ASML declares High-NA EUV tools ready for mass production, unlocking next phase of AI chip manufacturing

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Dutch semiconductor equipment maker ASML announced its $400 million High-NA EUV machines are technically ready for high-volume chip production after processing 500,000 silicon wafers. The next-generation tools will help chipmakers like TSMC and Intel produce more powerful AI chips by simplifying the manufacturing process, though full integration will take two to three years.

ASML Reaches Critical Milestone for High-NA EUV Tools

ASML has confirmed its High-NA EUV machines are ready for chipmakers to begin integrating them into mass production of chips, marking a semiconductor industry milestone that could reshape AI chip production capabilities. The Dutch company, which produces the world's only commercial extreme ultraviolet lithography tools, announced the technical readiness through Chief Technology Officer Marco Pieters in an exclusive interview with Reuters

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. The company plans to release critical performance data at a technical conference in San Jose, demonstrating that these next-generation EUV tools have achieved the metrics necessary for manufacturers to move forward

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Source: Benzinga

Source: Benzinga

Technical Performance Validates Production Readiness

The High-NA EUV systems have processed 500,000 silicon wafers, achieved limited downtime, and demonstrated the precision required to create advanced chip circuits. These three data points collectively indicate the machines are prepared for manufacturers to adopt them. ASML currently reports roughly 80% uptime and aims to reach 90% by the end of the year

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. Marco Pieters emphasized the significance of the learning cycles completed during testing, stating that chipmakers "have all the knowledge to qualify these tools"

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. The imaging data ASML plans to release demonstrates customers can replace multiple steps with older-generation tools with a single High-NA step, streamlining the chip manufacturing process significantly.

$400 Million Investment Addresses AI Hardware Demands

The new tools cost roughly $400 million each, twice the price of original EUV machines, reflecting both their technological advancement and the surging demand for AI hardware

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. This substantial investment becomes necessary as current generation EUV tools approach the technical limit of their ability to make complex AI chips

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. The High-NA EUV tools are essential for the AI industry to enhance advanced AI applications like OpenAI's ChatGPT and help chipmakers deliver their AI chip roadmaps on time. Major chipmakers including Taiwan Semiconductor Manufacturing and Intel will use these machines to produce powerful and efficient AI chips by eliminating several costly and complex steps from production

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Integration Timeline and Light Source Breakthrough

Despite their technical readiness, full integration will take two to three years as companies conduct additional testing and development to incorporate the machines into manufacturing workflows. ASML also announced a breakthrough in EUV light source performance that could increase chip output by as much as 50% by the end of the decade

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. The company's system can consistently generate 1,000 watts under customer conditions and sees a path to 1,500 watts, with no fundamental barrier to eventually reaching 2,000 watts. These improvements could enable customers to raise wafer production to about 330 per hour by decade's end, up from roughly 220 today

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Strong Financial Performance Reflects Market Position

Strong AI-driven demand fueled ASML's 2025 results, with full-year net sales of $39.16 billion and net income of $11.5 billion

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. Fourth-quarter revenue reached $11.62 billion, and net bookings totaled $16.77 billion, more than half tied to EUV systems. The company ended the year with a backlog of about $46.47 billion and projects 2026 net sales between $40.72 billion and $46.7 billion

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. Over the past 12 months, ASML stock climbed over 106%, outperforming the PHLX Semiconductor Index's 75% gain, reflecting investor confidence in the company's position within the semiconductor industry

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Source: Reuters

Source: Reuters

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