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On Tue, 23 Jul, 12:01 AM UTC
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Samsung Electro-Mechanics Collaborates with AMD to Supply High-Performance Substrates for Hyperscale Data Center Computing By Investing.com
Joint effort enhances the performance and reliability of next-generation data centers with cutting-edge substrate technology , /PRNewswire/ -- Samsung (KS:005930) Electro-Mechanics (SEMCO) today announced a collaboration with AMD (NASDAQ: NASDAQ:AMD) to supply high-performance substrates for hyperscale data center compute applications These substrates are made in SEMCO's key the technology hub in and the newly built state of the art factory in . Market research firm Prismark predicts that the semiconductor substrate market will grow at an average annual rate of about 7%, increasing from in 2024 to in 2028. SEMCO's substantial investment of in the FCBGA factory underscores its commitment to advancing substrate technology and manufacturing capabilities to meet the highest industry standards and the future technology needs. SEMCO's collaboration with AMD focuses on meeting the unique challenges of integrating multiple semiconductor chips (Chiplets) on a single large substrate. These high-performance substrates, essential for CPU/GPU applications, offer significantly larger surface areas and higher layer counts, providing the dense interconnections required for today's advanced data centers. Compared to standard computer substrates, data center substrates are ten times larger and feature three times more layers, ensuring efficient power delivery and lossless signal integrity between chips. Addressing these challenges, SEMCO's innovative manufacturing processes mitigate issues like warpage to ensure high yields during chip mounting. SEMCO's FCBGA factory is equipped with advanced real-time data collection and modeling capabilities, enabling SEMCO to develop predictive manufacturing models that ensure signal, power, and mechanical integrity. This state-of-the-art facility positions SEMCO as a leader in the production of embedded substrates with both passive (capacitor and inductor) and active (integrated circuit) components, meeting the forward-looking needs of next-generation data centers. "We are honored to be a strategic partner with AMD, a global leader in high-performance computing and AI semiconductor solutions," said Kim Wontaek, Executive Vice President of the Strategic Marketing Center at Samsung Electro-Mechanics. "Our continued investment in advanced substrate solutions will provide key value to customers like AMD, addressing the evolving demands of data centers and other compute-intensive applications ranging from AI to automotive systems." "At AMD, we are always pushing the edge of innovation to meet the performance and efficiency needs of our customers," says , Corporate VP of Global Operation Manufacturing Strategy at AMD. "Our leadership in chiplet technologies has enabled AMD to deliver leadership performance, efficiency, and flexibility across our CPU and data center GPU portfolio. Continued investments with partners such as SEMCO highlight the work we are doing to ensure we have the advanced substrate technologies and capacity we need to deliver future generations of high-performance computing and AI products." About Samsung Electro-Mechanics For over 50 years, Samsung Electro-Mechanics (SEMCO) has been a leading developer and manufacturer of a wide range of mechanical and high-tech electronic components. Founded in 1973, SEMCO has grown into a world-class company, supplying essential electronic parts to industries worldwide. Our product portfolio includes chip parts, communication modules and substrates, and optical components, addressing the challenges of next-generation designs. Our employees are dedicated to innovating and producing high-quality components that enhance modern technology and everyday life. Learn more at Samsung Electro-Mechanics.
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Samsung Electro-Mechanics Collaborates with AMD to Supply High-Performance Substrates for Hyperscale Data Center Computing | Taiwan News | Jul. 22, 2024 23:00
Joint effort enhances the performance and reliability of next-generation data centers with cutting-edge substrate technology SEOUL, South Korea, July 22, 2024 /PRNewswire/ -- Samsung Electro-Mechanics (SEMCO) today announced a collaboration with AMD (NASDAQ: AMD) to supply high-performance substrates for hyperscale data center compute applications These substrates are made in SEMCO's key the technology hub in Busan and the newly built state of the art factory in Vietnam. Picture of Samsung Electro-Mechanics Busan Factory Market research firm Prismark predicts that the semiconductor substrate market will grow at an average annual rate of about 7%, increasing from 15.2 trillion KRW in 2024 to 20 trillion KRW in 2028. SEMCO's substantial investment of 1.9 trillion KRW in the FCBGA factory underscores its commitment to advancing substrate technology and manufacturing capabilities to meet the highest industry standards and the future technology needs. SEMCO's collaboration with AMD focuses on meeting the unique challenges of integrating multiple semiconductor chips (Chiplets) on a single large substrate. These high-performance substrates, essential for CPU/GPU applications, offer significantly larger surface areas and higher layer counts, providing the dense interconnections required for today's advanced data centers. Compared to standard computer substrates, data center substrates are ten times larger and feature three times more layers, ensuring efficient power delivery and lossless signal integrity between chips. Addressing these challenges, SEMCO's innovative manufacturing processes mitigate issues like warpage to ensure high yields during chip mounting. SEMCO's FCBGA factory is equipped with advanced real-time data collection and modeling capabilities, enabling SEMCO to develop predictive manufacturing models that ensure signal, power, and mechanical integrity. This state-of-the-art facility positions SEMCO as a leader in the