Stanford team builds first commercial 3D chip at US foundry with 4x AI performance gains
A Stanford-led research team has manufactured the first monolithic 3D integrated circuit at a commercial US foundry, showing four-fold performance improvements over conventional flat chips. The prototype, built at SkyWater Technology, vertically stacks memory and logic using carbon nanotube transistors and could eventually deliver up to 1,000-fold gains in energy efficiency for future AI systems.