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Samsung readying mass production of next-gen HBM4 memory in 2026, 24Gb GDDR7 dies, 128GB+ DDR5
TL;DR: Samsung will begin mass production of next-gen 1c DRAM-based HBM4 memory, 24Gb GDDR7 dies, and 128GB+ DDR5 products in 2026, targeting AI and server markets. The company reported record Q3 2025 memory sales driven by strong AI demand and plans to expand 2nm GAA chip production and fab capacity. Samsung has just announced it will begin mass production of its new 1c DRAM-based next-gen HBM4 memory, as well as new 24Gb GDDR7 memory dies, and 128GB+ DDR5 products in 2026. The company announced its recent Q3 2025 earnings, with a 15.4% increase in revenue over Q2 2025, with a new all-time high in quarterly sales from its Memory business, thanks to strong demand for HBM3E memory and server SSDs in the continuing wave of AI demand. Samsung recently showed off its new HBM4 memory, offering up to 11Gbps bandwidth per IC, and should be featured inside of the next-generation of AI hardware from NVIDIA and AMD in the upcoming Rubin and Instinct MI400 series AI GPUs. Samsung is aiming to have a stable supply of its next-gen 2nm GAA (Gate-All-Around) production, and the new HBM4 base die, in 2026. Samsung should be testing out its run of 2nm GAA chips through its semiconductor foundry ahead of fabbing next-gen Exynos SoCs and Qualcomm's next-gen Snapdragon processors, with 2nm GAA ramping production this quarter. Samsung explains in the press release: "In Q4 2025, the Business will actively respond to demand from AI and conventional servers with HBM3E, high-density eSSDs and other leading-edge memory offerings. Additionally, it will continue to expand sales of industry-leading, high-value-added server memory products, such as 128GB and higher DDR5, as well as 24Gb GDDR7". "Going forward in 2026, the Memory Business will focus on the mass production of HBM4 products with differentiated performance, while simultaneously aiming to scale out the HBM sales base. In particular, demand for HBM4 is also projected to increase, and the Company plans to proactively respond with capacity expansion in 1c. It will also concentrate on expanding sales of other high-value-added products, such as DDR5, LPDDR5x and high-density QLC SSDs to meet demand for AI applications". "In Q4 2025, the Business will aim for continued earnings improvement by ramping up mass production of 2nm Gate-All-Around (GAA) products, increasing fab utilization, and optimizing costs. In 2026, the Foundry Business will focus on providing a stable supply of new 2nm GAA products and the HBM4 base-die, and beginning operations at the Company's fab in Taylor, Texas in a timely manner".
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Samsuing Preps For Mass Production On Next-Gen HBM4 Memory in 2026: 24Gb GDDR7, And 128GB+ DDR5 Products In The Plans Too
Samsung is also set to begin production of next-gen HBM4 memory, 24 Gb GDDR7 DRAM & 128 GB+ products in 2026. Samsung has announced its Q3 2025 earnings report, highlighting a 15.4% increase in revenue versus the previous quarter. The South Korean technology company posted a revenue of KRW 86.1 trillion, and also set an all-time high from quarterly sales for its Memory business, mainly driven by strong demand for its HBM3E memory and server SSDs, thanks to heightened AI momentum. Just recently, Samsung showcased its next-gen HBM4 memory solution for the first time. Offering speeds of up to 11 Gbps per IC, the next-gen solution will be a potential solution for upcoming AI accelerators by NVIDIA and AMD, such as Rubin and MI400 series. Samsung is likely to have sent out samples of its HBM solutions to AI chip makers for further evaluation and qualification testing. In addition to this, Samsung is also looking to provide a stable supply of 2nm GAA (Gate-All-Around) production & the HBM4 base die in 2026. The 2nm process from Samsung is likely going to be used for the production of the next-gen Exynos SoC / Qualcomm Snapdragon SoCs and will enter ramp this quarter. In Q4 2025, the Business will actively respond to demand from AI and conventional servers with HBM3E, high-density eSSDs and other leading-edge memory offerings. Additionally, it will continue to expand sales of industry-leading, high-value-added server memory products, such as 128GB and higher DDR5, as well as 24Gb GDDR7. Going forward in 2026, the Memory Business will focus on the mass production of HBM4 products with differentiated performance, while simultaneously aiming to scale out the HBM sales base. In particular, demand for HBM4 is also projected to increase, and the Company plans to proactively respond with capacity expansion in 1c. It will also concentrate on expanding sales of other high-value-added products, such as DDR5, LPDDR5x and high-density QLC SSDs to meet demand for AI applications. In Q4 2025, the Business will aim for continued earnings improvement by ramping up