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Tessolve to buy German chip designer for Rs 400 crore
This acquisition aims to position Tessolve as a leading design firm capable of delivering advanced turnkey solutions, particularly in System on Chip (SoC) designs for AI, automotive, and data center markets. The move will also strengthen Tessolve's European presence with new facilities in Germany and the Netherlands. Semiconductor engineering solutions provider Tessolve has signed a definitive pact to wholly acquire German semiconductor chip design firm Dream Chip Technologies for up to Rs 400 crore. Srini Chinamilli, cofounder and chief executive officer of Tessolve told ET that the deal positions Bengaluru-based Tessolve among a select group of design firms worldwide capable of delivering turnkey design solutions for complex cutting-edge chips. He added that it also bolsters Tessolve's ability to add advanced capabilities in System on Chip (SoC) designs to cater to the AI, automotive, data centre, and industrial markets. It will also serve to expand the company's European operations by adding four delivery sites across Germany and the Netherlands, including a specialised Advanced Driver Assistance Systems (ADAS) and imaging centre-of-excellence lab. "Dream Chip's capabilities further strengthen our ability to take on leading edge ASIC design projects and greatly enhance our European footprint," Chinamilli said. Jens Benndorf, CEO of Dream Chip said the company's design capabilities and IP combined with Tessolve's established semiconductor services and embedded solutions can offer customers end-to-end solutions from chip architecture to post-silicon test and supply chain management for developing complex designs. "Together, we will push the boundaries of innovation in automotive and enterprise designs, particularly in camera-based systems and AI-driven application-specific integrated circuit (ASIC) applications," Benndorf said. ET reported on Tuesday that Hero Electronix, backed by Suman Kant Munjal, was planning to sell a 25-30% stake in Tessolve to cash in on growing investor appetite in the space. Chinamilli, on his part, however said Hero Electronix is a majority shareholder that is excited about the company's prospects and will remain a majority shareholder for years to come. "Hero Electronix is a majority shareholder in Tessolve and they are here for the long term," he said. "They are not planning to get out of Tessolve anytime soon. They are committed to growth, and they are going to be with us. They're very excited about being part of Tessolve, so they'll be shareholders in our company for a long time."
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Hero Electronix's Tessolve to Acquire Europe's leading Chip Design Company for up to ₹400 Crore
This acquisition catapults Tessolve to the global elite in chip/ ASIC design Tessolve, a Hero Electronix venture and a leading provider of semiconductor engineering solutions for cutting edge chips, today announced the signing of a definitive agreement to acquire 100% of Dream Chip Technologies, a semiconductor chip design firm headquartered in Germany, for a consideration of up to ₹400 Crore (EUR 42.5 Million). The signing is subject to regulatory approvals. This acquisition positions Tessolve among a select group of design firms worldwide capable of delivering turnkey design solutions for complex cutting-edge chips. It further strengthens Tessolve's leadership in the industry by adding advanced capabilities in System on Chip (SoC) designs for the artificial intelligence (AI), automotive, data center, and industrial markets. The acquisition will also expand Tessolve's European operations by adding four delivery locations across Germany and Netherlands, including a specialized ADAS & imaging center-of-excellence lab, reinforcing Tessolve's commitment to providing cutting-edge semiconductor and embedded design solutions while expanding its market share in the semiconductor services sector. "This acquisition solidifies our position as a top tier semiconductor engineering firm globally with unmatched design to productization capabilities," said Srini Chinamilli, Co-founder & CEO of Tessolve. "Dream Chip's capabilities further strengthen our ability to take on leading edge ASIC design projects and greatly enhances our European footprint," he added. Dream Chip Technologies, headquartered in Germany with a highly capable team of specialized engineers and solution architects, is recognized as one of the leading semiconductor design service companies in the region, particularly for its expertise in complex digital designs. Its chip architecture and front-end design capabilities combined with Tessolve's strengths in chip design and unparalleled excellence in post-silicon test and packaging design, will enhance the company's ability to deliver full chip turnkey design solutions from specification to volume silicon production thereby delivering critical "time to market" advantage and "operational excellence" to customers. The acquisition is a 100% cash transaction. "We are excited to join forces with Tessolve and bring our expertise in digital chip design and embedded software to a global platform. By combining our design capabilities and IP with Tessolve's established semiconductor services and embedded solutions, we can offer our customers a truly end-to-end solution from