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NVIDIA CEO says Rubin GPU is the company's 'most advanced' AI architecture, cooking at TSMC now
NVIDIA CEO Jensen Huang has confirmed that his company has six different Rubin chips in the ovens at TSMC, gearing up for trial production right now. Jensen is in Taiwan right now for important meetings with key executives at TSMC, with local Taiwanese media talking to Jensen who confirmed that NVIDIA has already taped out six different Rubin chips -- including new CPUs and GPUs -- and that they're at TSMC being prepared for trial production. The NVIDIA CEO mentioned that the new Rubin chips include a dedicated CPU, GPU, scale-up NVLink Switch, and a new silicon photonics processor, which means the entire stack is getting a huge Rubin-infused upgrade. Rubin is a different beast to Blackwell and Hopper, as the changes to Rubin are from the ground up: HBM, the process node, design, and more. Jensen said: "My main purpose is to visit TSMC as you know we have a next generation architecture called Rubin, and Rubin is very advanced and we have now taped out six brand new chips to TSMC, so all of these chips are now in TSMC's fabs". NVIDIA's next-gen Rubin R100 AI GPU will feature next-gen HBM4 memory which is a huge upgrade over HBM3E used inside of the Blackwell B200 and B300 chips, with the company also using TSMC's new 3nm process node (N3P) and CoWoS-L advanced packaging. Rubin also shifts into a new chiplet design, which is a first-of-its-kind implementation for NVIDIA, and a 4x reticle design (compared to 3.3x reticle on Blackwell). Rubin is expected to debut sometime in 2026 if there are no issues, with the big reveal said to happen at NVIDIA's upcoming GTC Washington D.C. event in October 2025, so we're not far away now at all. If Rubin doesn't make its big appearance at GTC Washington D.C. then we should expect some more news either at CES 2026 in January, or GTC 2026 in March next year.
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NVIDIA CEO Jensen Huang Confirms Rubin AI Chip Is Being Prepped at TSMC, the Company's Most Advanced Architecture to Date
NVIDIA's Jensen Huang has confirmed that his firm is now working on the next-gen Rubin AI architecture, which is deemed a 'revolution' for the compute markets. Team Green is currently operating at a vicious product cycle, given that the firm just a few months ago introduced 'Blackwell Ultra' GB300 AI servers, and now, the firm is looking at the next generation. For those unaware, NVIDIA's CEO Jensen Huang is currently on a visit to Taiwan, where his focus will be specifically on Rubin's progress at TSMC. Speaking with the local media, Jensen revealed that NVIDIA has already taped out six different Rubin chips, including new CPUs and GPUs, and they are now under TSMC and being prepped for trial production. My main purpose is to visit TSMC as you know we have a next generation architecture called Rubin, and Rubin is very advanced and we have now taped out six brand new chips to TSMC, so all of these chips are now in TSMC's fabs. Jensen mentions that new chips include a dedicated CPU, GPU, scale-up NVLink Switch, and a new silicon photonics processor, which means that the whole tech stack will undergo a massive upgrade. NVIDIA's Rubin architecture is seen as the next leap in computing capabilities since Team Green is expected to make changes from the ground up, starting with HBM, process node, design, and much more. The Rubin architecture is expected to witness fundamental changes, which we'll discuss ahead. The firm will utilize the next-generation HBM4 chips to power its R100 GPUs, which are said to be a significant upgrade from the modern-day HBM3E standard. Team Green will also adopt TSMC's 3nm (N3P) process and CoWoS-L packaging. More importantly, Rubin will adopt a chiplet design, a first-of-a-kind NVIDIA implementation, and a 4x reticle design (versus 3.3x of Blackwell). So when you look at it, Rubin will make an impact similar to what Hopper did, in terms of generational leap. In terms of when Rubin will debut in the market, we are expecting a 2026-2027 timeline, depending upon when the company completes trial production. But the anticipation around NVIDIA's Rubin makes it clear that the architecture will be a massive launch by Team Green.
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NVIDIA CEO Jensen Huang confirms the development of the company's most advanced AI architecture, 'Rubin', with six new chips currently in trial production at TSMC.
NVIDIA, the leading graphics processing unit (GPU) manufacturer, is pushing the boundaries of AI technology once again with its upcoming 'Rubin' architecture. CEO Jensen Huang has confirmed that the company's "most advanced" AI architecture is currently in development, with six different Rubin chips already taped out and undergoing trial production at Taiwan Semiconductor Manufacturing Company (TSMC) 12.
Source: Wccftech
The Rubin architecture represents a significant leap forward in NVIDIA's AI capabilities. Unlike its predecessors, Blackwell and Hopper, Rubin incorporates fundamental changes from the ground up. These innovations include:
HBM4 Memory: The next-generation Rubin R100 AI GPU will feature HBM4 memory, a substantial upgrade from the HBM3E used in the current Blackwell B200 and B300 chips 1.
Advanced Process Node: NVIDIA is utilizing TSMC's new 3nm process node (N3P), pushing the boundaries of semiconductor manufacturing 12.
Chiplet Design: In a first for NVIDIA, Rubin will adopt a chiplet design, allowing for more efficient and flexible GPU architectures 12.
Expanded Reticle: Rubin will feature a 4x reticle design, compared to the 3.3x reticle used in Blackwell, potentially allowing for larger and more complex chip designs 1.
Source: TweakTown
Jensen Huang revealed that the Rubin chips in development include a dedicated CPU, GPU, scale-up NVLink Switch, and a new silicon photonics processor. This indicates that NVIDIA is upgrading its entire technology stack with the Rubin architecture 12.
While exact details are still under wraps, industry insiders speculate that Rubin could make its debut in 2026, barring any unforeseen issues. The big reveal is expected to take place at NVIDIA's GTC Washington D.C. event in October 2025. If not then, more news might surface at CES 2026 in January or GTC 2026 in March 1.
The development of Rubin underscores NVIDIA's commitment to maintaining its leadership in the AI chip market. With its ground-up redesign and advanced features, Rubin is poised to make an impact similar to what the Hopper architecture achieved in terms of generational leap 2.
NVIDIA's pace of innovation is noteworthy, with the company introducing the 'Blackwell Ultra' GB300 AI servers just a few months ago. The quick transition to developing Rubin demonstrates NVIDIA's aggressive strategy to stay ahead in the highly competitive AI hardware market 2.
As the AI industry continues to evolve rapidly, NVIDIA's Rubin architecture stands as a testament to the company's dedication to pushing the boundaries of what's possible in AI computing. With its revolutionary design and advanced components, Rubin is set to redefine the landscape of AI technology in the coming years.
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