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Qualcomm Debuts Dragonwing Q-2390 and IQ-2390 Processors
Qualcomm has unveiled the Dragonwing Q-2390 and IQ-2390 processors. The latest processors designed for commercial and consumer devices feature Adreno 704 GPUs. They offer quad-core Kryo CPUs and support Linux, Android, and Zephyr OS platforms. The Q-2390 chip targets Intelligent connected commercial and consumer edge devices, while the IQ-2390 is designed for real-time industrial edge AI systems. Evaluation kits for the new platforms are likely to be available early next year. Dragonwing Q-2390 and IQ-2390 Features Ahead of IFA, Qualcomm announced that the Dragonwing Q-2390 and IQ-2390 processors support applications ranging from retail and smart home products to smart displays and enterprise edge devices. Both processors feature a quad-core Qualcomm Kryo CPU and a Qualcomm Adreno 704 GPU. They include a real-time RISC-V MCU. Qualcomm claims these new platforms help OEMs and developers build smarter connected devices while reducing design complexity, lowering system cost, and accelerating time-to-market. The platforms support Linux, Android, and Zephyr OS. Dragonwing Q-2390 is designed for edge-intelligent commercial, enterprise and consumer products that require advanced capabilities within tight cost, power and size constraints. It combines application processing, on-device AI, camera and display support, LTE Cat 4 and GPS location capabilities, wired and wireless connectivity options, security and I/O capabilities into a single platform. It targets products like retail point-of-sale systems, kiosks, access control devices, smart appliances, smart agriculture, home robots, fitness equipment and enterprise terminals. The Dragonwing IQ-2390 integrates a Qualcomm Hexagon NPU. The processor supports dual-channel LPDDR4x memory. It has a Qualcomm Adreno 921 Display Processing Unit (DPU) and supports video playback and encoding up to 1080p at 30 fps. It has two Qualcomm Spectra ISPs. For wireless connectivity, it has Qualcomm Wi-Fi 5 and Bluetooth 5.0 and 5.1. The Dragonwing IQ-2390 is the first processor in Qualcomm's IQ2 Series, and it is designed for industrial environments. This processor combines application processing, machine vision, AI acceleration, and dual Gigabit Ethernet with Time-Sensitive Networking (TSN). The company says it can enable HMIs, PLCs, gateways, and energy-management systems. It has an operating range of -30°C to +115°C. Qualcomm confirmed that the Dragonwing Q-2390 and IQ-2390 SOMs will be showcased at IFA 2026, and customer participation is currently underway through an early access program. Evaluation kits for both platforms are expected in early 2027.
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Qualcomm Dragonwing Q-2390 and IQ-2390 processors with Edge AI, LTE Cat 4, TSN announced
Qualcomm Technologies has announced the Dragonwing Q-2390 and IQ-2390 processors ahead of IFA 2026. The Dragonwing Q-2390 is designed for consumer, commercial and enterprise IoT products, while the Dragonwing IQ-2390 is the first processor in the company's new IQ2 Series for industrial edge applications. Qualcomm Dragonwing Q-2390 The Dragonwing Q-2390 is designed for commercial, enterprise and consumer products that require edge computing within cost, power and size constraints. It integrates the following capabilities into a single platform: * Application compute * On-device AI * Camera and display support * LTE Cat 4 * GPS location capabilities * Wired and wireless connectivity options * Security * Extensive I/O capabilities The Q-2390 is designed for applications including: * Retail point-of-sale systems * Kiosks * Access control devices * Smart appliances * Smart agriculture * Home robots * Fitness equipment * Enterprise terminals The integrated platform is intended to reduce system complexity and development costs for device makers. Qualcomm Dragonwing IQ-2390 The Dragonwing IQ-2390 is the first processor in the new IQ2 Series, a family of industrial edge AI processors designed for a broader range of industrial and compute applications. The IQ2 Series complements Qualcomm's Dragonwing IQ10, IQX, IQ9, IQ8 and IQ6 Series portfolios. The IQ-2390 is designed for compact edge systems requiring reliable operation, real-time responsiveness and long product lifecycles. It is intended for applications across: * Industrial automation * Oil and gas * Utilities * Energy The processor combines application processing, machine vision and AI acceleration with dual Gigabit Ethernet and Time-Sensitive Networking (TSN). It is designed for systems such as: * Human-machine interfaces (HMIs) * Programmable logic controllers (PLCs) * Gateways * Industrial vision systems * Building automation platforms * Energy management solutions The IQ-2390 supports operation across an extended temperature range of -30°C to +115°C and includes features intended for environments subject to vibration and shock. It is designed for industrial deployments in factories, energy infrastructure and outdoor industrial environments. Its architecture is intended to simplify the deployment of AI-enabled industrial systems while reducing bill of materials, board space and integration complexity. The processor is provided in a ruggedized package for demanding industrial applications. Hardware and software Both processors feature the same core hardware and operating system support: * Quad-core Qualcomm Kryo CPU * Qualcomm Adreno 704 GPU * Real-time RISC-V MCU * Linux support * Android support * Zephyr OS support The platforms are designed to reduce design complexity and system cost while enabling OEMs and developers to build connected devices across different IoT segments. Quick Specifications: Dragonwing Q-2390 / Dragonwing IQ-2390 Availability The Dragonwing Q-2390 and IQ-2390 System-on-Modules (SOMs) are being showcased on-site at IFA 2026. Customer engagement is already underway through an early access program, while evaluation kits for both platforms are expected to be available in early 2027. Speaking on the launch, Jeff Arnold, VP & GM, Auto Telematics & Industrial & Embedded IoT Consumer and Connectivity, Qualcomm Technologies, Inc., said: AI is creating a fundamental shift in how connected devices are designed and deployed, but many product categories still face barriers around cost, complexity and integration. With the Dragonwing Q-2390 and IQ-2390 processors, we're enabling intelligence to scale across a much broader range of devices, from retail systems, smart appliances and consumer robots to industrial controllers, machine vision systems and critical infrastructure. Together, these platforms help bring advanced edge AI within reach of more customers and more industries than ever before.