chip architecture to post-silicon test and supply chain management for their most complex designs," said Jens Benndorf, CEO of Dream Chip Technologies. "Together, we will push the boundaries of innovation in automotive and enterprise designs, particularly in camera-based systems and AI-driven ASIC applications," he added. Mr. Ujjwal Munjal, Chairman of Tessolve, remarked, "Over the past few years, Tessolve has demonstrated impressive growth and resilience. With the synergy brought by Dream Chip Technologies, I am confident that Tessolve is poised to become a world leader in this space with unparalleled capabilities. As major companies increasingly shift towards custom chip design, this acquisition positions Tessolve more strongly than ever to meet the growing demands of the custom chip market." About Tessolve Tessolve offers a comprehensive suite of pre- and post-silicon solutions, delivering complete turnkey services from design to packaged parts. Founded in Bangalore, India, the company has expanded its presence to over 10 countries and serves 9 of the top 10 tech companies globally. With advanced silicon and system testing labs, Tessolve provides clients with a one-stop shop for both hardware and software needs, enabling faster market entry with its range of complementary solutions. For more details, visit www.tessolve.com. About Dream Chip Technologies Dream Chip Technologies stands out as Europe's leading independent engineering service provider, specializing in the development and design of ASICs, SoCs, FPGAs, embedded software, and discrete systems. With over 25 years of experience in the microelectronics industry, they offer comprehensive turnkey solutions that encompass every stage from chip specification to production and delivery. For more details, visit https://www.dreamchip.de.
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Tessolve, a Hero Electronix venture, is set to acquire Dream Chip Technologies, a German semiconductor chip design firm, for up to ₹400 Crore. This acquisition aims to enhance Tessolve's capabilities in AI, automotive, and data center chip design, positioning it as a leading global semiconductor engineering firm.
Tessolve, a leading provider of semiconductor engineering solutions and a Hero Electronix venture, has announced a definitive agreement to acquire Dream Chip Technologies, a German semiconductor chip design firm, for up to ₹400 Crore (EUR 42.5 Million)
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. This strategic move is set to position Tessolve among an elite group of global design firms capable of delivering turnkey solutions for complex cutting-edge chips.The acquisition significantly bolsters Tessolve's capabilities in System on Chip (SoC) designs, particularly for artificial intelligence (AI), automotive, data center, and industrial markets
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. By integrating Dream Chip's expertise in complex digital designs with Tessolve's strengths in chip design and post-silicon testing, the combined entity aims to offer comprehensive end-to-end solutions from chip architecture to post-silicon test and supply chain management .Srini Chinamilli, Co-founder & CEO of Tessolve, emphasized the strategic importance of the acquisition, stating, "This acquisition solidifies our position as a top tier semiconductor engineering firm globally with unmatched design to productization capabilities" .
The deal will significantly expand Tessolve's European operations, adding four delivery locations across Germany and the Netherlands
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. This expansion includes a specialized Advanced Driver Assistance Systems (ADAS) and imaging center-of-excellence lab, reinforcing Tessolve's commitment to providing cutting-edge semiconductor and embedded design solutions .Jens Benndorf, CEO of Dream Chip Technologies, expressed enthusiasm about the merger, highlighting the potential for innovation: "Together, we will push the boundaries of innovation in automotive and enterprise designs, particularly in camera-based systems and AI-driven application-specific integrated circuit (ASIC) applications"
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.This acquisition reflects the growing trend of companies shifting towards custom chip design. Ujjwal Munjal, Chairman of Tessolve, noted, "As major companies increasingly shift towards custom chip design, this acquisition positions Tessolve more strongly than ever to meet the growing demands of the custom chip market" .
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The acquisition is a 100% cash transaction, with Tessolve acquiring Dream Chip Technologies for a consideration of up to ₹400 Crore . Despite rumors of potential stake sales, Chinamilli clarified that Hero Electronix, the majority shareholder, remains committed to Tessolve's long-term growth and has no immediate plans to reduce its ownership
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.This strategic acquisition marks a significant milestone in the semiconductor industry, potentially reshaping the landscape of chip design and engineering services. By combining their strengths, Tessolve and Dream Chip Technologies are poised to address the increasing demand for advanced chip solutions in AI, automotive, and other high-tech sectors.
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