Qualcomm Dragonwing Q-2390 and IQ-2390 Bring Edge AI to Consumer and Industrial Devices

Qualcomm Dragonwing Expands Edge AI Accessibility

Qualcomm Technologies has announced the Dragonwing Q-2390 and IQ-2390 processors ahead of IFA 2026, targeting two distinct markets with Edge AI capabilities. The Q-2390 and IQ-2390 processors address a fundamental challenge in connected device development: bringing advanced intelligence to cost-sensitive, space-constrained applications across consumer, commercial, and enterprise IoT devices.1

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Jeff Arnold, VP & GM, Auto Telematics & Industrial & Embedded IoT Consumer and Connectivity at Qualcomm Technologies, emphasized the significance: "AI is creating a fundamental shift in how connected devices are designed and deployed, but many product categories still face barriers around cost, complexity and integration."2

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Q-2390 Powers Intelligent Connected Edge Devices

The Dragonwing Q-2390 consolidates application processing, on-device AI capabilities, camera and display support, LTE Cat 4, GPS location capabilities, wired and wireless connectivity options, security, and extensive I/O capabilities into a single platform.1

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This integration targets retail point-of-sale systems, kiosks, access control devices, smart appliances, smart agriculture, home robots, fitness equipment, and enterprise terminals.2

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Both processors feature a quad-core Kryo CPU and Qualcomm Adreno 704 GPU, along with a real-time RISC-V MCU. The platforms support Linux, Android, and Zephyr OS, providing flexibility for developers across different deployment scenarios.1

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IQ-2390 Introduces Industrial Edge AI Systems

The Dragonwing IQ-2390 represents the first processor in Qualcomm's new IQ2 Series, designed specifically for industrial edge AI systems. This processor integrates a Qualcomm Hexagon NPU and supports dual-channel LPDDR4x memory. It includes a Qualcomm Adreno 921 DPU and supports video playback and encoding up to 1080p at 30 fps with two Qualcomm Spectra ISPs.1

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The IQ-2390 combines application processing, machine vision, AI acceleration, and dual Gigabit Ethernet with Time-Sensitive Networking. This configuration enables deployment in human-machine interfaces, programmable logic controllers, gateways, and energy-management systems.1

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For wireless connectivity, it includes Qualcomm Wi-Fi 5 and Bluetooth 5.0 and 5.1.1

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Industrial Automation Gets Ruggedized Performance

The IQ-2390 operates across an extended temperature range of -30°C to +115°C, addressing industrial automation requirements in factories, energy infrastructure, and outdoor industrial environments.1

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The processor comes in a ruggedized package designed for environments subject to vibration and shock, targeting applications across oil and gas, utilities, and energy sectors.2

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The IQ2 Series complements Qualcomm's existing Dragonwing IQ10, IQX, IQ9, IQ8, and IQ6 Series portfolios, expanding the company's reach into broader industrial and compute applications requiring reliable operation, real-time responsiveness, and long product lifecycles.2

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System-on-Modules Enable Faster Development

Qualcomm claims these platforms help OEMs and developers build smarter connected devices while reducing design complexity, lowering system cost, and accelerating time-to-market.1

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The integrated approach simplifies deployment of AI-enabled industrial systems while reducing bill of materials, board space, and integration complexity.2

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The Dragonwing Q-2390 and IQ-2390 System-on-Modules are being showcased at IFA 2026. Customer engagement is underway through an early access program, with evaluation kits for both platforms expected in early 2027.1

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