NVIDIA CEO Jensen Huang Secures 50% Production Boost from TSMC for AI Chip Manufacturing

Reviewed byNidhi Govil

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NVIDIA's CEO Jensen Huang has requested TSMC to increase 3nm chip production by 50% to meet surging demand for Blackwell AI GPUs and future Rubin platforms. The partnership highlights the critical relationship between the two companies as AI chip demand continues to soar.

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NVIDIA Secures Massive Production Increase from TSMC

NVIDIA CEO Jensen Huang has successfully negotiated a substantial 50% increase in 3nm chip production from Taiwan Semiconductor Manufacturing Company (TSMC) to address the overwhelming demand for the company's Blackwell AI processors and prepare for future Rubin AI platforms

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. This significant expansion underscores the critical partnership between the two technology giants as AI chip demand continues to surge across global markets.

The production boost will see TSMC's Southern Taiwan Science Park 18B fabrication facility dramatically increase its monthly wafer output from the current 100,000-110,000 wafers to 160,000 wafers per month. NVIDIA's additional requirements alone account for approximately 35,000 wafers monthly, representing a substantial portion of this expansion

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Strategic Partnership Deepens

During his fourth visit to Taiwan this year, Huang made a striking statement about the interdependence between the companies, declaring that "without TSMC, there would be no NVIDIA today"

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. This acknowledgment came during his attendance at TSMC's annual sports day, where he met with company founder Morris Chang and toured the new Tainan 3nm semiconductor facility.

The relationship has evolved significantly, with NVIDIA transforming from a late adopter of cutting-edge chip technologies to one of TSMC's most demanding customers. The company is now racing to secure access to advanced manufacturing processes, including the upcoming A16 node, indicating that TSMC's importance to NVIDIA's business will only continue to grow

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Production Capacity and Future Outlook

NVIDIA is expected to secure approximately 30% of TSMC's total 3nm production capacity, highlighting the company's dominant position in the AI chip market

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. This substantial allocation reflects both the massive scale of demand for AI processors and NVIDIA's strategic importance to TSMC's business operations.

The expanded production will support manufacturing of NVIDIA's current Blackwell Ultra GB300 AI chips and the upcoming Vera Rubin AI platform, both of which utilize TSMC's advanced N3P process node

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. Industry reports indicate that TSMC's 3nm and 5nm production capacity is expected to be completely booked through 2026, emphasizing the competitive nature of securing advanced semiconductor manufacturing slots.

Supply Chain Implications

The partnership extends beyond basic chip manufacturing to include advanced packaging services such as Chip-on-Wafer-on-Substrate (CoWoS) technology, making TSMC central to NVIDIA's entire AI business ecosystem

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. This comprehensive relationship positions both companies to capitalize on the continuing AI revolution as demand for high-performance computing solutions shows no signs of slowing.

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