Micron Invests $7 Billion in Singapore for Advanced HBM Packaging Facility to Meet AI Demand

Micron Breaks Ground on New HBM Advanced Packaging Facility in Singapore

Approximate $7 billion investment over the next several years to meet AI data center demand SINGAPORE, Jan. 08, 2025 (GLOBE NEWSWIRE) -- Micron Technology, Inc. (Nasdaq: MU) broke ground today on a new High-Bandwidth Memory (HBM) advanced packaging facility adjacent to the company's current facilities in Singapore. Micron marked the occasion with a ceremony attended by Gan Kim Yong, Deputy Prime Minister and Minister for Trade and Industry of Singapore, Png Cheong Boon, Chairman of the Singapore Economic Development Board, Pee Beng Kong, Executive Vice President of the Singapore Economic Development Board, and Tan Boon Khai, CEO of JTC Corporation. The new HBM advanced packaging facility will be the first facility of its kind in Singapore. Operations for the new facility are scheduled to begin in 2026, with meaningful expansion of Micron's total advanced packaging capacity beginning in calendar 2027 to meet the demands of AI growth. The launch of this facility will further strengthen Singapore's local semiconductor ecosystem and innovation. "As AI adoption proliferates across industries, the demand for advanced memory and storage solutions will continue to increase robustly," said Sanjay Mehrotra, president and CEO of Micron. "With the continued support of the Singapore government, our investment in this HBM advanced packaging facility strengthens our position to address the expanding AI opportunities ahead." Micron's HBM advanced packaging investment of approximately US $7 billion (SG$9.5 billion) through the end of the decade and beyond will initially create around 1,400 jobs, with site expansion plans to reach an estimated 3,000 jobs in the future. These new roles will include functions such as packaging development, assembly and test operations. Png Cheong Boon, Chairman of the Singapore Economic Development Board, said, "We welcome this significant investment by Micron, which reflects its confidence in Singapore's competitiveness as a critical node in the global semiconductor supply chain. This is Singapore's first high-bandwidth memory advanced packaging facility, allowing us to contribute to global AI growth. It expands Singapore's partnership with Micron and further strengthens the semiconductor ecosystem in Singapore." Micron's future expansion plans in Singapore will also support long-term manufacturing requirements for NAND. Micron will maintain flexibility in managing the pace of capacity ramps in both the HBM and NAND facilities to align with market demand. Micron's current facility in Singapore is the first front-end semiconductor fab in the world to be recognized as the Advanced Fourth Industrial Revolution Lighthouse and Sustainability Lighthouse by the World Economic Forum. The new HBM advanced packaging facility will be built in alignment with Micron's sustainability commitments. It will feature technologies such as a greenhouse gas abatement, water recycling and waste circularity (reduce, reuse, recycle, recover). The new building will be highly automated through AI-based intelligent solutions and designed to meet the Leadership in Energy and Environmental Design (LEED) certification requirements. About Micron Technology, Inc. We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence (AI) and compute-intensive applications that unleash opportunities -- from the data center to the intelligent edge and across the client and mobile user experience. To learn more about Micron Technology, Inc. (Nasdaq: MU), visit micron.com.

Micron Breaks Ground on New HBM Advanced Packaging Facility in Singapore By Investing.com

Approximate $7 billion investment over the next several years to meet AI data center demand SINGAPORE, Jan. 08, 2025 (GLOBE NEWSWIRE) -- Micron Technology, Inc. (Nasdaq: NASDAQ:MU) broke ground today on a new High-Bandwidth Memory (HBM) advanced packaging facility adjacent to the company's current facilities in Singapore. Micron marked the occasion with a ceremony attended by Gan Kim Yong, Deputy Prime Minister and Minister for Trade and Industry of Singapore, Png Cheong Boon, Chairman of the Singapore Economic Development Board, Pee Beng Kong, Executive Vice President of the Singapore Economic Development Board, and Tan Boon Khai, CEO of JTC Corporation. The new HBM advanced packaging facility will be the first facility of its kind in Singapore. Operations for the new facility are scheduled to begin in 2026, with meaningful expansion of Micron's total advanced packaging capacity beginning in calendar 2027 to meet the demands of AI growth. The launch of this facility will further strengthen Singapore's local semiconductor ecosystem and innovation. As AI adoption proliferates across industries, the demand for advanced memory and storage solutions will continue to increase robustly, said Sanjay Mehrotra, president and CEO of Micron. With the continued support of the Singapore government, our investment in this HBM advanced packaging facility strengthens our position to address the expanding AI opportunities ahead. Micron's HBM advanced packaging investment of approximately US $7 billion (SG$9.5 billion) through the end of the decade and beyond will initially create around 1,400 jobs, with site expansion plans to reach an estimated 3,000 jobs in the future. These new roles will include functions such as packaging development, assembly and test operations. Png Cheong Boon, Chairman of the Singapore Economic Development Board, said, We welcome this significant investment by Micron, which reflects its confidence in Singapore's competitiveness as a critical node in the global semiconductor supply chain. This is Singapore's first high-bandwidth memory advanced packaging facility, allowing us to contribute to global AI growth. It expands Singapore's partnership with Micron and further strengthens the semiconductor ecosystem in Singapore. Micron's future expansion plans in Singapore will also support long-term manufacturing requirements for NAND. Micron will maintain flexibility in managing the pace of capacity ramps in both the HBM and NAND facilities to align with market demand. Micron's current facility in Singapore is the first front-end semiconductor fab in the world to be recognized as the Advanced Fourth Industrial Revolution Lighthouse and Sustainability Lighthouse by the World Economic Forum. The new HBM advanced packaging facility will be built in alignment with Micron's sustainability commitments. It will feature technologies such as a greenhouse gas abatement, water recycling and waste circularity (reduce, reuse, recycle, recover). The new building will be highly automated through AI-based intelligent solutions and designed to meet the Leadership in Energy and Environmental Design (LEED) certification requirements. About Micron Technology, Inc. We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND and NOR memory and storage products through our Micron ® and Crucial ® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence (AI) and compute-intensive applications that unleash opportunities " from the data center to the intelligent edge and across the client and mobile user experience. To learn more about Micron Technology, Inc. (Nasdaq: MU), visit micron.com. © 2025 Micron Technology, Inc. All rights reserved. Information, products, and/or specifications are subject to change without notice. Micron, the Micron logo, and all other Micron trademarks are the property of Micron Technology, Inc. All other trademarks are the property of their respective owners.

