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On Fri, 7 Mar, 4:18 PM UTC
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Biwin Black Opal DW100 DDR5 192GB Memory Kit 6400 and DDR5-6000
Biwin's new Black Opal OC Lab Gold Edition DW100 memory kit is built for computing setups that need a lot of memory and quick data transfers. The kit comes with four 48 GB modules, giving a total of 192 GB. There are two versions available: one running at DDR5-6400 with timings of CL30-39-39-108 at 1.4 V, and another at DDR5-6000 with timings of CL28-36-36-102 at 1.4 V. This design is aimed at technical setups like AI computing, heavy data processing, and systems that run many tasks at the same time. The kit is designed with optimized memory scaling and improved signal integrity to keep data moving quickly even under heavy loads. Compatibility tests have shown that the Biwin kit works well with popular motherboards like MSI and Gigabyte's X870 series. The support for AMD EXPO means that tuning the memory via BIOS is straightforward, helping gurus fine-tune their systems for specific tasks. By using carefully selected timing parameters to lower latency and reduce delays, this kit helps ensure that data access is as quick as possible. Its use of DDR5 technology boosts data throughput, making it a good fit for tasks like running large language models and handling generative AI processes. Set to be available on Amazon in late April at about USD 849, this memory kit has undergone thorough compatibility and performance testing. Source: Biwin
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Biwin Debuts New OC Lab Gold Edition DW100 192 GB DDR5 Memory Kit, Offering Up To 6400 MT/s Speed At CL30
Biwin has added a higher-capacity DDR5 memory kit for AMD X870 motherboards, with speeds reaching 6400 MT/s at low latency. Biwin has launched another DDR5 memory kit under the Opal OC Lab Gold Edition series, but this time featuring a massive 192 GB capacity. The new kit brings four memory modules with each module carrying 48 GB DDR5 memory capacity. The company introduced its first dual EXPO-compatible kit recently, but it was limited to 32 GB capacity with a 2x 16 GB configuration. The memory modules boast beautiful gold-accented heat spreaders and customizable RGB lighting on top of them. This new kit is identical in appearance and can very well push the limits despite having so much capacity. While the 32 GB kit could achieve up to 8000 MT/s, the new 192 GB kit can push up to a decent 6400 MT/s memory speed, which is impressive for its size. The most impressive feat is achieving it at just CL30 latency. The memory can achieve CL30-39-39-108 with 1.4V at 6400 MT/s and CL28-36-36-102 at 6000 MT/s, which are even tighter timings. The Biwin Black Opal DW100 DDR5 memory kit is fully compatible with several X870 motherboards, particularly with MSI and Gigabyte X870 motherboards as of now. With such a huge memory capacity, the Black Opal DW100 allows leveraging high bandwidth, stability, and efficiency for AI computing, large language models, generative AI, and edge computing workloads. Since pushing 6000+ MT/s on the AMD platform is already a sweet spot, achieving this speed on a 192 GB kit is incredibly terrific as well. Biwin says that the tight timings of CL30 and CL28 will help the system with this 192 GB kit will enhance system stability, execution precision, real-time AI inference, and large-scale dataset operations. The Biwin Black Opal DW100 RGB DDR5 192 GB memory kit will be available for purchase in April through Amazon at a price tag of $849. While it's overkill for gamers, it's excellent for productivity and will be ideal for professionals, AI developers, and enthusiasts.
