Apple's 2027 iPhone: A Leap in AI with Advanced Memory Technology

Report: 2027 iPhones Could Adopt Advanced AI Memory Technology

Apple is believed to be developing several technological innovations to mark the 20th anniversary of the iPhone, and one key technology it's considering is Mobile High Bandwidth Memory (HBM), according to a report from ETNews. HBM is a type of DRAM that stacks memory chips vertically and connects them via tiny vertical interconnects called Through-Silicon Vias (TSVs) to dramatically boost signal transmission speeds. It's primarily used in AI servers today, and is often referred to as AI memory due to its ability to support AI processing alongside GPUs. Mobile HBM is what the term suggests - a variant of the technology for mobile devices that is designed to deliver very high data throughput while minimizing power consumption and the physical footprint of the RAM dies. Apple is looking to enhance on-device AI capabilities, and ETNews reports that connecting mobile HBM to the iPhone's GPU units is being considered as a strong candidate for achieving this goal. The technology could be key for running massive AI models on-device, such as for large language model inference or advanced vision tasks, without draining battery or increasing latency. The report indicates that Apple may have already discussed its plans with major memory suppliers like Samsung Electronics and SK hynix, both of which are developing their own versions of mobile HBM. Samsung is reportedly using a packaging approach called VCS (Vertical Cu-post Stack), while SK hynix is working on a method called VFO (Vertical wire Fan-Out). Both companies aim for mass production sometime after 2026. As always though, there are manufacturing challenges. Mobile HBM is a lot more expensive to manufacture than current LPDDR memory. It could also face thermal constraints in slim devices like iPhones, and the 3D stacking and TSVs require highly sophisticated packaging and yield management. If Apple does adopt this technology for its 2027 iPhone lineup, it would be yet another example of the company pushing the envelope for its 20th anniversary iPhone, which is rumored to feature a completely bezel-less display that curves around all four edges of the device.

Apple's 20th-anniversary iPhone RAM upgrade could make it an AI monster

The 20th-anniversary iPhone's memory could make Siri and Apple Intelligence lightning fast. The 20th-anniversary iPhone stands to offer a major jump forward in on-device processing, with memory changes potentially increasing AI response speeds in leaps and bounds. Apple is fighting to keep its iPhone lineup relevant in a marketplace infatuated with artificial intelligence. While it has a considerable advantage in working in AI for years already, including the use of its self-developed AI-focused chips, it could soon make other major changes to improve performance. According to sources of ETNews, Apple is seriously considering the possibility of adding mobile high-bandwidth memory (HBM) to its 2027 iPhone range. This would include the 20th-anniversary iPhone, which is expected to include other display and battery changes. The use of HBM would be a big change for Apple, as it is a technique that requires the stacking of DRAM layers. The stacking increases the signal transmission speed, and therefore bandwidth, making it a lot quicker and easier for processors to access and secure data from the store. The HBM is usually connected to the application processor, but there is the possibility of it being connected to the GPU, which can be used for AI processing. This is effectively what Unified Memory does in Apple Silicon Mac models. A report source insists that Apple will use HBM to the iPhone in 2027, as it is "reviewing a change in the design" of its application processor to make it more useful for AI processing. The source adds that connecting the memory to the GPU is also "likely." The report believes that Apple may have already discussed the plan with memory suppliers, such as Samsung and SK Hynix. Both are creating their own mobile HBM modules using their own packaging technologies, with mass production expected after 2026. SK Hynix is reportedly doing so under the name Vertical wire Fan Out (VFO), while Samsung Electronics is doing so under the title Vertical Cu-post Stack (VCS). In the case of Apple, reports surfaced in December about Apple working with Samsung on faster memory for the iPhone. The intention was to create a larger DRAM package to increase the number of connectors, increasing the memory bandwidth. Samsung and SK Hynix will probably fight tooth and nail to secure Apple's custom for their mobile HBM modules. It is anticipated that there will be fierce competition, as each company would be able to expand their existing HBM work in the server market to smartphones. Memory and improved Apple Intelligence processing won't be the only things expected in the 20th anniversary iPhone. Other more visible changes are also expected for the milestone device. This includes changes to the display, such as a switch to a 16-nanometer FinFET process for the OLED display driver chip (DDI) to make it considerably more power efficient. A change in tech could also eliminate the bezel, by bending all four sides of the display. The implementation of an under-display camera will also be tricky, since the screen needs to transmit light without deteriorating the camera image quality. Current theories to implement the tech includes the use of a transparent polyimide as an OLED substrate material, as well as the use of special lenses to reduce optical loss from the OLED pixels. Samsung is also expected to be using a new M16 material set for the iPhone 18 displays, and could create a custom material for the 20th-anniversary device. Other rumors also include the use of 100% silicon material without graphite for the cathode of batteries, which can increase performance and battery life. With AI having high processing requirements, and therefore power, any savings or other battery improvements will inevitably help make the model's AI more impressive.

Apple's 2027 iPhone Will Use Groundbreaking Mobile HBM And TSV Technology, Enabling Massive AI Models To Run Locally, Making The Device Faster, Smarter, And More Expensive

The 20th-anniversary iPhone will be a special device, different from anything we have seen so far, as the company is working on various technologies to celebrate two decades of the flagship. While the device will be a marvel of engineering in terms of design, Apple is also developing new technologies that enhance the device's performance. It is now being reported that the 2027 iPhone will adopt an advanced AI memory technology for enhanced performance. According to ETNews, Apple's 20th-anniversary iPhone is expected to house Mobile High Bandwidth Memory (HBM), a type of DRAM that stacks memory chips vertically and connects them through vertical interconnects called Through-Silicon Vias (TSVs). The arrangement's purpose is to enhance signal transmission speeds, which will ultimately allow it to deliver better performance than conventional methods. HBM is typically used in AI servers, which is where it takes its name from, and it boasts the ability to support AI processing alongside GPUs. HBM is a technology for mobile that specializes in delivering higher data throughput while being enormously power-efficient. It also allows the RAM dies to be significantly smaller in size, which could have additional benefits attached to it, especially as future iPhone models become thinner. Apple Intelligence has changed the traditional hardware anatomy inside the iPhone, as the company aims to enhance on-device capabilities. ETNews claims that connecting mobile HBM in the 2027 iPhone's GPU units will allow the devices to achieve just that. The technology, once perfected over time, could allow large language models to run locally on the device without hurting battery life or increasing latency. Apple's memory suppliers, Samsung Electronics and SK Hynix, are already developing the technology for the company, and it is slated to be part of the iPhone in 2027, potentially at the device's 20th anniversary. While both suppliers are working on their own versions of the technology, Samsung is using a packaging method called VCS, or Vertical Cu-post Stack, while SK Hynix is using a method called VFO, or Vertical wire Fan-Out, and both suppliers aim to begin mass production next year. Take note that the technology is quite expensive at this stage, which could add to the cost of the 2027 iPhone models. There are now a handful of reasons for Apple to introduce a major price hike with the 2027 iPhone models, but we will share more details on the scenario as soon as further information is available.