Lantronix Unveils Five New AI-Powered System-in-Package Solutions in Collaboration with Qualcomm

Lantronix Introduces Advanced AI-Powered SiP Solutions

Lantronix Inc. (NASDAQ: LTRX), a global leader in compute and connectivity IoT solutions, has announced five new System-in-Package (SiP) solutions powered by Qualcomm Technologies' chipsets. This development reinforces Lantronix's position in industrial and enterprise IoT innovation, bringing advanced Artificial Intelligence (AI) and Machine Learning (ML) capabilities to edge computing 1

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Strategic Collaboration with Qualcomm

The announcement builds on a 15-year relationship between Lantronix and Qualcomm Technologies. Dev Singh, vice president of Business Development and head of Industrial Automation at Qualcomm Technologies Inc., highlighted the significance of this collaboration, stating that Lantronix's expertise in embedded computing and IoT enables customers to seamlessly deploy AI solutions at the edge using Qualcomm's cutting-edge processors 1

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Key Features of the New SiP Solutions

The five new SiP families are designed to accelerate the development of AI-driven applications in various industrial and enterprise use cases, including:

1. Robotics
2. Industrial automation
3. Video surveillance
4. Video collaboration
5. Drones

These modules are compliant with the Trade Agreements Act (TAA) and the National Defense Authorization Act (NDAA), ensuring their suitability for government and defense applications 1

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AI Capabilities and Performance

Lantronix has integrated AI capabilities from the Qualcomm AI Hub into its new SiP solutions. This integration provides access to over 100 AI models and a simplified model optimization process, enabling efficient utilization of AI capabilities ranging from 3.to 100 INT-8 TOPS (Tera Operations Per Second) 1

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Specific SiP Families and Their Applications

1. IQ9 Series SiPs (9100IQ and 9075IQ)

   • Powered by Qualcomm IQ-9100 and IQ-9075 processors
   • Suitable for industrial and robotics applications
   • Features include robust safety functions, fault tolerance, and support for up to 16 concurrent cameras 1

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2. Open-Q 8550CS

   • Powered by Qualcomm QSC8550 processor
   • Ideal for advanced video and AI applications
   • Offers high AI performance, power efficiency, and advanced Wi-Fi 7 and Bluetooth 5 connectivity 1

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3. Open-Q 6490CS and 5430CS

   • Powered by Qualcomm QCS6490 and QCS5430 processors
   • Designed for scalable AI solutions
   • Provides low-power AI performance, Wi-Fi 6E, and BLE 5+ connectivity 1

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Impact on IoT and Edge Computing

Mathi Gurusamy, chief strategy officer for Lantronix, emphasized that these new SiP solutions continue the company's strategic collaboration with Qualcomm Technologies. This partnership has enabled Lantronix to build a proven track record of delivering integrated, collaborative solutions that drive forward IoT and AI/ML technologies to meet the evolving needs of today's advanced-edge applications 1

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Future Outlook

The introduction of these new SiP solutions positions Lantronix at the forefront of the rapidly evolving IoT and edge computing landscape. By combining leading-edge performance with cost efficiency, these solutions are expected to play a crucial role in advancing AI-driven applications across various industries, potentially reshaping the future of industrial automation, robotics, and smart surveillance systems 1

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