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[1]
SAIHEAT Announces The Upcoming 2024 BIT HEAT DAY By Investing.com
SINGAPORE, Oct. 30, 2024 (GLOBE NEWSWIRE) -- SAIHEAT Limited (f/k/a SAI.TECH Global Corporation) (SAIHEAT or the Company) (NASDAQ: SAIH, SAITW), is pleased to announce the upcoming annual conference - 2024 BIT HEAT DAY, taking place on November 14, 2024, at the company's U.S. R&D Center in Marietta, Ohio. The event will be co-hosted with the Organization of Clean Energy and Climate (OCEC), a non-profit organization, with full support from local governmental office and community. The conference will focus on promoting next-generation edge data center infrastructure and the environmental, social, and governance (ESG) benefits of computing heat recycling through liquid-cooling technologies. Washington County Commissioner Charlie Schilling will deliver the event's welcome address. During the conference, SAIHEAT and OCEC will unveil their joint expansion plans for the U.S. R&D Center and introduce the OCEC Heat Recycling Center Site Development Plan, aimed at advancing AI data centers and driving industry growth. SAIHEAT will also showcase its new A-series product line, designed to address the growing demands of the AI industry. SAIHEAT's U.S. R&D Center operates as an Advanced Computing Center Ecosystem (ACCE), integrating state-of-the-art liquid-cooling technology to achieve carbon-negative operations and support global carbon neutrality efforts. This technology enhances energy efficiency across industrial facilities through innovative heat recycling. Currently running at a 3MW capacity, the center utilizes 100 kW of computing heat to support a 4,608-square-foot greenhouse for agricultural activities. "SAIHEAT's U.S. R&D Center has made Satoshi Nakamoto's 2010 prediction a reality," said Arthur Lee, founder and CEO of SAIHEAT. "Satoshi envisioned Bitcoin mining heat used for heating, and now, as AI computing power grows, we are transitioning AI operations toward a cleaner, more sustainable future through our expertise in liquid-cooling." Event Details The 2024 BIT HEAT Day will take place on Thursday, November 14, from 11:30 A.M. to 4:30 P.M. at SAIHEAT's U.S. R&D Center, 550 Gravel Bank Road, Marietta, OH 45750. For more information, follow SAIHEAT on Twitter @SAI2TECH and join us on Eventbrite (NYSE:EB). About ACCE The Advanced Computing Center Ecosystem (ACCE) includes three systems: WITBOX, HEATBOX, and USERBOX. WITBOX hosts high-performance computing servers cooled by advanced liquid-cooling technology, which captures over 97% of the heat generated. HEATBOX processes, upgrades, and regulates recycled heat to provide demand-response heating with temperatures ranging from 120 °F to 290 °F. USERBOX delivers customized solutions for various industrial heating applications using recycled computing heat. About OCEC The Organization of Clean Energy and Climate ("OCEC") is a non-profit organization with the mission to perform research and study on more effective ways to use computing heat, develop the technology and system to demonstrate how residential, commercial, and industrial scenarios can recycle the computing heat waste as a replacement for traditional heating. The OCEC operates to build the Computing Heat Recycle Technology Development Center in a way that benefits the local community. As the first of this kind of R&D center, OCEC continues to be the leader in this area, bringing the best computing heat recycling solution to the world, and being one of the key contributors to achieving carbon-neutral efforts. For more information on OCEC, please visit https://ocec.co/. About SAIHEAT SAIHEAT Limited (Nasdaq: SAIH) delivers integrated energy services for next-generation data centers. Its thermal module, HEATWIT, offers data center liquid cooling system and solutions for computing heat recycling. The power module, HEATNUC, focuses on global power resource development and modular nuclear power joint development. Formerly known as SAI.TECH Global Corporation, SAIHEAT became a publicly traded company on the Nasdaq Stock Market (NASDAQ) through a merger with TradeUP Global Corporation in May 2022. For more information on SAIHEAT, please visit https://www.saiheat.com. Safe Harbor Statement This press release may contain forward-looking statements within the meaning of the Private Securities Litigation Reform Act of 1995. The words believe, expect, anticipate, project, targets, optimistic, confident that, continue to, predict, intend, aim, will or similar expressions are intended to identify forward-looking statements. All statements other than statements of historical fact are statements that may be deemed forward-looking statements. These forward-looking statements include, but not limited to, statements concerning SAI.TECH and the Company's operations, financial performance, and condition are based on current expectations, beliefs and assumptions which are subject to change at any time. SAI.TECH cautions that these statements by their nature involve risks and uncertainties, and actual results may differ materially depending on a variety of important factors such as government and stock exchange regulations, competition, political, economic, and social conditions around the world including those discussed in SAI.TECH's Form 20-F under the headings Risk Factors, Results of Operations and Business Overview and other reports filed with the Securities and Exchange Commission from time to time. All forward-looking statements are applicable only as of the date it is made and SAI.TECH specifically disclaims any obligation to maintain or update the forward-looking information, whether of the nature contained in this release or otherwise, in the future.
