Broadcom and Corning Collaborate on Advanced Co-Packaged Optics for AI Data Centers

Can Corning-Broadcom Deal Transform AI's Data Center Future? - Broadcom (NASDAQ:AVGO), Corning (NYSE:GLW)

Corning Inc GLW on Tuesday announced a collaboration with Broadcom Inc AVGO on a co-packaged optics (CPO) infrastructure that will significantly increase processing capacity within data centers. Corning will supply advanced optical components for Broadcom's Bailly CPO system, making it ideal for large-scale artificial intelligence (AI) clusters. CPO infrastructure is meeting the needs of AI workloads by improving networking and processing bandwidth, density, and power efficiency inside data centers by placing optics and electronics closer together in a processing system. Also Read: Nvidia, Broadcom, AMD Gain As Trump Reshapes AI Chip Export Rules To Ease Market Pressure Broadcom's Bailly CPO system incorporates eight silicon photonics-based, 6.4 TBps optical engines co-packaged with Broadcom's StrataXGS Tomahawk 5 Ethernet switch chip. Corning is now a qualified supplier of the optical infrastructure needed to connect fibers to these optical engines. Broadcom stock gained 66% in the last 12 months, backed by the artificial intelligence frenzy. BofA Securities analyst Vivek Arya continues to view the demand for AI computing as healthy, and the ongoing shift toward compute-hungry test-time computing and reasoning models should further help. He highlighted that capex from non-CSPs, including emerging cloud vendors, enterprises, and national AI infrastructure projects, could be an additional source of sustaining AI investments, filling more than any demand gap despite concerns that AI data center buildouts might peak in 2025 and considerably slow down afterward. The analyst's top AI picks remain Nvidia Corp NVDA and Broadcom, respectively, as merchant and custom AI silicon leaders. Price Actions: AVGO stock is up 3.3% at $228.92 at the last check on Tuesday. GLW is up 1.7% at $47.76. Read Next: Nvidia, Broadcom Lead Fund Manager Buys Even As Semiconductor Sector Cools: Analysts Image created using artificial intelligence via Midjourney. AVGOBroadcom Inc$229.073.38%Stock Score Locked: Want to See it? Benzinga Rankings give you vital metrics on any stock - anytime. Reveal Full ScoreEdge RankingsMomentum93.96Growth78.77Quality79.10Value8.78Price TrendShortMediumLongOverviewGLWCorning Inc$47.661.46%NVDANVIDIA Corp$129.295.11%Market News and Data brought to you by Benzinga APIs

Broadcom Unveils Next-Gen Optical Chip Tech To Power AI Data Centers - Broadcom (NASDAQ:AVGO)

Broadcom Inc. AVGO announced significant advancements in its co-packaged optics (CPO) technology on Thursday, with the launch of its third-generation 200G per lane (200G/lane) CPO product line. Broadcom highlighted key improvements in OSAT processes, thermal designs, handling procedures, fiber routing, and overall yield. Broadcom's leadership in CPO began in 2021 with its first-generation Tomahawk 4-Humboldt chipset, enabling an early learning cycle across the entire CPO supply chain. Also Read: Nvidia, AMD And Other Chip Stocks Gain As Trump Plans To Ease AI Chip Export Rules This chipset introduced key innovations, including high-density integrated optical engines, edge coupling, and detachable fiber connectors. Building on that success, the second-generation Tomahawk 5-Bailly (TH5-Bailly) chipset became the industry's first volume-production CPO solution. As part of the TH5-Bailly production, Broadcom focused on automated testing and scalable manufacturing processes, setting the stage for high-volume production of future generations. Broadcom's partners included Corning Inc GLW, Delta Electronics, and Foxconn Interconnect Technology. On Tuesday, Corning announced a partnership with Broadcom to power AI data centers with advanced optics for faster, more efficient processing. Corning will supply advanced optical components for Broadcom's Bailly CPO system, making it ideal for large-scale artificial intelligence (AI) clusters. Broadcom Stock Prediction For 2025 Equity research can be a valuable source of information for learning about a company's fundamentals. Analysts create financial models based on the fundamentals and expected future earnings of a company to arrive at a price target and recommendation for the stock. Shares of Broadcom have an average 1-year price target of $250.92, representing an expected upside of 7.41%. Because of differences in assumptions, analysts can arrive at very different price targets and recommendations. No analysts have bearish recommendations on Broadcom, while 13 analysts have bullish ratings. The street high price target from Cantor Fitzgerald is $300.0, while the street low from Citigroup is $210.0. Price Action: AVGO stock is trading higher 0.19% to $232.55 at the last check on Thursday. Read Next: AMD Stock Pops On $6 Billion Buyback Plan, US Tariff Ease Image by Ken Wolter via Shutterstock AVGOBroadcom Inc$232.870.32%Stock Score Locked: Want to See it? Benzinga Rankings give you vital metrics on any stock - anytime. Reveal Full ScoreEdge RankingsMomentum94.27Growth78.96Quality81.17Value8.59Price TrendShortMediumLongOverviewGLWCorning Inc$47.350.72% This content was partially produced with the help of AI tools and was reviewed and published by Benzinga editors. Market News and Data brought to you by Benzinga APIs