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Qualcomm Technologies announced the Dragonwing Q-2390 and IQ-2390 processors ahead of IFA 2026. The Q-2390 targets consumer, commercial, and enterprise IoT devices while the IQ-2390 marks the debut of Qualcomm's new IQ2 Series for industrial edge AI systems with extended temperature range support.
Qualcomm Technologies has announced the Dragonwing Q-2390 and IQ-2390 processors ahead of IFA 2026, targeting two distinct markets with Edge AI capabilities. The Q-2390 and IQ-2390 processors address a fundamental challenge in connected device development: bringing advanced intelligence to cost-sensitive, space-constrained applications across consumer, commercial, and enterprise IoT devices.
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Jeff Arnold, VP & GM, Auto Telematics & Industrial & Embedded IoT Consumer and Connectivity at Qualcomm Technologies, emphasized the significance: "AI is creating a fundamental shift in how connected devices are designed and deployed, but many product categories still face barriers around cost, complexity and integration."
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The Dragonwing Q-2390 consolidates application processing, on-device AI capabilities, camera and display support, LTE Cat 4, GPS location capabilities, wired and wireless connectivity options, security, and extensive I/O capabilities into a single platform.
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This integration targets retail point-of-sale systems, kiosks, access control devices, smart appliances, smart agriculture, home robots, fitness equipment, and enterprise terminals.2
Both processors feature a quad-core Kryo CPU and Qualcomm Adreno 704 GPU, along with a real-time RISC-V MCU. The platforms support Linux, Android, and Zephyr OS, providing flexibility for developers across different deployment scenarios.
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The Dragonwing IQ-2390 represents the first processor in Qualcomm's new IQ2 Series, designed specifically for industrial edge AI systems. This processor integrates a Qualcomm Hexagon NPU and supports dual-channel LPDDR4x memory. It includes a Qualcomm Adreno 921 DPU and supports video playback and encoding up to 1080p at 30 fps with two Qualcomm Spectra ISPs.
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The IQ-2390 combines application processing, machine vision, AI acceleration, and dual Gigabit Ethernet with Time-Sensitive Networking. This configuration enables deployment in human-machine interfaces, programmable logic controllers, gateways, and energy-management systems.
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For wireless connectivity, it includes Qualcomm Wi-Fi 5 and Bluetooth 5.0 and 5.1.1
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Source: Gadgets 360
The IQ-2390 operates across an extended temperature range of -30°C to +115°C, addressing industrial automation requirements in factories, energy infrastructure, and outdoor industrial environments.
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The processor comes in a ruggedized package designed for environments subject to vibration and shock, targeting applications across oil and gas, utilities, and energy sectors.2
The IQ2 Series complements Qualcomm's existing Dragonwing IQ10, IQX, IQ9, IQ8, and IQ6 Series portfolios, expanding the company's reach into broader industrial and compute applications requiring reliable operation, real-time responsiveness, and long product lifecycles.
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Qualcomm claims these platforms help OEMs and developers build smarter connected devices while reducing design complexity, lowering system cost, and accelerating time-to-market.
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The integrated approach simplifies deployment of AI-enabled industrial systems while reducing bill of materials, board space, and integration complexity.2
The Dragonwing Q-2390 and IQ-2390 System-on-Modules are being showcased at IFA 2026. Customer engagement is underway through an early access program, with evaluation kits for both platforms expected in early 2027.
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