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NVIDIA's unstoppable AI chip demand has TSMC boosting 3nm production by a huge 50%
TL;DR: NVIDIA CEO Jensen Huang has requested TSMC to boost 3nm chip production by 50% to meet rising demand for Blackwell AI GPUs and Rubin AI platforms. This expansion highlights NVIDIA's reliance on TSMC's advanced semiconductor fabs as both companies prepare for increased AI chip manufacturing in 2026. NVIDIA CEO Jensen Huang has asked TSMC to increase its 3nm production by 50% as demand for the company's Blackwell AI chips continues to swell, as the groundwork is being laid down for its next-gen Rubin AI GPUs. Jensen is in Taiwan right now, where he was hanging out with TSMC founder Morris Chang, where he praised the country and TSMC, saying: "without TSMC, there would be no NVIDIA today". Jensen has visited TSMC's new Tainan 3nm semiconductor fab, while also visiting Hsinchu to participate in TSMC's annual sports day. TSMC has fresh new additional orders for NVIDIA AI chips fabbed on its 3nm process, which will require TSMC to expand the production capacity of its 3nm process fabbed at its Southern Taiwan Science Park 18B fab, increasing from the current 100,000 to 110,000 wafers per month, to 160,000 wafers per month. This is a huge increase of 45% to 50%, with NVIDIA's additional monthly wafer requirements at around 35,000 wafers. NVIDIA will need as much of TSMC's 3nm production capacity, as it wasn't long ago we were reporting that TSMC's 3nm and 5nm production was expected to be "100% booked out" in 2026, with more on that story in the links above. Additionally, NVIDIA's new Blackwell Ultra GB300 AI chips and new Vera Rubin AI platform are both fabbed on TSMC's N3P process node, so things are looking super-busy for both companies as we flow into 2026.
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"No TSMC, No NVIDIA," Stresses CEO Jensen Huang as He Highlights the Importance of the Taiwan Chip Giant for the AI Industry
NVIDIA's CEO was spotted at TSMC's "Sports Day" today, and while addressing the public, Jensen stated that without TSMC, NVIDIA wouldn't have been in the dominant position it currently is. Jensen is currently on his fourth visit to Taiwan this year alone, and every time, his meeting with TSMC's executives is always followed by 'appreciative' comments. On the attendance of the Taiwan giant's sports event, NVIDIA's CEO Jensen Huang claimed straightforwardly that "without TSMC, there would be no NVIDIA today", praising not only the firm's executives, but also workers and professionals involved in fueling Team Green's semiconductor demands. One of the main reasons behind Jensen's visit to TSMC this time is to secure additional Blackwell chip wafers, as we reported yesterday. NVIDIA faces a massive demand for its current product offerings, which primarily consist of chips and rack-scale configurations within the Blackwell series. To meet the enormous demand, NVIDIA has requested that TSMC allocate additional chip production capacity. Along with this, Team Green is expected to be a primary customer of the 3nm process, securing around 30% of the total production, which shows that the AI bandwagon is moving with full force. The statement "No TSMC, no NVIDIA" does seem a bit dramatic when you look at it for the first time, but once the supply chain is analyzed, there's no doubt that the Taiwan chip giant is at the center of NVIDIA's AI business, whether it includes supplying necessary semiconductors or even advanced packaging services like CoWoS. More importantly, Team Green initially had been one of the 'late adopters' of cutting-edge chip technologies, but now the firm is racing to get its hands on advanced chips like the A16, implying that TSMC's importance will only grow. NVIDIA needs to keep TSMC 'close' to itself, given that the firm is one of the most sought-after in the AI industry. And, with Jensen's continued visits to Taiwan, it appears that the NVIDIA-TSMC relationship will evolve significantly moving forward.
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NVIDIA's CEO Jensen Huang has requested TSMC to increase 3nm chip production by 50% to meet surging demand for Blackwell AI GPUs and future Rubin platforms. The partnership highlights the critical relationship between the two companies as AI chip demand continues to soar.

NVIDIA CEO Jensen Huang has successfully negotiated a substantial 50% increase in 3nm chip production from Taiwan Semiconductor Manufacturing Company (TSMC) to address the overwhelming demand for the company's Blackwell AI processors and prepare for future Rubin AI platforms
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. This significant expansion underscores the critical partnership between the two technology giants as AI chip demand continues to surge across global markets.The production boost will see TSMC's Southern Taiwan Science Park 18B fabrication facility dramatically increase its monthly wafer output from the current 100,000-110,000 wafers to 160,000 wafers per month. NVIDIA's additional requirements alone account for approximately 35,000 wafers monthly, representing a substantial portion of this expansion
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.During his fourth visit to Taiwan this year, Huang made a striking statement about the interdependence between the companies, declaring that "without TSMC, there would be no NVIDIA today"
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. This acknowledgment came during his attendance at TSMC's annual sports day, where he met with company founder Morris Chang and toured the new Tainan 3nm semiconductor facility.The relationship has evolved significantly, with NVIDIA transforming from a late adopter of cutting-edge chip technologies to one of TSMC's most demanding customers. The company is now racing to secure access to advanced manufacturing processes, including the upcoming A16 node, indicating that TSMC's importance to NVIDIA's business will only continue to grow
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.NVIDIA is expected to secure approximately 30% of TSMC's total 3nm production capacity, highlighting the company's dominant position in the AI chip market
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. This substantial allocation reflects both the massive scale of demand for AI processors and NVIDIA's strategic importance to TSMC's business operations.The expanded production will support manufacturing of NVIDIA's current Blackwell Ultra GB300 AI chips and the upcoming Vera Rubin AI platform, both of which utilize TSMC's advanced N3P process node
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. Industry reports indicate that TSMC's 3nm and 5nm production capacity is expected to be completely booked through 2026, emphasizing the competitive nature of securing advanced semiconductor manufacturing slots.Related Stories
The partnership extends beyond basic chip manufacturing to include advanced packaging services such as Chip-on-Wafer-on-Substrate (CoWoS) technology, making TSMC central to NVIDIA's entire AI business ecosystem
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. This comprehensive relationship positions both companies to capitalize on the continuing AI revolution as demand for high-performance computing solutions shows no signs of slowing.Summarized by
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