Samsung Electro-Mechanics Partners with AMD for High-Performance Data Center Computing Solutions

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Samsung Electro-Mechanics and AMD collaborate to develop advanced substrates for hyperscale data center computing, aiming to enhance performance and efficiency in AI and cloud computing applications.

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Samsung and AMD Join Forces for Data Center Innovation

Samsung Electro-Mechanics, a leading electronic components manufacturer, has announced a strategic collaboration with Advanced Micro Devices (AMD) to supply high-performance substrates for hyperscale data center computing

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. This partnership aims to address the growing demands of artificial intelligence (AI) and cloud computing applications, which require increasingly powerful and efficient processing capabilities.

Advanced Substrate Technology

The collaboration focuses on developing and supplying advanced flip chip ball grid array (FC-BGA) substrates, which are crucial components in high-performance computing systems. These substrates serve as intermediaries between semiconductors and printed circuit boards, playing a vital role in signal transmission and heat dissipation

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Samsung Electro-Mechanics will leverage its expertise in manufacturing high-layer count substrates with fine circuit patterns to meet AMD's specifications for their next-generation high-performance processors. This technology is expected to significantly enhance the performance and efficiency of data center operations.

Market Impact and Future Prospects

The partnership between Samsung Electro-Mechanics and AMD is poised to have a substantial impact on the data center computing market. As the demand for AI and cloud services continues to grow, the need for more powerful and energy-efficient computing solutions becomes increasingly critical

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Industry analysts predict that this collaboration will not only strengthen Samsung Electro-Mechanics' position in the high-end substrate market but also support AMD's efforts to compete more effectively in the data center processor segment. The global market for FC-BGA substrates is expected to grow significantly in the coming years, driven by the expansion of hyperscale data centers and the proliferation of AI applications

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Technological Advancements and Challenges

The development of advanced FC-BGA substrates presents several technical challenges, including the need for finer circuit patterns, improved heat dissipation, and enhanced signal integrity. Samsung Electro-Mechanics' expertise in these areas, combined with AMD's processor design capabilities, is expected to yield innovative solutions that push the boundaries of data center computing performance

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As part of this collaboration, both companies will work closely to optimize the substrate design for AMD's specific requirements, ensuring seamless integration with their next-generation processors. This tailored approach is anticipated to result in superior performance metrics and improved energy efficiency for data center operations.

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