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Biwin launches 192GB DDR5-6400 and DDR5-6000 memory kits for AMD's AM5 platform
Big DRAM capacities to tackle large language model processing Biwin has introduced two new ultra-high-capacity 192GB (4x48GB) DDR5 memory kits to compete with the best RAM. Targeted at AI developers to boost memory-hungry AI applications, the latest kits, dubbed the Black Opal OC Lab Gold Edition DW100 RGB, are comprised of DDR5-6400 and DDR5-6000 models, both featuring a massive 192GB of capacity in total (48GB per stick). The new kits will be available starting late April on Amazon, priced at an estimated $849. The DDR5-6400 variant comes in a CL30-39-39-108 configuration, and the DDR5-6000 spec CL28-36-36-102. Both configurations operate at 1.4V. The memory DIMMS are RGB illuminated, sporting a black and gold color scheme with clock-like logos on the sides. Both configs come with AMD EXPO profiles for easy integration on AMD systems. The new DIMMS are advertised for AI-computing and enterprise-focused workloads, such as large language model computing, generative AI computing, and edge computing. These workloads typically benefit from large memory capacities, which these kits come with. The DDR5-6000 spec was allegedly targeted on purpose for AMD-based systems. Due to the intricacies of the Infinity Fabric and memory controller, DDR5-6000 is widely regarded as the sweet spot for Ryzen 7000 and Ryzen 9000 CPUs. Most chips are capable of running DDR5-6000in a 1:1 ratio. Nothing was said about the DDR5-6400 spec, but more recent BIOS updates for AM5 motherboards have pushed the envelope to DDR5-6400 for many Ryzen CPUs. Inevitably, this is why Biwin created a DDR5-6400 version of its 192GB AMD-focused memory kit. Both specs were advertised as running memory-testing applications on an AM5-based Ryzen 9 CPU (for some reason, the exact model name was grayed out). The DDR5-6000 kit ran MemtestPro for over seven hours with perfect stability. The DDR5-6400 kit ran TestMem5 for only over an hour but also yielded no errors. The screenshot for the DDR5-6400 test shows the CPU SoC voltage running at 1.26V (1.3V is considered the limit for SoC voltage on AM5 Ryzen CPUs). The new kits are allegedly validated for compatibility on MSI and Gigabyte X870 motherboards. Nothing stops users from running these kits in other AM5 motherboards (or DDR5 Intel motherboards, even). Still, validity adds extra insurance that these kits will work out of the box without stability issues.
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Biwin introduces high-capacity 192GB DDR5 memory kits, designed for AI computing and AMD AM5 platforms, offering speeds up to 6400 MT/s with low latency.
Biwin, a memory manufacturer, has unveiled its latest offering in the high-performance computing market: the Black Opal OC Lab Gold Edition DW100 RGB DDR5 memory kits. These kits are designed to meet the growing demands of AI computing and data-intensive applications, featuring an impressive 192GB capacity across four 48GB modules 1.
The new memory kits come in two variants:
Both configurations boast low latency, which is particularly impressive given their high capacity. The DDR5-6000 variant is specifically optimized for AMD Ryzen 7000 and 9000 series CPUs, aligning with the sweet spot for the Infinity Fabric and memory controller 2.
Biwin has conducted extensive compatibility testing, ensuring that these kits work seamlessly with popular motherboards, particularly MSI and Gigabyte's X870 series. The memory kits support AMD EXPO (Extended Profiles for Overclocking) technology, allowing for easy BIOS-level tuning 3.
The substantial 192GB capacity and high-speed performance make these kits particularly suitable for:
The combination of high capacity and low latency is expected to enhance system stability, execution precision, and real-time AI inference capabilities 2.
The memory modules feature gold-accented heat spreaders and customizable RGB lighting, adding a touch of elegance to high-performance computing setups 2.
Biwin plans to make these memory kits available on Amazon in late April, with an estimated price of $849. While this positions the product in the high-end market segment, it offers a compelling solution for professionals, AI developers, and enthusiasts requiring substantial memory capacity and performance 1.
Reference
[2]
Micron Technology introduces new Crucial DDR5 CUDIMM and CSODIMM memory modules, offering speeds up to 6,400 MT/s, designed for AI PCs and high-performance systems. These modules promise faster performance and improved stability for data-intensive AI workloads.
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Micron Technology has introduced its latest High Bandwidth Memory (HBM) solution, the HBM3E, featuring unprecedented capacity and bandwidth. This advancement promises significant improvements for AI and high-performance computing applications.
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Nvidia partners with Samsung, SK Hynix, and Micron to develop SOCAMM, a new proprietary memory format for AI servers, offering higher performance and efficiency compared to traditional memory modules.
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SK Hynix has achieved a significant milestone in memory technology by developing the industry's first 16GB DDR5 memory using the 1c node on a 10nm process. This breakthrough paves the way for next-generation memory solutions across various applications.
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SK hynix has begun sampling its groundbreaking 12-layer HBM4 memory, offering unprecedented capacity and bandwidth for AI acceleration. This development marks a significant leap in memory technology for AI applications.
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