SK Hynix Ships Next-Generation HBM4E Memory Samples as AI Chip Demand Accelerates Competition

Nvidia supplier SK Hynix ships samples of next-generation chips to major customers

The next-generation 12-layer HBM4E chip reaches ⁠speeds of up to 16 gigabits per second ⁠per pin and offers over 20% better power efficiency than previous models, the company said. SK Hynix said on Thursday it has shipped samples of its latest high-bandwidth memory (HBM) chips to major customers, ⁠as ⁠the South Korean chipmaker seeks to strengthen its position in the fast-growing AI semiconductor market. The next-generation 12-layer HBM4E chip reaches ⁠speeds of up to 16 gigabits per second ⁠per pin and offers over 20% better power efficiency than previous models, the company said. HBM chips are used in AI chipsets and are crucial components for processors such as those made by ⁠Nvidia, helping handle vast data needed to train AI models. SK Hynix is Nvidia's main HBM supplier, as rivals Samsung and Micron compete. (Reporting by Joyce LeeEditing by Ed Davies)

SK Hynix Samples HBM4E With 48 GB Capacity and 16 Gbps as AI Chip Demand Forces DRAM Makers Into Overdrive

SK Hynix has commenced sampling of its next-gen HBM4E memory, offering up to 16 Gbps speeds and 48 GB capacities. SK Hynix Races Samsung In Sampling First HBM4E DRAM Modules For Next-Gen AI Solutions The acceleration in AI has pushed DRAM manufacturers to dial up their development plans. As such, SK Hynix is racing its rival Samsung to deliver the first HBM4E memory solutions to partners who will be using it to power their next-generation datacenters. The HBM4E memory will play a crucial role for next-gen datacenters as it will power some heavy-weight chips, NVIDIA Rubin Ultra, and AMD Instinct MI500. These two chip platforms are poised to generate lots of revenue in the AI segment, and DRAM makers are backing them up in a big way. The sampling from SK Hynix begins just a few weeks after Computex 2026, where the company previewed the same HBM4E memory, featuring up to 48 GB capacities, and speeds of up to 16 Gbps. Samsung was also at the showfloor previewing its own HBM4E and HBM5 technologies with HPB (Heat Path Block). Press Release: SK hynix announced today that it has shipped samples of HBM4E, a next-generation DRAM for AI, to major customers. "The company was able to deliver samples of the 12-stack HBM4E on schedule thanks to its advanced HBM development and production expertise for HBM," said SK hynix, adding that "We will work closely with partners for mass production in a timely manner." The 12-layer HBM4E shows improvements in both performance and power efficiency. The product features a maximum data processing speed of 16Gbps per pin and power efficiency that is up more than 20 percent from previous models. These enhancements improve data processing capabilities for AI training and inference. The HBM4E reduces data transfer latency through its latest interface and design optimization while maintaining stable operation in high-bandwidth environments. This enables customers to increase efficiency in processing data for AI datacenters and large-scale computing systems. SK hynix utilizes Advanced MR-MUF technology for HBM4E products to achieve a 48GB capacity in a 12-layer stack while ensuring structural stability. In particular, the company has also improved heat resistance by 17 percent, compared to the preceding HBM4, enabling stable operation of memory chips in high-performance computing environments. SK hynix has successfully supplied optimized memory solutions to customers based on its expertise in the mass production and supply of HBM3, HBM3E, and HBM4. Leveraging its market-proven product reliability and supply capabilities, the company will support the development of next-generation infrastructure while helping address AI system bottlenecks Follow Wccftech on Google to get more of our news coverage in your feeds.

Nvidia Supplier SK Hynix Ships Next-Generation HBM Memory Samples To Major Customers - Micron Technology

SK Hynix Unveils Advanced HBM4E Memory For AI Workloads In a statement, the South Korean memory giant said that it has started supplying samples of its next-generation 12-layer HBM4E chips for customer evaluation. The new memory delivers transfer speeds of up to 16 gigabits per second per pin and offers more than 20% better power efficiency compared with previous-generation products. HBM is a critical component in AI accelerators and graphics processors because it enables faster movement of massive datasets required to train and run advanced AI models. The technology is widely used alongside AI chips produced by Nvidia. AI Memory Race Intensifies As Rivals Chase Market Leader SK Hynix is currently Nvidia's primary supplier of HBM products, giving it a significant advantage in the booming AI infrastructure market. Record Financial Results Highlight AI-Driven Growth The company's latest product milestone follows a blockbuster first quarter reported in April. SK Hynix posted record revenue of 52.58 trillion won, or approximately $35.6 billion, surpassing the 50 trillion won mark for the first time. Revenue increased 198% from a year earlier and 60% from the previous quarter. Operating profit reached a record 37.6 trillion won, or about $25.4 billion, nearly doubling from the fourth quarter of 2025 and rising fivefold year over year. The company reported an operating margin of 72%, underscoring the profitability of the ongoing AI spending boom. Price Action: At the time of writing, SK Hynix stock was trading 5.79% higher at KRW 2,667,000 (about $1,754) in Seoul, gaining KRW 146,000 during Thursday's session. Disclaimer: This content was partially produced with the help of AI tools and was reviewed and published by Benzinga editors. Photo Courtesy: JHVEPhoto on Shutterstock.com Market News and Data brought to you by Benzinga APIs To add Benzinga News as your preferred source on Google, click here.

