TSMC's 3nm Process Set for Massive Adoption by AI Tech Giants

TSMC 3nm Set To Witness Massive Adoption From AI Tech Giants; NVIDIA Rubin, AMD Instinct MI355X & Intel Falcon Shores

TSMC's 3nm process is set to receive massive adoption in the AI sector, as Intel, NVIDIA, & AMD plan on utilizing the technology in their next-gen accelerators. The Taiwan giant's next node is said to be highly demanding in the markets, mainly because mainstream tech companies have revolved their upcoming product portfolios around the process. Notable examples include Apple for its upcoming A19 Pro chip, MediaTek's Dimensity 9400, and even Google's Tensor G5. And now, it looks like we have clarity on the adoption of TSMC's 3nm by the AI tech giants, such as NVIDIA and AMD out there, with a new report by Ctee now showing us where the process is expected to be integrated when it comes to AI portfolios. It is revealed that TSMC's 3nm is going to be one of the firm's most successful processes, mainly since the demand from the AI markets is quite high this time. For Team Red, it is said that AMD plans to utilize TSMC's 3nm process for their next-gen Instinct MI355X AI accelerator, which will be based on the next-gen CDNA 4 architecture and will bring in quality performance in the markets. Team Red's AI portfolio in 2025 isn't that extensive when compared to the likes of NVIDIA's Blackwell, but maybe the company is prioritizing quality over quantity for now. For NVIDIA, well the firm is expected to integrate TSMC's 3nm process and its derivatives into the upcoming "Rubin" architecture, which is slated to debut in the markets by 2026. Team Green doesn't plan to rush out its Rubin AI products to compete with industry alternatives, which is why it can be supposed that out of all AI accelerators adopting TSMC's 3nm, NVIDIA will be the last to join the bandwagon. But there's a rumor that NVIDIA x MediaTek AI PC SoC will launch somewhere next year, which will feature TSMC's 3nm node; hence, we will see the process in action then. Perhaps the underdog in TSMC's 3nm AI products is likely to be Intel, with their highly anticipated Falcon Shores architecture. This architecture is expected to turn around Team Blue's position in the AI markets following a delayed and rather complacent entry. With Falcon Shores, Intel will ditch its foundry services and instead adopt TSMC's 3nm process in an attempt to make its products much more competitive. Intel's Falcon Shores holds great importance for the firm and the sustainability of its AI business. With the adoption from mobile, automotive, and the AI industry, TSMC's 3nm process is poised for massive revenue generation, and who knows, maybe it will turn out to be the most successful product in t

TSMC's 3nm project list grows: AMD MI350 series, NVIDIA Rubin AI GPU, expected in 2H 2025

TSMC's list of 3nm customers is growing, with AI added to the 3nm project list with AMD's upcoming Instinct MI350 AI accelerator series, and NVIDIA's next-gen Rubin R100 AI GPU. In a new report from Ctee citing investment bankers, TSMC will fab the new MI350 series and Rubin R100 series AI chips in the second half of 2025, joining 3nm customers with Apple, Intel, MediaTek, and Qualcomm... as well as AMD on its CPU side making chips on TSMC's 3nm process node (already, and more into 2025). The full list of TSMC's 3nm project list includes the Apple M4, Apple A18 and A18 chips for the iPhone, MediaTek's new Dimensity C-X1 (auto chip), Qualcomm's upcoming Snapdragon 8 Gen4 chip, Intel's new Lunar Lake and Arrow Lake CPUs, AMD's new Zen 5 CPUs and upcoming Instinct MI350 series AI accelerators, and finally, NVIDIA's next-gen Rubin R100 AI GPU (which will sport future-gen HBM4 memory). AMD's new Instinct MI350 series shifting to TSMC's new 3nm process node will bring a more level playing field in the advanced process node field, with NVIDIA's new Rubin R100 AI GPU also made on the 3nm node. Ctee cites its sources, saying that NVIDIA's orders to TSMC in 2025 will exceed the numbers of orders in 2024, with its 3nm and 5nm production capacity stretched even further. There's also the NVIDIA + MediaTek co-developed Arm-based AI PC processor that will be built on 3nm at TSMC, which will extend production capacity even further, with this new AI PC chip to be revealed in Q2 2025, and mass produced in Q3 2025. Intel's new Lunar Lake CPUs are also built on 3nm, with most of its future products gearing up for production at TSMC, too. Industry insiders have said that with market trends the way they are, that the entry of new AI chips into the battle on TSMC's new 3nm node will consume more wafer foundry production capacity, especially in the advanced packaging side of things. NVIDIA's new Blackwell B200, AMD's Instinct MI300, and Intel's Gaudi 3 AI chips use CoWoS advanced packaging, which is 3.3x the size of the TSMC photomask, and can only cut about 16 wafers. Moving forward, we'll see an increase to 5.5x, with the number of wafers being cut becoming less. A list of chips being fabbed on TSMC's new 3nm process node: