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Samsung Goes Head-to-Head with SK Hynix and Micron as It Unveils HBM4 Memory to the Public for the First Time
Samsung has showcased its HBM4 memory modules to the public for the first time, indicating that the Korean giant is indeed prepared for the upcoming HBM competition. HBM4 is one of the most 'prestigious' computing essentials in the modern-day markets, mainly since the memory module will be
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Samsung, SK hynix showcase latest HBM4 chips at 2025 SEDEX - The Korea Times
Samsung Electronics and SK hynix on Wednesday showcased their latest high bandwidth memory (HBM) chips at a semiconductor exhibition in Seoul amid an expected showdown between the South Korean companies for the sixth-generation artificial intelligence (AI) chip market. At the 2025 Semiconductor
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Samsung and SK hynix showcase their latest HBM4 memory chips at the 2025 Semiconductor Exhibition (SEDEX) in Seoul, signaling an impending competition in the AI chip market. The event highlights the growing importance of high-bandwidth memory in AI acceleration.

Samsung Electronics and SK hynix, two of South Korea's leading semiconductor manufacturers, have showcased their latest high bandwidth memory (HBM) chips at the 2025 Semiconductor Exhibition (SEDEX) in Seoul
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. This event marks a significant milestone in the race for dominance in the artificial intelligence (AI) chip market, with both companies displaying their HBM4 modules to the public for the first time1
.High bandwidth memory is a crucial component in graphics processing units (GPUs) that power generative AI systems. As the demand for more sophisticated AI applications grows, the need for faster and more efficient memory solutions becomes paramount. The current market is dominated by fifth-generation HBM3E chips, but industry experts anticipate HBM4 to become a major factor in the coming year
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.Samsung, once the dominant player in the memory market, has faced challenges in recent years, particularly in the HBM segment. However, the company is making a strong comeback with its HBM4 technology. At SEDEX, Samsung demonstrated its readiness for mass production, reporting an impressive 90% yield for its HBM4 logic die
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.To ensure early adoption of its HBM4 modules, Samsung is implementing several strategies:
Currently, SK hynix leads the HBM market with a 62% share in shipments, followed by Micron Technology and Samsung
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. The company has already completed the development of its HBM4 chips and is preparing for mass production. SK hynix's strong position is partly due to its involvement in the tripartite supply chain with Nvidia and TSMC for the current HBM3E chips.Related Stories
Both Samsung and SK hynix are vying for a position in Nvidia's supply chain for its upcoming AI accelerator, codenamed Rubin. This next-generation GPU is expected to utilize HBM4 technology, making it a crucial battleground for memory manufacturers
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. While SK hynix is reportedly in talks with Nvidia for large-scale supply, Samsung has yet to receive approval but remains optimistic given its recent technological advancements1
.The intensifying competition in the HBM4 segment is expected to have significant implications for the broader DRAM market. With Samsung's rapid advancements and the unprecedented demand for high-performance memory, the industry is poised for a more competitive landscape in the coming years
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