[2]
SAIHEAT Announces The Upcoming 2024 BIT HEAT DAY - Saiheat (NASDAQ:SAIH)
SINGAPORE, Oct. 30, 2024 (GLOBE NEWSWIRE) -- SAIHEAT Limited (f/k/a SAI.TECH Global Corporation) ("SAIHEAT" or the "Company") SAIH SAITW)), is pleased to announce the upcoming annual conference - 2024 BIT HEAT DAY, taking place on November 14, 2024, at the company's U.S. R&D Center in Marietta, Ohio. The event will be co-hosted with the Organization of Clean Energy and Climate (OCEC), a non-profit organization, with full support from local governmental office and community. The conference will focus on promoting next-generation edge data center infrastructure and the environmental, social, and governance (ESG) benefits of computing heat recycling through liquid-cooling technologies. Washington County Commissioner Charlie Schilling will deliver the event's welcome address. During the conference, SAIHEAT and OCEC will unveil their joint expansion plans for the U.S. R&D Center and introduce the OCEC Heat Recycling Center Site Development Plan, aimed at advancing AI data centers and driving industry growth. SAIHEAT will also showcase its new A-series product line, designed to address the growing demands of the AI industry. SAIHEAT's U.S. R&D Center operates as an Advanced Computing Center Ecosystem (ACCE), integrating state-of-the-art liquid-cooling technology to achieve carbon-negative operations and support global carbon neutrality efforts. This technology enhances energy efficiency across industrial facilities through innovative heat recycling. Currently running at a 3MW capacity, the center utilizes 100 kW of computing heat to support a 4,608-square-foot greenhouse for agricultural activities. "SAIHEAT's U.S. R&D Center has made Satoshi Nakamoto's 2010 prediction a reality," said Arthur Lee, founder and CEO of SAIHEAT. "Satoshi envisioned Bitcoin mining heat used for heating, and now, as AI computing power grows, we are transitioning AI operations toward a cleaner, more sustainable future through our expertise in liquid-cooling." Event Details The 2024 BIT HEAT Day will take place on Thursday, November 14, from 11:30 A.M. to 4:30 P.M. at SAIHEAT's U.S. R&D Center, 550 Gravel Bank Road, Marietta, OH 45750. For more information, follow SAIHEAT on Twitter @SAI2TECH and join us on Eventbrite. About ACCE The Advanced Computing Center Ecosystem (ACCE) includes three systems: WITBOX, HEATBOX, and USERBOX. WITBOX hosts high-performance computing servers cooled by advanced liquid-cooling technology, which captures over 97% of the heat generated. HEATBOX processes, upgrades, and regulates recycled heat to provide demand-response heating with temperatures ranging from 120°F to 290°F. USERBOX delivers customized solutions for various industrial heating applications using recycled computing heat. About OCEC The Organization of Clean Energy and Climate ("OCEC") is a non-profit organization with the mission to perform research and study on more effective ways to use computing heat, develop the technology and system to demonstrate how residential, commercial, and industrial scenarios can recycle the computing heat waste as a replacement for traditional heating. The OCEC operates to build the Computing Heat Recycle Technology Development Center in a way that benefits the local community. As the first of this kind of R&D center, OCEC continues to be the leader in this area, bringing the best computing heat recycling solution to the world, and being one of the key contributors to achieving carbon-neutral efforts. For more information on OCEC, please visit https://ocec.co/. About SAIHEAT SAIHEAT Limited SAIH delivers integrated energy services for next-generation data centers. Its thermal module, HEATWIT, offers data center liquid cooling system and solutions for computing heat recycling. The power module, HEATNUC, focuses on global power resource development and modular nuclear power joint development. Formerly known as SAI.TECH Global Corporation, SAIHEAT became a publicly traded company on the Nasdaq Stock Market (NASDAQ) through a merger with TradeUP Global Corporation in May 2022. For more information on SAIHEAT, please visit https://www.saiheat.com. This press release may contain forward-looking statements within the meaning of the Private Securities Litigation Reform Act of 1995. The words "believe", "expect", "anticipate", "project", "targets", "optimistic", "confident