strategic collaboration to develop a new flagship Top-of-Rack (TOR) switch with embedded storage, known as TOR EBOF (Ethernet Bunch of Flash)
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. This innovative solution aims to provide distributed storage at the network edge, reducing latency and eliminating the need for separate storage networks.The TOR EBOF, targeted for 2027 availability, represents a significant advancement in storage and networking integration. Key features include:
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This collaboration is particularly significant in the context of the rapidly expanding AI market. By combining Ingrasys' manufacturing capabilities and expertise in GPU servers with Western Digital's proficiency in NVMe-oF and fabric-attached storage, the partnership aims to create more flexible disaggregated infrastructure. This approach is designed to unlock new levels of efficiency, scalability, and performance for data centers tackling AI workloads at scale
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.In parallel with this partnership, Western Digital is advancing its ecosystem collaboration and innovation for AI acceleration, disaggregated storage, and software-defined storage (SDS). Key developments include:
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Related Stories
Western Digital is now qualifying multiple SSD vendors for its platforms, including DapuStor, Kioxia, Phison, Sandisk, and ScaleFlux. This approach offers customers greater flexibility and choice in building their storage infrastructure, optimizing for performance, cost, and supply chain resilience
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.Kurt Chan, vice president and general manager of Western Digital's Platforms Business, emphasized the importance of these developments: "As workloads grow more complex and AI accelerates infrastructure demands, the future will be defined by those who can scale smarter, move faster, and deploy with confidence"
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.The collaboration between Western Digital and Ingrasys, along with the broader ecosystem initiatives, is set to accelerate the adoption of fabric-attached disaggregated storage. This shift is crucial for meeting the growing demands of AI workflows and modern data center architectures
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.As these innovations unfold, the storage industry is poised for significant transformation, with Western Digital and its partners at the forefront of enabling more efficient, scalable, and high-performance solutions for the AI-driven future of data infrastructure.
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