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Nvidia's Rubin GPU and Vera CPU data center AI platforms begin tape out -- both chips 'in fab' and on track for 2026
Collette Cress, chief financial officer of Nvidia, has said that the company's next-generation data center-grade GPU codenamed Rubin and CPU, codenamed Vera have been taped out and were 'in fab,' which means that their silicon is currently being produced by TSMC. The announcement indicates that
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NVIDIA CEO says Rubin GPU is the company's 'most advanced' AI architecture, cooking at TSMC now
NVIDIA CEO Jensen Huang has confirmed that his company has six different Rubin chips in the ovens at TSMC, gearing up for trial production right now. Jensen is in Taiwan right now for important meetings with key executives at TSMC, with local Taiwanese media talking to Jensen who confirmed that
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NVIDIA confirms next-gen Rubin AI GPUs with HBM4 are in the fab, volume production in 2H 2026
TL;DR: NVIDIA CEO Jensen Huang confirmed Rubin AI GPUs and five other advanced chips are in production at TSMC, targeting volume release in the second half of 2026. Rubin will be NVIDIA's third-generation NVLink rack-scale AI supercomputer, supporting a $3-4 trillion global AI infrastructure growth
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NVIDIA CEO Jensen Huang Confirms Rubin AI Chip Is Being Prepped at TSMC, the Company's Most Advanced Architecture to Date
NVIDIA's Jensen Huang has confirmed that his firm is now working on the next-gen Rubin AI architecture, which is deemed a 'revolution' for the compute markets. Team Green is currently operating at a vicious product cycle, given that the firm just a few months ago introduced 'Blackwell Ultra' GB300
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NVIDIA's Cutting-Edge Rubin AI Chips Could Roll Out From TSMC By Year-End, As Jensen Sets a Pace No Rival Can Match
NVIDIA's next-gen Rubin architecture is expected to come out from TSMC's fabs as soon as Q4 2025, which means a new lineup has dropped in just six months from the previous one. When you look at Team Green's product cycle, the firm is currently unmatched mainly since the company has just ramped up
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NVIDIA's next-generation Rubin platform, including advanced GPUs and CPUs, has entered production at TSMC. This marks a significant milestone in AI chip development, with volume production scheduled for 2026.
NVIDIA, the leading AI chip manufacturer, has announced that its next-generation data center AI platform, codenamed Rubin, has entered production at Taiwan Semiconductor Manufacturing Company (TSMC). This marks a significant milestone in the development of advanced AI chips, with NVIDIA's CEO Jensen Huang confirming that six different Rubin chips have been taped out and are now in TSMC's fabs
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Source: Wccftech
The Rubin platform consists of several cutting-edge components:
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The Rubin platform introduces several technological improvements:
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NVIDIA has confirmed that the Rubin platform is on track for volume production in the second half of 2026
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. This timeline aligns with the company's annual product cadence and continuous innovation across compute, networking, systems, and software.Jensen Huang, NVIDIA's CEO, stated:
"Rubin will be our third-generation NVLink rack-scale AI supercomputer with a mature and full-scale supply chain. This keeps us on track with our pace of an annual product cadence and continuous innovation across compute, networking, systems and software"
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Source: TweakTown
NVIDIA expects the Rubin platform, along with its current Blackwell architecture, to play a crucial role in the expanding AI infrastructure market. The company projects that these platforms will contribute to a $3 trillion to $4 trillion global AI infrastructure build-out through the end of the decade
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.The rapid development and production of the Rubin platform demonstrate NVIDIA's commitment to maintaining its leadership position in the AI chip market. With these advancements, NVIDIA aims to stay ahead of potential competitors and meet the growing demand for high-performance AI computing solutions
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