Samsung Develops Custom HBM4 Solutions for Meta and Microsoft, Aiming to Compete with TSMC and SK hynix

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Samsung initiates development of customized HBM4 memory solutions for tech giants Meta and Microsoft, potentially marking a significant breakthrough in the company's HBM business and intensifying competition in the AI chip market.

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Samsung's Strategic Move in HBM4 Development

Samsung has reportedly begun developing "custom HBM4" memory solutions, specifically tailored for tech giants Meta and Microsoft. This move signals a potential breakthrough for Samsung's High Bandwidth Memory (HBM) business, which has been facing challenges in recent times

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Technological Advancements and Specifications

The upcoming HBM4 memory from Samsung is expected to offer significant improvements over its predecessor, HBM3E. Key enhancements include:

  • Memory bandwidth increase of 66%, reaching 2TB/sec
  • Capacity boost of 33%, up to 48GB
  • Stacking of 16 DRAM stages

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Samsung plans to utilize its own 4nm process from its foundry division and employ 10nm 6th-generation 1c DRAM, considered one of the highest-end offerings in the market

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Potential Applications and Market Impact

The customized HBM4 solutions are rumored to be integrated into:

  • Microsoft's "Maia 100" AI chip
  • Meta's Artemis AI processor

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This development could prove crucial for Samsung, as major tech companies increasingly shift towards custom-built AI chips for their data centers and supercomputers. The move aims to reduce chip purchases and cut costs for these tech giants

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Competitive Landscape

Samsung's initiative comes as a response to fierce competition in the HBM market:

  • TSMC and SK hynix have partnered for HBM4 memory development, particularly for NVIDIA's next-gen Rubin R100 AI GPU
  • Samsung's recent struggles in securing NVIDIA as a customer have led to bearish earnings in its HBM segment

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Timeline and Future Prospects

Samsung is expected to complete HBM4 development by the end of 2025, with mass production commencing shortly after. While the company unveiled initial HBM4 specifications at the ISSCC 2024 conference in February, detailed specs are yet to be released

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This strategic move could potentially revitalize Samsung's position in the HBM market. However, the company will need to overcome its recent setbacks and face strong competition from established players like SK hynix to secure a significant market share in the rapidly evolving AI chip industry

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