NVIDIA's Next-Generation Rubin AI GPUs Enter Production with HBM4 Memory Samples

Reviewed byNidhi Govil

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NVIDIA's next-generation Rubin AI GPUs have entered production ahead of schedule, with the company securing HBM4 memory samples from all major DRAM manufacturers. The development comes as TSMC increases 3nm production capacity by 50% to meet growing demand.

Accelerated Production Timeline

NVIDIA's next-generation Rubin AI GPUs have entered production in a remarkably compressed timeline, according to recent reports from Taiwan

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. The development comes just days after NVIDIA CEO Jensen Huang announced that the company had received its first Rubin GPU samples in their laboratories, making the transition from initial testing to production phase extraordinarily rapid.

Source: TweakTown

Source: TweakTown

During Huang's recent visit to Taiwan, where he held extensive discussions with TSMC executives, he confirmed that "we have already seen Rubin on the production line"

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. This accelerated timeline demonstrates NVIDIA's aggressive push to maintain its dominance in the AI accelerator market as demand continues to surge across multiple sectors.

Advanced Memory Technology Integration

A critical component of the Rubin GPU development involves next-generation memory technology. NVIDIA has successfully secured HBM4 memory samples from all major DRAM manufacturers, ensuring a diversified supply chain for the advanced memory modules

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. Each Rubin GPU features eight HBM4 memory sites and incorporates dual Reticle-sized GPU dies, representing a significant architectural advancement over current generation products.

The strategic approach of sourcing from multiple DRAM suppliers reflects lessons learned from recent memory shortages that have impacted the semiconductor industry. This diversification strategy aims to prevent supply bottlenecks that could potentially delay the rollout of Rubin-based systems.

Manufacturing Capacity Expansion

To accommodate the unprecedented demand for AI chips, TSMC has increased its 3nm production capacity by 50%

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. TSMC President C.C. Wei acknowledged that NVIDIA is requesting substantial quantities of wafers and chips, though he declined to specify exact numbers, calling the information "secret"

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This capacity expansion supports not only Rubin production but also the continued strong demand for NVIDIA's current Blackwell and Blackwell Ultra GPUs. Huang emphasized that the demand extends beyond just GPUs, noting that "NVIDIA is also manufacturing CPUs, network chips, switches, and many other chips related to Blackwell"

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Future Product Roadmap

NVIDIA has outlined an ambitious roadmap for Rubin-based systems. The Vera Rubin NVL144 AI server platform is scheduled to debut in 2026, featuring 144 GPUs and 13TB of HBM4 memory with 75TB of fast memory - representing a 60% increase over the current GB300 NVL72 system

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The even more powerful Rubin Ultra NVL576 system, planned for 2027, will scale up to 576 GPUs with upgraded Rubin Ultra chips featuring four Reticle-sized dies each. This system will include a massive 4.6 petabytes of HBM4 memory and deliver 15 Exaflops of FP4 inference power, representing a 14x increase over current generation systems

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