TSMC's Advanced AI Chip Packaging Plant in Taiwan Faces Setbacks: Typhoon Danas and Safety Concerns

TSMC's new advanced packaging plant in Taiwan gets hit by typhoon after recent delays

TSMC's new advanced packaging plant in Taiwan has been hit by a typhoon, after the company has been hit with multiple setbacks at the plant. As an Amazon Associate, we earn from qualifying purchases. TweakTown may also earn commissions from other affiliate partners at no extra cost to you. TSMC's new advanced packaging plant in Chiayi, Taiwan, has been hit with multiple setbacks, but another setback has just happened as the plant was damaged by a typhoon. Typhoon Danas is the fourth typhoon to hit Taiwan in 2025. It has impacted the western regions of the country, with two people killed and over 500 people injured from the impact of the typhoon on western Taiwan. Typhoon Danas is the first typhoon to hit Chiayi, Taiwan, in 120 years, with TSMC's new under-construction facilities in Chiayi being impacted. The impact from the typhoon was limited to impacting scaffolding collapsing at the site, according to the Southern Science Park Administration, reports the Taiwan Economic Daily. The scaffolding that collapsed is now the second setback at TSMC's new advanced packaging site, with TED reporting that the site's contractor has increased the speed of construction to account for the delay caused by Typhoon Danas. TSMC's second setback at its new advanced packaging plant is after the first in May 2025, where a construction worker was hit by a switchboard and died from the injuries. Taiwan's safety authorities took note of the incident, where after the investigation, it allowed the semiconductor giant to resume construction activities on the site. TSMC CEO C.C. Wei previously said that he would personally apologise for any safety issues at the company's sites, with Wei commenting that TSMC was aware of the social responsibility and wasn't in the semiconductor business to just make money. TSMC's new advanced packaging site in Chiayi is responsible for packaging chips in a world with continuously increasing semiconductor demand being driven by AI demand. The new Chiayi advanced packaging plant will manufacture fully packaged chips for companies like NVIDIA and more, with even TSMC's new US-based plants sending chips back to Taiwan for advanced packaging.

TSMC's Under-Construction AI Plant In Taiwan Hit By Typhoon Danas

The Taiwan Semiconductor Manufacturing Company (TSMC)'s new packaging plant, currently under construction in Chiayi, Taiwan, has recently dealt with multiple setbacks. The first setback involved a worker's death due to a falling switchboard. After safety regulators gave the go-ahead to resume work, Typhoon Danas hit Chiayi for the first landfall in the region in 120 years. The Chiayi plant is expected to finish its first CoWoS plant in the current quarter, and the plant's construction was delayed by a month earlier this year after a safety accident in May. Typhoon Danas is the fourth typhoon to hit Taiwan this year, and a rare one that impacted the island's western regions. As of Monday, two people have been killed, while more than 500 people have been injured due to the typhoon's impact on western Taiwan. Danas is the first typhoon to hit Chiayi, Taiwan, in 120 years, with TSMC's under-construction facilities in Chiayi also taking some impact. The impact was limited to some scaffolding collapsing at the site, according to the Southern Science Park Administration, reports Taiwan's Economic Daily. The scaffolding collapse was the second setback to the site, and the Daily suggests that the site's contractor has sped up construction to account for the delay. The slight setback from the typhoon was the second one for the facility in 2025. It followed an accident in May when a construction worker was hit by a switchboard and died of the injuries. Taiwan's safety authorities took note of the incident and, after the investigation, allowed TSMC to resume construction activities at the site on the 3rd. TSMC's CEO C.C. Wei has previously asserted that he will personally apologize for any safety incidents at the firm's sites. Wei commented that TSMC was aware of its social responsibility and was not in the semiconductor business simply to make money. The site being built in Chiayi will be responsible for packaging chips in the aftermath of significant semiconductor demand due to AI applications. While TSMC has adequate capacity for manufacturing advanced chips, high-power AI applications also require chip dies to be packaged together. Due to increased demand, the Taiwanese firm has expanded its chip packaging facility with the packaging machines at Chiayi, which is expected to manufacture fully packaged chips for NVIDIA and other companies.