that", "continue to", "predict", "intend", "aim", "will" or similar expressions are intended to identify forward-looking statements. All statements other than statements of historical fact are statements that may be deemed forward-looking statements. These forward-looking statements include, but not limited to, statements concerning SAI.TECH and the Company's operations, financial performance, and condition are based on current expectations, beliefs and assumptions which are subject to change at any time. SAI.TECH cautions that these statements by their nature involve risks and uncertainties, and actual results may differ materially depending on a variety of important factors such as government and stock exchange regulations, competition, political, economic, and social conditions around the world including those discussed in SAI.TECH's Form 20-F under the headings "Risk Factors", "Results of Operations" and "Business Overview" and other reports filed with the Securities and Exchange Commission from time to time. All forward-looking statements are applicable only as of the date it is made and SAI.TECH specifically disclaims any obligation to maintain or update the forward-looking information, whether of the nature contained in this release or otherwise, in the future. Media Contact [email protected] Investor Relations Contact [email protected] Market News and Data brought to you by Benzinga APIs
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SAIHEAT Limited is set to host its annual 2024 BIT HEAT DAY conference, focusing on next-generation edge data center infrastructure and the environmental benefits of computing heat recycling through liquid-cooling technologies for AI operations.
SAIHEAT Limited, formerly known as SAI.TECH Global Corporation, has announced its upcoming annual conference, the 2024 BIT HEAT DAY, scheduled for November 14, 2024, at the company's U.S. R&D Center in Marietta, Ohio 12. The event, co-hosted with the Organization of Clean Energy and Climate (OCEC), aims to showcase innovative solutions for sustainable AI data center operations.
The conference will primarily focus on promoting next-generation edge data center infrastructure and the environmental, social, and governance (ESG) benefits of computing heat recycling through liquid-cooling technologies 1. This aligns with the growing demand for energy-efficient solutions in the rapidly expanding AI industry.
During the event, SAIHEAT and OCEC plan to unveil their joint expansion plans for the U.S. R&D Center and introduce the OCEC Heat Recycling Center Site Development Plan 1. These initiatives are aimed at advancing AI data centers and driving industry growth. Additionally, SAIHEAT will showcase its new A-series product line, specifically designed to address the increasing demands of the AI industry 2.
SAIHEAT's U.S. R&D Center operates as an Advanced Computing Center Ecosystem (ACCE), integrating state-of-the-art liquid-cooling technology to achieve carbon-negative operations 1. The ACCE comprises three key systems:
The R&D Center currently operates at a 3MW capacity, utilizing 100 kW of computing heat to support a 4,608-square-foot greenhouse for agricultural activities 1. This practical application demonstrates the potential for AI-driven heat recycling in various industries.
Arthur Lee, founder and CEO of SAIHEAT, emphasized the company's role in realizing Satoshi Nakamoto's 2010 prediction of using Bitcoin mining heat for heating purposes 1. Lee stated, "As AI computing power grows, we are transitioning AI operations toward a cleaner, more sustainable future through our expertise in liquid-cooling" 2.
The 2024 BIT HEAT Day will take place on Thursday, November 14, from 11:30 A.M. to 4:30 P.M. at SAIHEAT's U.S. R&D Center in Marietta, Ohio 1. Interested parties can follow SAIHEAT on Twitter @SAI2TECH and join the event through Eventbrite for more information and updates 2.
SAIHEAT Limited (NASDAQ: SAIH) provides integrated energy services for next-generation data centers 2. The company's thermal module, HEATWIT, offers data center liquid cooling systems and solutions for computing heat recycling, while its power module, HEATNUC, focuses on global power resource development and modular nuclear power joint development 1.
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