mass production of 2nm Gate-All-Around (GAA) products, increasing fab utilization, and optimizing costs. In 2026, the Foundry Business will focus on providing a stable supply of new 2nm GAA products and the HBM4 base-die, and beginning operations at the Company's fab in Taylor, Texas in a timely manner. via Samsung Newsroom As for other products, Samsung also highlighted how 128GB+ DDR5 memory and 24Gb GDDR7 DRAM will play a crucial role for the company in 2026. Future server platforms from AMD and Intel are going to launch around the second half of 2026, so a lot of action is expected. Meanwhile, GDDR7 is going to retain popularity amongst high-end consumers and AI graphics cards. NVIDIA's recently announced Rubin CPX GPU is likely going to be a potential candidate for this memory, whereas other AI and gaming products, such as the NVIDIA RTX 50 "SUPER" series, and a possible AMD Radeon "RDNA 5" or "RDNA 4" refresh, are expected to utilize GDDR7. The 24Gb DRAM dies will enable more VRAM capacity, and also fill in the gaps in the entry-mainstream segments. The core issue for the DRAM and SSD market right now is that supply is currently being focused on the AI market, leading to prices for consumer-aimed products skyrocketing. DDR5 memory and SSD prices have started to see major price hikes and shortages recently, so that is something to worry about. All major DRAM makers have already announced increased prices for DDR5/DDR4 memory, so we will see how the market evolves in the coming months.
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Samsung announces plans to begin mass production of HBM4 memory, 24Gb GDDR7 dies, and 128GB+ DDR5 products in 2026, targeting AI and server markets amid record Q3 2025 memory sales driven by strong AI demand.
Samsung has unveiled ambitious plans to begin mass production of cutting-edge memory technologies in 2026, including next-generation HBM4 memory, 24Gb GDDR7 dies, and 128GB+ DDR5 products. The announcement came alongside the company's Q3 2025 earnings report, which showed a remarkable 15.4% increase in revenue compared to the previous quarter, reaching KRW 86.1 trillion
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.The South Korean technology giant achieved an all-time high in quarterly sales from its Memory business, primarily driven by strong demand for HBM3E memory and server SSDs amid the continuing wave of AI adoption across industries
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.Samsung recently showcased its next-generation HBM4 memory solution, which offers impressive speeds of up to 11 Gbps per IC. This advanced memory technology is specifically designed to meet the demanding requirements of upcoming AI accelerators from major chip manufacturers including NVIDIA and AMD
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Source: Wccftech
The HBM4 memory is expected to be featured in next-generation AI hardware, including NVIDIA's upcoming Rubin series and AMD's Instinct MI400 series AI GPUs. Samsung has likely already begun sending samples of its HBM solutions to AI chip makers for evaluation and qualification testing
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.A key component of Samsung's 2026 production strategy involves the implementation of its advanced 2nm Gate-All-Around (GAA) manufacturing process. The company aims to provide a stable supply of both 2nm GAA production and the HBM4 base die by 2026
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.Samsung plans to test its 2nm GAA chips through its semiconductor foundry operations before manufacturing next-generation Exynos SoCs and Qualcomm's upcoming Snapdragon processors. The 2nm GAA production is expected to ramp up this quarter, positioning Samsung at the forefront of advanced semiconductor manufacturing
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Beyond HBM4, Samsung's 2026 roadmap includes significant expansion in other high-value memory products. The company will focus on expanding sales of industry-leading server memory products, including 128GB and higher capacity DDR5 modules, as well as 24Gb GDDR7 memory dies
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.The 24Gb GDDR7 technology is expected to retain popularity among high-end consumer and AI graphics cards, with potential applications in NVIDIA's Rubin CPX GPU and other AI and gaming products, including possible NVIDIA RTX 50 "SUPER" series and AMD Radeon refreshes
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.The current market environment presents both opportunities and challenges for Samsung's memory business. While AI demand continues to drive record sales, the focus on AI applications has led to supply constraints and price increases for consumer-oriented products. DDR5 memory and SSD prices have experienced significant hikes and shortages recently, as major DRAM manufacturers prioritize AI market demands
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