MediaTek Dimensity 9500s to power OPPO Find X9s and new POCO phone in India

MediaTek Dimensity 9500s to power OPPO Find X9s, POCO phone in India

MediaTek has announced the Dimensity 9500s and Dimensity 8500 smartphone chipsets at its Tech Day event in Delhi after these were introduced last month for the global markets. The platforms target flagship and premium smartphone segments, focusing on performance, efficiency, on-device AI processing, imaging, gaming, and wireless connectivity. Both chipsets use an "All-Big Core" CPU architecture and support agentic AI workloads. The Dimensity 9500s is built on a 3nm process and features an octa-core All-Big Core CPU architecture. The CPU includes one Cortex-X925 ultra core clocked up to 3.73GHz, three Cortex-X4 premium cores, and four Cortex-A720 performance cores. Graphics are handled by the Immortalis-G925 GPU, and the integrated NPU supports generative reasoning and multi-modal AI models. Key capabilities include: The Dimensity 8500 uses a 4nm process and All-Big Core CPU architecture with eight Cortex-A725 cores clocked up to 3.4GHz. The computing and gaming engine supports stable frame delivery, faster loading, energy efficiency, and ray tracing for mainstream mobile games. Key capabilities include: MediaTek confirms that smartphones powered by the Dimensity 9500s and Dimensity 8500 will arrive through partner manufacturers. OPPO Find X9s in India is confirmed to be powered by the chip in India. POCO has also confirmed a device based on the chip in India soon, with additional announcements from other OEMs expected in the coming months. Speaking on the launch, JC Hsu, Corporate Senior Vice President at MediaTek and General Manager of the Wireless Communications Business Unit, said:

MediaTek unveils Dimensity 9500s and 8500 chipsets in India: Features and upcoming phones

MediaTek has officially expanded its semiconductor portfolio with the introduction of the Dimensity 9500s and Dimensity 8500 chipsets. The new SoCs were announced during the MediaTek Tech Day in New Delhi and are designed to power the next crop of flagship and premium smartphones with focus on performance efficiency, on-device AI, gaming and next-generation connectivity. OEM partners including Oppo and Poco confirmed upcoming device lineups featuring the new Dimensity 9500s. Oppo India announced that the upcoming Find X9s will be powered by the Dimensity 9500s. Goldee Patnaik, Head of Communications at Oppo India, described the device as a "refined and balanced approach" to the flagship ecosystem. Poco India also confirmed plans to use the Dimensity 9500s into a future X-series smartphone. Ken Sekhar, Marketing Lead at Poco India, noted that the chipset would allow the brand to set new benchmarks in real-world performance for its users. "With the launch of these chipsets, we are democratizing the flagship experience," said Anuj Sidharth, Director of Marketing and Corporate Communication for MediaTek India and SEA. He emphasized that the combination of Big Core architectures and generative AI capabilities is intended to bring next-generation experiences to a broader market. The Dimensity 9500s is manufactured on a 3nm process and continues MediaTek's "All Big Core" CPU approach. It features an octa-core layout with one Arm Cortex-X925 ultra core clocked up to 3.73GHz, three Cortex-X4 cores and four Cortex-A720 cores. Graphics duties are handled by the Immortalis-G925 GPU, which supports hardware ray tracing and MediaTek's Adaptive Game Technology 3.0 and Frame Rate Conversion 3.0. MediaTek said the chipset's integrated NPU is designed to handle generative and multimodal AI workloads directly on the device. On the imaging side, the Dimensity 9500s supports the MediaTek Imagiq ISP with 8K full-focus video recording, Dolby Vision HDR, real-time motion tracking at up to 30fps, and camera sensors up to 320MP. Display support goes up to WQHD+ resolution with refresh rates as high as 180Hz, including support for different form factors such as tri-fold displays. In terms of connectivity, the Dimensity 9500s includes a 5G Release 17 modem with up to 4-carrier aggregation and peak downlink speeds of up to 7Gbps. It also supports Wi-Fi 7, Bluetooth 5.4, dual-SIM dual-active 5G, and MediaTek's UltraSave 4.0 power-saving technology. Additional features include AI Network Suite 2.0 for improved performance in weak signal areas and Xtra Range 3.0, which extends Wi-Fi coverage and enables long-range Bluetooth device-to-device connections. The Dimensity 8500 is positioned below the flagship SoC and is built on a 4nm process and also uses an All Big Core CPU design. It consists of eight Cortex-A725 cores with clock speeds going up to 3.4GHz. According to MediaTek, this configuration improves both sustained performance and power efficiency compared to the previous generation. For graphics, the Dimensity 8500 gets a Mali-G720 GPU which MediaTek claims offers up to a 25 percent performance uplift and lower power consumption. The chipset supports LPDDR5X memory at speeds of up to 9600Mbps and UFS 4 storage. It also includes MediaTek's 8th-generation NPU 880, with support for large language models and image generation workloads. The imaging capabilities on the Dimensity 8500 include support for camera sensors up to 320MP and 4K video recording at 60fps. Display support goes up to WQHD+ resolution at 144Hz, with dual-screen support. On the connectivity front, the chip offers Wi-Fi 6E, Bluetooth 5.4, dual-SIM dual-active 5G and MediaTek UltraSave 3.0+ power-saving features.