Corning collaborates with Broadcom to accelerate AI data center processing capacity

Corning (NYSE:GLW) has announced a collaboration with Broadcom (NASDAQ:AVGO) to increase processing capacity within data centers. Corning will supply cutting-edge optical components for Broadcom's Bailly CPO system. This combination will deliver improvements in optical interconnection density and power savings, making it ideal for large-scale artificial intelligence (AI) clusters. GLW +2.08% premarket to $47.95. Source: Press Release More on Broadcom, Corning Broadcom: This AI Moat Just Got Deeper (And Cheaper) Broadcom: Buy This Dip - Solid Upside Ahead Google, Nvidia among Wedbush's top 30 tech names defining the future of AI SA Asks: Which chip stocks are most attractive right now?

Broadcom Announces Third-Generation Co-Packaged Optics (CPO) Technology with 200G/lane Capability By Investing.com

PALO ALTO, Calif., May 15, 2025 (GLOBE NEWSWIRE) -- Broadcom Inc. (NASDAQ: AVGO) today announced significant advancements in its co-packaged optics (CPO) technology with the launch of its third-generation 200G per lane (200G/lane) CPO product line. In addition to the 200G/lane breakthrough, Broadcom demonstrated the maturity of its second-generation 100G/lane CPO products and ecosystem, highlighting key improvements in OSAT processes, thermal designs, handling procedures, fiber routing, and overall yield. A growing list of publicly-announced industry partners further underscores Broadcom's CPO platform readiness, enabling AI scale-out and scale-up applications for large AI deployments. Broadcom's Legacy in CPO Broadcom's leadership in CPO began in 2021 with its first-generation Tomahawk 4-Humboldt chipset, enabling an early learning cycle across the entire CPO supply chain, well ahead of the industry. This pioneering chipset introduced key innovations, including high-density integrated optical engines, edge coupling, and detachable fiber connectors. Building on that success, the second-generation Tomahawk 5-Bailly (TH5-Bailly) chipset became the industry's first volume-production CPO solution. As part of the TH5-Bailly production, Broadcom focused on automated testing and scalable manufacturing processes, setting the stage for high-volume production of future generations. The deployment of Broadcom's 100G/lane CPO product line has enabled the company to gain unmatched expertise in CPO system design, seamlessly integrating optical and electrical components to maximize the performance while delivering the lowest power optical interconnects in the industry. Today, with the announcement of the third-generation 200G/lane CPO product line, alongside commitment to developing a fourth-generation 400G/lane solution, Broadcom continues to lead the industry in delivering the lowest power and highest bandwidth density optical interconnects. A Rapidly Developing CPO Ecosystem Broadcom's leadership in CPO is driven not only by its cutting-edge switch ASICs and optical engine technology but also by a comprehensive ecosystem of passive optical components, interconnects, and system solutions partners. Through its 100G/lane CPO product line, Broadcom has proven its ability to scale its technology, meeting the growing demands of inference-based AI and supporting the next wave of AI-driven applications. Broadcom has spent years perfecting our CPO platform solutions, as evidenced by the maturity of our second generation 100G/lane products and the ecosystem readiness, said Near Margalit, Ph. D., vice president and general manager of the Optical Systems Division, Broadcom. With our third-generation 200G/lane CPO solutions, we are once again setting the bar for the next-generation of AI interconnects. Our commitment to delivering the industry-leading performance, power efficiency, and scalability will help our customers meet the demands of today's rapidly evolving AI infrastructure. Key Partner Milestones Towards Mass Deployment Broadcom's advancements in CPO technology are supported by the growing number of key publicly announced partnerships across the ecosystem, as several major collaborators announced significant milestones this week: These partner milestones demonstrate the continued progress in building a complete, fully integrated