Micron invests $7 billion in HBM assembly facility amid AI boom

Today, Micron Technology has started constructing its multi-billion-dollar packaging facility for high-bandwidth memory (HBM) in Singapore. The company will invest $7 billion in the plant, as it expects demand for HBM3E, HBM4, and HBM4E memory to skyrocket in the coming years amid the AI boom. The facility is set to start operations in 2026. Micron's packaging facility for high-bandwidth memory (HBM) is located next to Micron's existing fabs in Singapore that produce 3D NAND and DRAM. The new HBM assembly plant will commence production in 2026 and then plans to substantially increase its capacity in 2027. The facility will use advanced AI-driven automation to boost operational efficiency, though the company does not disclose where and how artificial intelligence will be used. While Micron is leading the industry with premium HBM3E memory, when it comes to HBM market share, the company is still an underdog compared to Samsung and SK hynix. To some degree, this is conditioned by the fact that Micron does not have as vast DRAM manufacturing capacity as its rivals from South Korea (while HBM memory dies take up more capacity than conventional memory ICs). Still, to a certain degree, this can be attributed to the lack of vast HBM assembly capacity. Micron is gradually increasing its HBM3E output at its existing facilities, hoping to grab a mid-20% HBM market share in mid-2025. However, with the new Singapore assembly facility coming online in 2026, the company hopes to get an even larger chunk of the market. "As AI adoption proliferates across industries, the demand for advanced memory and storage solutions will continue to increase robustly," said Sanjay Mehrotra, president and CEO of Micron. "With the continued support of the Singapore government, our investment in this HBM advanced packaging facility strengthens our position to address the expanding AI opportunities ahead." Although the new facility will be tailored for assembling HBM stacks, it can also be used to assemble 3D NAND packages since assembly technologies with through-silicon vias (TSVs) are generally similar. The project will initially create around 1,400 jobs; the expansion could potentially increase that number to 3,000. These roles will include packaging development, assembly, and testing operations. "This is Singapore's first high-bandwidth memory advanced packaging facility, allowing us to contribute to global AI growth," said Png Cheong Boon, Singapore Economic Development Board Chairman. "It expands Singapore's partnership with Micron and further strengthens the semiconductor ecosystem in Singapore."

Micron's $7 Billion Bet on AI-Driven Memory In Singapore Facility Set to Boost Innovation - Micron Technology (NASDAQ:MU)

Nvidia's Blackwell architecture to feature Micron's HBM chips, driving AI adoption and memory market growth into 2027. On Wednesday, Micron Technology, Inc. MU broke ground on a new High-Bandwidth Memory (HBM) advanced packaging facility near the company's current facilities in Singapore. It marks Singapore's first HBM advanced packaging facility, which will be highly automated through AI-based intelligent solutions and feature greenhouse gas abatement technologies. Gan Kim Yong, Deputy Prime Minister and Minister for Trade and Industry of Singapore, Png Cheong Boon, Singapore Economic Development Board Chairman, and other officials attended the ceremony. Also Read: Huawei And Baidu Increase Samsung HBM Purchases As US Curbs Loom Operations for the new facility will begin in 2026, and Micron's total advanced packaging capacity will expand starting in 2027. Micron CEO Sanjay Mehrotra flagged that as AI adoption across industries increases, the demand for advanced memory and storage solutions will continue to increase robustly. Micron's HBM advanced packaging investment of ~$7 billion (SG $9.5 billion) through the end of the decade and beyond will initially create around 1,400 jobs. Site expansion plans to reach an estimated 3,000 jobs, including functions like packaging development, assembly, and test operations. Micron's future expansion plans in Singapore will also support NAND's long-term manufacturing requirement. Nvidia Corp NVDA chief Jensen Huang announced at CES 2025 that Micron's HBM chips will power Nvidia's latest Blackwell architecture. Nvidia also showcased a $3,000 computer, dubbed Project Digits, featuring Micron's DDR5X HBM. Rosenblatt is one of Rosenblatt's top picks for 2025, backed by HBM dominance and driving AI and memory cycles. Prior reports indicated that SK Hynix will lead the HBM market in 2024, holding over 52% of the market share, followed by Samsung with 42.4% and Micron with over 5%. Nvidia approved Samsung's fifth-gen HBM3E chips for AI processors, while the 12-layer HBM3E chips are awaiting approval. Morgan Stanley expects the HBM market to grow from $4 billion in 2023 to $71 billion in 2027. Micron is eying HBM chip production in the U.S. and Malaysia. Micron stock surged 20% in the last 12 months. Investors can gain exposure to the stock through JPMorgan Equity Premium Income ETF JEPI and First Trust NASDAQ-100-Technology Sector Index Fund QTEC. Price Action: MU stock traded higher by 1.36% to $103.30 premarket at the last check on Wednesday. Also Read: TSMC Analyst Sees AI, Advanced Nodes Driving Growth In 2025 Photo via Shutterstock Market News and Data brought to you by Benzinga APIs