production of embedded substrates with both passive (capacitor and inductor) and active (integrated circuit) components, meeting the forward-looking needs of next-generation data centers. "We are honored to be a strategic partner with AMD, a global leader in high-performance computing and AI semiconductor solutions," said Kim Wontaek, Executive Vice President of the Strategic Marketing Center at Samsung Electro-Mechanics. "Our continued investment in advanced substrate solutions will provide key value to customers like AMD, addressing the evolving demands of data centers and other compute-intensive applications ranging from AI to automotive systems." "At AMD, we are always pushing the edge of innovation to meet the performance and efficiency needs of our customers," says Scott Aylor, Corporate VP of Global Operation Manufacturing Strategy at AMD. "Our leadership in chiplet technologies has enabled AMD to deliver leadership performance, efficiency, and flexibility across our CPU and data center GPU portfolio. Continued investments with partners such as SEMCO highlight the work we are doing to ensure we have the advanced substrate technologies and capacity we need to deliver future generations of high-performance computing and AI products." About Samsung Electro-Mechanics For over 50 years, Samsung Electro-Mechanics (SEMCO) has been a leading developer and manufacturer of a wide range of mechanical and high-tech electronic components. Founded in 1973, SEMCO has grown into a world-class company, supplying essential electronic parts to industries worldwide. Our product portfolio includes chip parts, communication modules and substrates, and optical components, addressing the challenges of next-generation designs. Our employees are dedicated to innovating and producing high-quality components that enhance modern technology and everyday life. Learn more at Samsung Electro-Mechanics. Picture of Samsung Electro-Mechanics Vietnam Factory
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Samsung Electro-Mechanics and AMD collaborate to develop advanced substrates for hyperscale data center computing, aiming to enhance performance and efficiency in AI and cloud computing applications.
Samsung Electro-Mechanics, a leading electronic components manufacturer, has announced a strategic collaboration with Advanced Micro Devices (AMD) to supply high-performance substrates for hyperscale data center computing 1. This partnership aims to address the growing demands of artificial intelligence (AI) and cloud computing applications, which require increasingly powerful and efficient processing capabilities.
The collaboration focuses on developing and supplying advanced flip chip ball grid array (FC-BGA) substrates, which are crucial components in high-performance computing systems. These substrates serve as intermediaries between semiconductors and printed circuit boards, playing a vital role in signal transmission and heat dissipation 1.
Samsung Electro-Mechanics will leverage its expertise in manufacturing high-layer count substrates with fine circuit patterns to meet AMD's specifications for their next-generation high-performance processors. This technology is expected to significantly enhance the performance and efficiency of data center operations.
The partnership between Samsung Electro-Mechanics and AMD is poised to have a substantial impact on the data center computing market. As the demand for AI and cloud services continues to grow, the need for more powerful and energy-efficient computing solutions becomes increasingly critical 2.
Industry analysts predict that this collaboration will not only strengthen Samsung Electro-Mechanics' position in the high-end substrate market but also support AMD's efforts to compete more effectively in the data center processor segment. The global market for FC-BGA substrates is expected to grow significantly in the coming years, driven by the expansion of hyperscale data centers and the proliferation of AI applications 2.
The development of advanced FC-BGA substrates presents several technical challenges, including the need for finer circuit patterns, improved heat dissipation, and enhanced signal integrity. Samsung Electro-Mechanics' expertise in these areas, combined with AMD's processor design capabilities, is expected to yield innovative solutions that push the boundaries of data center computing performance 1.
As part of this collaboration, both companies will work closely to optimize the substrate design for AMD's specific requirements, ensuring seamless integration with their next-generation processors. This tailored approach is anticipated to result in superior performance metrics and improved energy efficiency for data center operations.
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AMD and France's Commissariat à l'énergie atomique et aux énergies alternatives (CEA) sign a Letter of Intent to collaborate on developing energy-efficient AI computing systems for various sectors, including energy and medicine.
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SK Hynix strengthens its position in the AI chip market by advancing HBM4 production and introducing new HBM3E technology, responding to Nvidia's request for faster delivery amid growing competition with Samsung.
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Samsung Electronics reports a significant increase in second-quarter profits, driven by strong demand for AI chips and higher semiconductor prices. The company expresses optimism about future growth in the AI sector.
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Samsung Electronics reports a significant 40% quarter-over-quarter decline in semiconductor profits, highlighting its challenges in capitalizing on the AI chip boom and competing with rivals like SK Hynix.
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Samsung is increasingly relying on Chinese technology companies to support its struggling semiconductor division, as it faces challenges in securing major US customers despite significant investments in American manufacturing facilities.
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