SK hynix ships 12-high HBM4E samples to customers - The Korea Times

SK hynix said Thursday it has shipped samples of high-bandwidth memory 4E (HBM4E) for next-generation artificial intelligence (AI) processors to major customers. The company said it delivered 12-high HBM4E samples on schedule, and will work closely with partners for mass production "in a timely manner." HBM4E is the seventh generation of HBM, a high-performance DRAM designed for rapid data processing and used in graphics processing units (GPUs) and other AI accelerators that require massive computing power. The previous version, HBM4, is set to be used for Nvidia's Vera Rubin AI supercomputer, which will be released in the third quarter, and HBM4E is expected to be used for Vera Rubin Ultra platform next year. SK hynix said the 12-high HBM4E delivers improvements in both performance and power efficiency. The product offers a maximum data transfer speed of 16 gigabits per second (Gbps) per pin and more than 20 percent higher power efficiency compared to previous models. The HBM4E reduces data transfer latency through its latest interface and design optimization while maintaining stable operation in high-bandwidth environments, SK hynix said. While mass-producing HBM4, SK hynix has opted for a strategy focused on improving yields and ensuring stability, but experienced minor setbacks during the qualification process, including fine-tuning chip designs before full-scale shipment to meet Nvidia's stringent speed specifications. The HBM4E samples use most advanced 1c-class DRAM to deliver 16 Gbps of speed and featured the company's Advanced Mass Reflow-Molded Underfill technology, enabling 12-layer HBM4E products to achieve a capacity of 48-gigabyte while ensuring structural stability. In particular, the company said it improved heat dissipation performance by 17 percent compared to HBM4, allowing memory chips to operate more stably in high-performance computing environments. Vera Rubin Ultra is expected to use 12 HBM4E stacks per GPU, up from eight HBM4 stacks per GPU in the Vera Rubin platform. This means memory bottlenecks are expected to aggravate, and SK hynix's ability to supply the chips in a timely manner is becoming increasingly important. SK hynix said it has provided optimized memory solutions on time throughout its HBM series and will continue working with customers to address AI system bottlenecks with HBM4E. "SK hynix has laid the foundation to strengthen its AI leadership with HBM4E based on its market-leading technological capabilities and manufacturing expertise," SK hynix Chief Development Officer Ahn Hyun said. "Through close collaboration with our partners, we will deliver the value needed in the market while reinforcing our technology leadership as a full-stack AI memory creator."

SK hynix ships HBM4E memory samples to major customers By Investing.com

SEOUL, South Korea - SK hynix Inc. announced today it has delivered samples of its HBM4E memory chips to major customers, according to a press release statement. The 12-layer HBM4E features a maximum data processing speed of 16 gigabits per second per pin and power efficiency improved by more than 20% compared to previous models. The product is designed for AI training and inference applications. The company said the HBM4E reduces data transfer latency through interface and design optimization. SK hynix utilizes Advanced MR-MUF technology to achieve 48GB capacity in a 12-layer stack. The technology reduces heat resistance by 17% compared to HBM4.The memory chip advancement comes as SK hynix trades near its 52-week high, reflecting strong investor confidence in the company's AI memory solutions. As a prominent player in the Semiconductors & Semiconductor Equipment industry, the company has delivered high returns over the past year. InvestingPro subscribers have access to over 20 additional exclusive tips and comprehensive financial metrics for SK hynix. "The company was able to deliver samples of the 12-stack HBM4E on schedule thanks to its advanced HBM development and production expertise for HBM," SK hynix stated, adding it will work with partners for mass production. Ahn Hyun, President and Chief Development Officer, said the company aims to deliver value to the market through collaboration with partners. SK hynix has previously supplied HBM3, HBM3E, and HBM4 products to customers. The company's shares trade on the Korea Exchange, with Global Depository shares listed on the Luxembourg Stock Exchange. In other recent news, Nvidia has announced several partnerships with major South Korean technology companies, including SK Hynix, SK Telecom, Naver, and Doosan Group. These agreements aim to secure memory chip supplies and expand Nvidia's artificial intelligence business, although the financial terms were not disclosed. Meanwhile, SK Hynix is receiving aggressive proposals from global tech firms eager to secure memory chip supplies amid rising demand driven by artificial intelligence. These proposals reportedly include investments in dedicated memory production lines and financing for equipment purchases. Additionally, SK Hynix plans to double its wafer capacity over the next five years, as announced by Chey Tae-won, chairman of parent company SK Group. This expansion aligns with the industry's current boom in AI-driven demand. Jefferies has noted that South Korean semiconductor stocks, including SK Hynix, have risen significantly, surpassing gains from the IT bubble era. The firm suggests that there is additional upside potential for these stocks, supported by strong earnings and retail participation. This article was generated with the support of AI and reviewed by an editor. For more information see our T&C.

Nvidia supplier SK Hynix ships samples of next-generation chips to major customers

SEOUL, June 18 (Reuters) - SK Hynix said on Thursday it has shipped samples of its latest high-bandwidth memory (HBM) chips to major customers, as the South Korean chipmaker seeks to strengthen its position in the fast-growing AI semiconductor market. The next-generation 12-layer HBM4E chip reaches speeds of up to 16 gigabits per second per pin and offers over 20% better power efficiency than previous models, the company said. HBM chips are used in AI chipsets and are crucial components for processors such as those made by Nvidia, helping handle vast data needed to train AI models. SK Hynix is Nvidia's main HBM supplier, as rivals Samsung and Micron compete. (Reporting by Joyce LeeEditing by Ed Davies)