NVIDIA Rebrands Blackwell Ultra to B300 Series, Featuring Advanced HBM3E Memory and TSMC Packaging

NVIDIA's Strategic Rebranding and Technological Advancements

NVIDIA, a leader in AI and graphics processing technology, has announced a significant rebranding of its upcoming Blackwell Ultra product line to the B300 series. This move, reported by TrendForce, marks a strategic shift in NVIDIA's product segmentation and naming convention 1

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Key Rebranding Details

The rebranding affects several products in NVIDIA's lineup:

• B200 Ultra renamed to B300
• GB200 Ultra renamed to GB300
• B200A Ultra and GB200A Ultra rebranded as B300A and GB300A, respectively 1

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This new naming scheme is believed to reflect architectural changes in the B300 series, although NVIDIA has not officially stated the reason for the shift 2

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Technological Advancements

The B300 series will incorporate cutting-edge technologies:

1. HBM3E 12-Hi Memory: The new chips will utilize advanced High Bandwidth Memory (HBM) technology, with SK hynix's HBM3E 12-Hi stack memory expected to enter production between Q4 2024 and Q1 2025 1

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2. TSMC CoWoS-L Packaging: NVIDIA will employ TSMC's advanced Chip-on-Wafer-on-Substrate with Local Silicon Interconnect (CoWoS-L) packaging technology for the B300 and GB300 chips 1

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3. Memory Capacity: The B300 series is expected to offer up to 288 GB of HBM3e memory, with 144 GB packages also available. This puts NVIDIA in direct competition with AMD's upcoming MI350X GPU, which is also targeting 288 GB capacities 2

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Market Strategy and Release Timeline

NVIDIA's rebranding strategy appears to be aimed at better meeting the diverse needs of its client base:

• The B300A is specifically targeted at OEM clients, with mass production projected to begin in Q2 2025 1

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• The B300 and GB300 chips are expected to launch between Q2 and Q3 2025 1

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• The existing Blackwell portfolio (B200 and GB200) is currently shipping in small quantities, with increased production throughout Q4 2024 and Q1 2025 1

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This staggered release strategy allows NVIDIA to refine its chip segmentation, catering to both the high-performance demands of Cloud Service Providers (CSPs) and the cost-performance needs of server OEMs 1

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