BE Semiconductor Industries Reports Strong Q2 2024 Orders, Beating Expectations

Chipmaking parts supplier Besi posts better-than-expected Q2 orders

July 25 (Reuters) - Dutch chipmaking parts supplier BE Semiconductor Industries (Besi) beat expectations for second-quarter new orders on Thursday, as demand for its hybrid bonding tools, photonics and 2.5D assembly solutions for AI applications partially offset weak automotive end markets. The chip assembly equipment maker's new order bookings rose to 185.2 million euros ($200.74 million) in the three months to the end of June, compared with analysts' consensus of 179 million euros compiled by Visible Alpha and cited by ING analysts. That compares to orders of 128 million euros booked in the first three months of 2024. ($1 = 0.9226 euros) (Reporting by Dagmarah Mackos, Editing by Christian Schmollinger)

Chipmaking parts supplier Besi posts better-than-expected Q2 orders - ET Telecom

Devices 1 min read Chipmaking parts supplier Besi posts better-than-expected Q2 orders The chip assembly equipment maker's new order bookings rose to 185.2 million euros ($200.74 million) in the three months to the end of June, compared with analysts' consensus of 179 million euros compiled by Visible Alpha and cited by ING analysts. Dutch chipmaking parts supplier BE Semiconductor Industries (Besi) beat expectations for second-quarter new orders on Thursday, as demand for its hybrid bonding tools, photonics and 2.5D assembly solutions for AI applications partially offset weak automotive end markets. The chip assembly equipment maker's new order bookings rose to 185.2 million euros ($200.74 million) in the three months to the end of June, compared with analysts' consensus of 179 million euros compiled by Visible Alpha and cited by ING analysts. That compares to orders of 128 million euros booked in the first three months of 2024.

BE Semiconductor Industries N : Announces Q2-24 Results

Duiven, the Netherlands, July 25, 2024 - BE Semiconductor Industries N.V. (the "Company" or "Besi") (Euronext Amsterdam: BESI; OTC markets: BESIY), a leading manufacturer of assembly equipment for the semiconductor industry, today announced its results for the second quarter and first half year ended June 30, 2024. Revenue of € 151.2million up 3.3% vs. Q1-24 due primarily to higher shipments for photonics and 2.5D assembly applications. Down 7.0% vs. Q2-23 principally due to continued weakness in smartphone end markets partially offset by growth in hybrid bonding and other advanced packaging applications Orders of € 185.2 million up 45.0% vs. Q1-24 and 64.5% versus Q2-23 principally due to significant growth in hybrid bonding, photonics and 2.5D assembly solutions for AI applications partially offset by ongoing weakness in automotive end markets Gross margin of 65.0% decreased by 2.2 points vs. Q1-24 and by 0.6 points vs. Q2-23 due primarily to product mix Net income of € 41.9 million increased 23.2% vs. Q1-24 primarily due to a € 10.0 million decrease in share-based compensation. Vs. Q2-23, net income decreased 20.3% due principally to lower revenue and increased R&D spending in support of wafer level assembly activities. Q2-24 net margin rose to 27.7% vs. 23.2% in Q1-24 but declined versus the 32.4% reported in Q2-23 Net cash of € 74.4 million at quarter end was flat compared to Q2-23 and reflected the payment of € 171.5 million in dividends and the conversion into equity of € 89.9 million of Convertible Notes in Q2-24