Micron Breaks Ground on New HBM Advanced Packaging Facility in Singapore - Micron Technology (NASDAQ:MU)

SINGAPORE, Jan. 08, 2025 (GLOBE NEWSWIRE) -- Micron Technology, Inc. MU broke ground today on a new High-Bandwidth Memory (HBM) advanced packaging facility adjacent to the company's current facilities in Singapore. Micron marked the occasion with a ceremony attended by Gan Kim Yong, Deputy Prime Minister and Minister for Trade and Industry of Singapore, Png Cheong Boon, Chairman of the Singapore Economic Development Board, Pee Beng Kong, Executive Vice President of the Singapore Economic Development Board, and Tan Boon Khai, CEO of JTC Corporation. The new HBM advanced packaging facility will be the first facility of its kind in Singapore. Operations for the new facility are scheduled to begin in 2026, with meaningful expansion of Micron's total advanced packaging capacity beginning in calendar 2027 to meet the demands of AI growth. The launch of this facility will further strengthen Singapore's local semiconductor ecosystem and innovation. "As AI adoption proliferates across industries, the demand for advanced memory and storage solutions will continue to increase robustly," said Sanjay Mehrotra, president and CEO of Micron. "With the continued support of the Singapore government, our investment in this HBM advanced packaging facility strengthens our position to address the expanding AI opportunities ahead." Micron's HBM advanced packaging investment of approximately US $7 billion (SG$9.5 billion) through the end of the decade and beyond will initially create around 1,400 jobs, with site expansion plans to reach an estimated 3,000 jobs in the future. These new roles will include functions such as packaging development, assembly and test operations. Png Cheong Boon, Chairman of the Singapore Economic Development Board, said, "We welcome this significant investment by Micron, which reflects its confidence in Singapore's competitiveness as a critical node in the global semiconductor supply chain. This is Singapore's first high-bandwidth memory advanced packaging facility, allowing us to contribute to global AI growth. It expands Singapore's partnership with Micron and further strengthens the semiconductor ecosystem in Singapore." Micron's future expansion plans in Singapore will also support long-term manufacturing requirements for NAND. Micron will maintain flexibility in managing the pace of capacity ramps in both the HBM and NAND facilities to align with market demand. Micron's current facility in Singapore is the first front-end semiconductor fab in the world to be recognized as the Advanced Fourth Industrial Revolution Lighthouse and Sustainability Lighthouse by the World Economic Forum. The new HBM advanced packaging facility will be built in alignment with Micron's sustainability commitments. It will feature technologies such as a greenhouse gas abatement, water recycling and waste circularity (reduce, reuse, recycle, recover). The new building will be highly automated through AI-based intelligent solutions and designed to meet the Leadership in Energy and Environmental Design (LEED) certification requirements. About Micron Technology, Inc. We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence (AI) and compute-intensive applications that unleash opportunities -- from the data center to the intelligent edge and across the client and mobile user experience. To learn more about Micron Technology, Inc. MU, visit micron.com. © 2025 Micron Technology, Inc. All rights reserved. Information, products, and/or specifications are subject to change without notice. Micron, the Micron logo, and all other Micron trademarks are the property of Micron Technology, Inc. All other trademarks are the property of their respective owners. Micron Media Relations Contact Mark Plungy Micron Technology, Inc. +1 (408) 203-2910 [email protected] Micron Investor Relations Contact Satya Kumar Micron Technology, Inc. +1 (408) 450-6199 [email protected] Market News and Data brought to you by Benzinga APIs

Micron to Spend $7 Billion Building Singapore Memory Chip Plant

Micron Technology Inc. is investing $7 billion over the next several years to expand its manufacturing footprint in Singapore, as artificial intelligence boosts demand for advanced memory chips. The US company broke ground on a new facility in the city-state on Wednesday, saying the plant is set to start operating in 2026. It will be used to package high-bandwidth memory chips, a type widely seen in AI data centers, and create about 1,400 jobs.