CPO ecosystem that enables the next generation of AI networking solutions. Gen 3 CPO: Unlocking 200G/lane CPO Systems Broadcom's 200G/lane CPO technology is designed for next-generation, high-radix scale-up and scale-out networks, which will demand parity with copper interconnect reliability and power efficiency. This capability is crucial for enabling scale-up domains exceeding 512 nodes, while also addressing the bandwidth, power, and latency challenges associated with the increasing size of next-generation foundation model parameters. Broadcom's Gen 3 solutions are engineered to address scale-up interconnects, where issues such as link flaps and operational disruptions can significantly affect the industry's ability to achieve the lowest cost per token. Broadcom's Gen 3 and 4 roadmap includes close collaboration with ecosystem partners to optimize the integration of CPO solutions, ensuring they meet the demanding requirements of hyperscale data centers and AI workloads. Additionally, Broadcom remains committed to open standards and system-level optimization, which are essential to the continued success and evolution of our CPO technology. For more information on Broadcom's CPO technology and latest advancements, please click here: www.broadcom.com/cpo Supporting Quotes Corning has been collaborating with Broadcom for several years to ensure that their CPO connectivity needs can be met with a high degree of performance and reliability as AI-enabled datacenters continue to scale, said Mike O'Day, Senior Vice President and General Manager, Corning Optical Communications. We're delivering an optical connectivity solution that enables unprecedented levels of optical speeds and bandwidth concentrations with lower power consumptions and costs. Corning looks forward to continued collaboration with Broadcom on their Bailly deployments as well as innovating towards next generation 200G per lane CPO systems. We are excited to bring this state-of-the-art CPO switch to market, empowering data centers to achieve even greater efficiency and performance, said Wangson Wang, General Manager of Data Networks Infrastructure BU at Delta. Our goal is to support the next generation of networking infrastructure with innovative solutions that deliver unparalleled speed, reduced energy consumption, and scalable growth for AI networks. We're deepening our partnership with Broadcom to drive innovation in 200G co-packaged optics, said Joseph Wang, Chief Technology Officer at Foxconn Interconnect Technology. Our joint efforts are aimed at delivering AI infrastructure that's ready for scale"built on high-performance, energy-efficient interconnects designed for tomorrow's data demands. At Micas Networks, we're excited to see Broadcom pushing the boundaries of networking technology with their next-generation 200G per lane CPO solutions. Our collaboration with Broadcom has been instrumental in launching the industry's first volume production, 100G per lane, CPO system delivering ultra low-power optical interconnects into AI fabrics, said Joey Gou, CEO of Micas Networks. Now, with a 200G per lane version, we're pushing even further into ultra-fast, power-efficient networking that will enable a range of next-gen applications. We look forward to continuing our partnership with Broadcom to support the evolving demands of the data-driven world. About Broadcom Broadcom Inc. (NASDAQ: AVGO) is a global technology leader that designs, develops, and supplies a broad range of semiconductor, enterprise software and security solutions. Broadcom's category-leading product portfolio serves critical markets including cloud, data center, networking, broadband, wireless, storage, industrial, and enterprise software. Our solutions include service provider and enterprise networking and storage, mobile device and broadband connectivity, mainframe, cybersecurity, and private and hybrid cloud infrastructure. Broadcom is a Delaware corporation headquartered in Palo Alto, CA. For more information, go to www.broadcom.com. Broadcom, the pulse logo, and Connecting Everything are among the trademarks of Broadcom. The term "Broadcom" refers to Broadcom Inc., and/or its subsidiaries. Other trademarks are the property of their respective owners.