Micron Invests $7 Billion in Singapore for Advanced HBM Packaging Facility to Meet AI Demand
Micron Technology breaks ground on a new High-Bandwidth Memory (HBM) advanced packaging facility in Singapore, investing $7 billion to meet growing AI data center demand. The facility, set to begin operations in 2026, will be the first of its kind in Singapore and is expected to create up to 3,000 jobs.