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Besi reports higher bookings as AI demand picks up in Asia
April 23 (Reuters) - BE Semiconductor Industries (Besi) (BESI.AS), opens new tab, a supplier of advanced packaging tools for chipmakers, said on Wednesday its order bookings grew in the first quarter as Asian subcontractors ordered more AI related data centre applications. Investors are banking on
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BESI Q1 2025 slides: Revenue dips, orders rise as AI applications drive future growth By Investing.com
BE Semiconductor Industries NV ( AMS (VIE:AMS2):AS:BESI) reported mixed first-quarter 2025 results in its April 23 investor presentation, showing declining revenue but increasing orders as the company positions itself for an anticipated market recovery in advanced packaging for AI
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Besi reports higher bookings as AI demand picks up in Asia
(Reuters) -Dutch chipmaking parts supplier BE Semiconductor Industries (Besi) said on Wednesday that its order bookings, an important indicator of future growth, rose 8.2% against last quarter as orders from Asian subcontractors for AI related data centre applications picked up. Investors are
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BE Semiconductor Industries (Besi) reports increased order bookings driven by AI demand in Asia, despite a dip in revenue. The company's focus on advanced packaging for AI applications positions it for future growth.

BE Semiconductor Industries (Besi), a Dutch supplier of advanced packaging tools for chipmakers, reported mixed results for the first quarter of 2025. While revenue declined, the company saw a significant increase in order bookings, primarily driven by growing demand for AI-related applications in Asia
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.Besi's Q1 2025 results paint a picture of transition:
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Despite missing analyst expectations, Besi's stock rose 1.85% in pre-market trading, suggesting investor focus on the company's strategic positioning and order growth
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.The increase in order bookings is primarily attributed to rising demand for AI-related data center applications from Asian subcontractors
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. CEO Richard Blickman highlighted the company's strong position in advanced packaging for AI applications:"Demand for advanced packaging for AI applications remains strong given upcoming new device introductions and use cases planned in the 2026-2028 period," Blickman stated
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.Besi's world-leading hybrid bonding tool, which allows direct bonding of two chips, is attracting significant attention:
"We received hybrid bonding orders from two leading memory (chip) producers for HBM 4 applications as well as follow-on orders from a leading Asian foundry for logic applications," Blickman reported
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.This technology positions Besi at the forefront of the AI chip packaging market, with the CEO claiming they are "currently with the hundred nanometer well advanced in comparison to everyone else"
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A notable development was Applied Materials' announcement of a 9% stake in Besi as a strategic investment, potentially validating the company's technology and market position
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.Besi expects the assembly equipment market to recover in 2025/2026, with growth anticipated to begin in the second half of 2025. The company forecasts the market to reach $6.6 billion in 2026, a 60% increase from 2023 levels
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.While the AI-driven demand presents significant opportunities, Besi faces challenges:
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Besi maintains a cautious outlook, expecting revenue to remain steady in the second quarter, with a possible deviation of 5% in either direction
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.Summarized by
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