Samsung Plans Mass Production of Next-Gen HBM4 Memory and Advanced DRAM Technologies for 2026

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Samsung announces plans to begin mass production of HBM4 memory, 24Gb GDDR7 dies, and 128GB+ DDR5 products in 2026, targeting AI and server markets amid record Q3 2025 memory sales driven by strong AI demand.

Samsung Announces Next-Generation Memory Production Timeline

Samsung has unveiled ambitious plans to begin mass production of cutting-edge memory technologies in 2026, including next-generation HBM4 memory, 24Gb GDDR7 dies, and 128GB+ DDR5 products. The announcement came alongside the company's Q3 2025 earnings report, which showed a remarkable 15.4% increase in revenue compared to the previous quarter, reaching KRW 86.1 trillion

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The South Korean technology giant achieved an all-time high in quarterly sales from its Memory business, primarily driven by strong demand for HBM3E memory and server SSDs amid the continuing wave of AI adoption across industries

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Revolutionary HBM4 Technology for AI Applications

Samsung recently showcased its next-generation HBM4 memory solution, which offers impressive speeds of up to 11 Gbps per IC. This advanced memory technology is specifically designed to meet the demanding requirements of upcoming AI accelerators from major chip manufacturers including NVIDIA and AMD

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Source: Wccftech

Source: Wccftech

The HBM4 memory is expected to be featured in next-generation AI hardware, including NVIDIA's upcoming Rubin series and AMD's Instinct MI400 series AI GPUs. Samsung has likely already begun sending samples of its HBM solutions to AI chip makers for evaluation and qualification testing

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Advanced Manufacturing with 2nm GAA Technology

A key component of Samsung's 2026 production strategy involves the implementation of its advanced 2nm Gate-All-Around (GAA) manufacturing process. The company aims to provide a stable supply of both 2nm GAA production and the HBM4 base die by 2026

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Samsung plans to test its 2nm GAA chips through its semiconductor foundry operations before manufacturing next-generation Exynos SoCs and Qualcomm's upcoming Snapdragon processors. The 2nm GAA production is expected to ramp up this quarter, positioning Samsung at the forefront of advanced semiconductor manufacturing

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Comprehensive Memory Portfolio Expansion

Beyond HBM4, Samsung's 2026 roadmap includes significant expansion in other high-value memory products. The company will focus on expanding sales of industry-leading server memory products, including 128GB and higher capacity DDR5 modules, as well as 24Gb GDDR7 memory dies

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The 24Gb GDDR7 technology is expected to retain popularity among high-end consumer and AI graphics cards, with potential applications in NVIDIA's Rubin CPX GPU and other AI and gaming products, including possible NVIDIA RTX 50 "SUPER" series and AMD Radeon refreshes

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Market Challenges and Supply Dynamics

The current market environment presents both opportunities and challenges for Samsung's memory business. While AI demand continues to drive record sales, the focus on AI applications has led to supply constraints and price increases for consumer-oriented products. DDR5 memory and SSD prices have experienced significant hikes and shortages recently, as major DRAM manufacturers prioritize AI market demands

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