TSMC Unveils Groundbreaking A14 Technology for Faster, More Efficient AI Chips

TSMC shows off new tech for stitching together bigger, faster chips

SANT CLARA, California, April 23 (Reuters) - Taiwan Semiconductor Manufacturing Co (2330.TW), opens new tab on Wednesday unveiled technology for making faster chips and putting them together in dinner-plate sized packages that will boost performance needed for artificial intelligence applications. It said its A14 manufacturing technology will arrive in 2028 and will be able to produce processors that are 15% faster at the same power consumption as its N2 chips due to enter production this year or will use 30% less power at the same speed as the N2 chips. The world's biggest contract manufacturer, which counts Nvidia (NVDA.O), opens new tab and Advanced Micro Devices (AMD.O), opens new tab as clients, added that its forthcoming "System on Wafer-X" will be able to weave together at least 16 large computing chips, as well as memory chips and fast optical interconnections and new technology to deliver thousands of watts of power to the chips. By comparison, Nvidia's current flagship graphics processing units consist of two large chips stitched together and its "Rubin Ultra" GPUs due out in 2027 will stitch four together. TSMC plans to build two factories to carry out the work near its chip plants in Arizona. Intel, which is working to build out a contract manufacturing business to compete with TSMC, is due to announce new manufacturing technologies next week. Last year, it claimed it would overtake TSMC in making the world's fastest chips. Demand for massive AI chips that are packaged together has shifted the battleground between the two firms from simply making fast chips to integrating them - a complex task that requires working closely with customers. "They're both neck and neck. You're not going to pick one over the other because they have the technological lead," said Dan Hutcheson, vice chair at analyst firm TechInsights. "You're going to pick one over the other for different reasons." Customer service, pricing and how much wafer allocation can be obtained are likely to influence a company's decision about which chip manufacturer would be best for them. Reporting by Stephen Nellis and Max Cherney in Santa Clara, California; Editing by Edwina Gibbs Our Standards: The Thomson Reuters Trust Principles., opens new tab Suggested Topics:Artificial Intelligence Max A. Cherney Thomson Reuters Max A. Cherney is a correspondent for Reuters based in San Francisco, where he reports on the semiconductor industry and artificial intelligence. He joined Reuters in 2023 and has previously worked for Barron's magazine and its sister publication, MarketWatch. Cherney graduated from Trent University with a degree in history.

TSMC unveils faster chip technology for AI applications By Investing.com

Investing.com -- Taiwan Semiconductor Manufacturing Co (TWSE:2330, NYSE: TSMC) announced on Wednesday its new A14 manufacturing technology, set to arrive in 2028. The A14 technology is expected to produce processors that are 15% faster at the same power consumption as its N2 chips, which are due to enter production this year. Alternatively, the technology can be used to produce chips that use 30% less power at the same speed as the N2 chips. TSMC, the world's largest contract manufacturer, also announced its forthcoming "System on Wafer-X", which will be able to combine at least 16 large computing chips, memory chips, fast optical interconnections, and new technology to deliver thousands of watts of power to the chips. This development is a significant step forward from Nvidia (NASDAQ:NVDA)'s current flagship graphics processing units, which consist of two large chips stitched together. Nvidia's "Rubin Ultra" GPUs, due out in 2027, will stitch four together. TSMC plans to construct two factories near its chip plants in Arizona to carry out the work. The new technology is expected to boost performance needed for artificial intelligence applications, marking a shift in the battleground between TSMC and Intel (NASDAQ:INTC) from simply making fast chips to integrating them. This complex task requires working closely with customers. Customer service, pricing, and wafer allocation availability are likely to influence a company's decision about which chip manufacturer to choose. "They're both neck and neck. You're not going to pick one over the other because they have the technological lead," said Dan Hutcheson, vice chair at analyst firm TechInsights. "You're going to pick one over the other for different reasons." TSMC also debuted new logic, specialty, advanced packaging, and 3D chip stacking technologies at the Company's North America Technology Symposium. These technologies are expected to drive product innovations in High Performance Computing (HPC), Smartphone, Automotive, and Internet of Things (IoT). The company's A14 technology is designed to drive AI transformation forward by delivering faster computing and greater power efficiency. It is also expected to enhance smartphones by improving their on-board AI capabilities. The current A14 development is progressing smoothly with yield performance ahead of schedule. TSMC Chairman and CEO Dr. C.C. Wei said, "Our customers constantly look to the future, and TSMC's technology leadership and manufacturing excellence provides them with a dependable roadmap for their innovations." He added that TSMC's technologies like A14 are part of a comprehensive suite of solutions that connect the physical and digital worlds to unleash customers' innovation for advancing the AI future.

TSMC shows off new tech for stitching together bigger, faster chips

SANT CLARA, California (Reuters) -Taiwan Semiconductor Manufacturing Co on Wednesday unveiled technology for making faster chips and putting them together in dinner-plate sized packages that will boost performance needed for artificial intelligence applications. It said its A14 manufacturing technology will arrive in 2028 and will be able to produce processors that are 15% faster at the same power consumption as its N2 chips due to enter production this year or will use 30% less power at the same speed as the N2 chips. The world's biggest contract manufacturer, which counts Nvidia and Advanced Micro Devices as clients, added that its forthcoming "System on Wafer-X" will be able to weave together at least 16 large computing chips, as well as memory chips and fast optical interconnections and new technology to deliver thousands of watts of power to the chips. By comparison, Nvidia's current flagship graphics processing units consist of two large chips stitched together and its "Rubin Ultra" GPUs due out in 2027 will stitch four together. TSMC plans to build two factories to carry out the work near its chip plants in Arizona. Intel, which is working to build out a contract manufacturing business to compete with TSMC, is due to announce new manufacturing technologies next week. Last year, it claimed it would overtake TSMC in making the world's fastest chips. Demand for massive AI chips that are packaged together has shifted the battleground between the two firms from simply making fast chips to integrating them - a complex task that requires working closely with customers. "They're both neck and neck. You're not going to pick one over the other because they have the technological lead," said Dan Hutcheson, vice chair at analyst firm TechInsights. "You're going to pick one over the other for different reasons." Customer service, pricing and how much wafer allocation can be obtained are likely to influence a company's decision about which chip manufacturer would be best for them. (Reporting by Stephen Nellis and Max Cherney in Santa Clara, California; Editing by Edwina Gibbs)