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Founded1968

Key PeopleLip-Bu Tan

HeadquartersSanta Clara, USA

ProductsXeon

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Semiconductor Revenue Hits $793 Billion as AI Chips Drive Historic 21% Growth in 2025

The global semiconductor market reached a record $793 billion in 2025, up 21% year-over-year, fueled by surging demand for AI chips. NVIDIA became the first chipmaker to exceed $100 billion in annual sales, pulling $53 billion ahead of Samsung. AI semiconductors now account for nearly one-third of total sales, with AI infrastructure spending forecast to cross $1.3 trillion in 2026.

Business2 sources

Semiconductor Revenue Hits $793 Billion as AI Chips Drive Historic 21% Growth in 2025

Business2 sources

Intel spinout Articul8 raises over half of $70M funding round at $500M valuation for enterprise AI

Articul8, an enterprise AI company spun out of Intel in 2024, has secured more than half of a planned $70 million Series B funding round at a $500 million valuation. The company has surpassed $90 million in total contract value from 29 paying customers and expects to finish the year with $57 million in annual recurring revenue, reflecting strong demand for specialized AI systems in regulated industries.

Startups3 sources

Intel spinout Articul8 raises over half of $70M funding round at $500M valuation for enterprise AI

Startups3 sources

Ugreen launches AI NAS with up to 64GB RAM and on-device intelligence for private cloud storage

Ugreen unveiled its NASync iDX Series at CES 2026, introducing AI-powered network-attached storage that processes data locally without cloud dependency. The iDX6011 and iDX6011 Pro feature Intel Core Ultra processors with up to 64GB of RAM, enabling natural language search, automatic photo organization, and voice transcription entirely on-device. With prices starting at $999 during early-bird preorders, these systems target creators and production teams seeking intelligent data management with enhanced privacy.

Technology3 sources

Ugreen launches AI NAS with up to 64GB RAM and on-device intelligence for private cloud storage

Technology3 sources

Lenovo ThinkBook Plus Gen 7 Auto Twist brings motorized screen tracking to business laptops

Lenovo is turning its concept laptop into reality with the ThinkBook Plus Gen 7 Auto Twist, launching June 2026 at $1,649. The AI laptop features a motorized hinge that automatically rotates the screen to follow users during meetings and presentations, using camera-based head tracking similar to Apple Center Stage. Beyond the novelty, it packs Intel Core Ultra Series 3 processors and qualifies as a Copilot+ PC.

Technology4 sources

Lenovo ThinkBook Plus Gen 7 Auto Twist brings motorized screen tracking to business laptops

Technology4 sources

MSI and Minisforum race to deliver powerful AI PCs in ultra-compact designs

MSI unveiled its AI Edge mini PC with 96GB unified memory and Ryzen AI Max+ 395, entering a crowded market of 30+ similar devices. Meanwhile, Minisforum beat major manufacturers to launch the first Ryzen AI 9 HX470 mini PC, and MSI also introduced a 0.5-liter Panther Lake-based system. The launches highlight intensifying competition in compact AI computing.

Technology4 sources

MSI and Minisforum race to deliver powerful AI PCs in ultra-compact designs

Technology4 sources

Mobileye acquires Mentee Robotics for $900M, pushing into humanoid robots and Physical AI

Intel subsidiary Mobileye announced a $900 million acquisition of Mentee Robotics at CES, marking its bold entry into humanoid robotics. Co-founder Amnon Shashua calls this Mobileye 3.0, combining automotive autonomy expertise with breakthrough robotics technology. The deal aims to deploy general-purpose humanoid robots in factories and fulfillment centers by 2026.

Business12 sources

Mobileye acquires Mentee Robotics for $900M, pushing into humanoid robots and Physical AI

Business12 sources

Samsung debuts Galaxy Book6 with Intel Core Ultra Series 3 and Galaxy AI at CES 2026

Samsung unveiled its Galaxy Book6 lineup at CES 2026, featuring Intel Core Ultra Series 3 processors built on 18A process technology and NVIDIA GeForce RTX 50 series GPUs. The series includes three models with enhanced cooling systems, up to 30 hours of battery life, and deeper Galaxy AI integration across Samsung's ecosystem.

Technology5 sources

Samsung debuts Galaxy Book6 with Intel Core Ultra Series 3 and Galaxy AI at CES 2026

Technology5 sources

Acer unveils refreshed AI laptops with Intel Core Ultra Series 3 chips and Copilot+ features

Acer showcased a comprehensive refreshed laptop lineup at CES 2026, spanning gaming, productivity, and mainstream segments. The Swift, Predator, Nitro, and Aspire series now feature Intel Core Ultra Series 3 Panther Lake processors with NPUs delivering over 45 AI TOPS, NVIDIA GeForce 50 Series GPUs on select models, and Microsoft Copilot+ PC certification for enhanced on-device AI tasks.

Technology7 sources

Acer unveils refreshed AI laptops with Intel Core Ultra Series 3 chips and Copilot+ features

Technology7 sources

Qualcomm Snapdragon X2 Plus chips target budget laptops with 80 TOPS NPU and multi-day battery

Qualcomm expanded its 2026 laptop lineup at CES with the Snapdragon X2 Plus, targeting mainstream and budget-friendly laptops. The new chips feature a 10-core or 6-core Oryon CPU, an 80 TOPS NPU for AI performance, and promise up to 43% better energy efficiency than previous generation processors, with laptops expected by March.

Technology15 sources

Qualcomm Snapdragon X2 Plus chips target budget laptops with 80 TOPS NPU and multi-day battery

Technology15 sources

HP's OmniBook Ultra 14 pushes AI boundaries with 85 TOPS chip and dual processor options

HP unveiled the OmniBook Ultra 14 at CES 2026, featuring an exclusive Qualcomm Snapdragon X2 Elite variant with 85 TOPS—the highest NPU performance yet. The premium ultraportable laptop also offers Intel Panther Lake options, weighing just 2.81 pounds and measuring thinner than Apple's MacBook Air. Starting at $1,549.99, this Copilot+ PC targets professionals seeking robust AI capabilities in a lightweight design.

Technology2 sources

HP's OmniBook Ultra 14 pushes AI boundaries with 85 TOPS chip and dual processor options

Technology2 sources

Intel Panther Lake debuts as first AI chip built on 2nm 18A process at CES 2026

Intel officially launched its Core Ultra Series 3 processors, codenamed Panther Lake, at CES 2026 in Las Vegas. These chips mark a significant milestone as Intel's first high-volume production using its advanced 18A process technology. The company claims up to 50% better performance than Lunar Lake while delivering enhanced power efficiency that enables laptops to achieve over 40 hours of battery life.

Technology17 sources

Intel Panther Lake debuts as first AI chip built on 2nm 18A process at CES 2026

Technology17 sources

LG Gram debuts Aerominum alloy, claims world's lightest 17-inch Nvidia RTX laptop at CES 2026

LG unveiled its 2026 Gram lineup at CES 2026, introducing Aerominum, a proprietary magnesium-aluminum alloy that makes these AI laptops exceptionally light. The LG Gram Pro 17 weighs just 3.84 pounds despite packing an Nvidia GeForce RTX 5050 GPU, while the 16-inch model features dual-AI functionality combining on-device processing with cloud power.

Technology7 sources

LG Gram debuts Aerominum alloy, claims world's lightest 17-inch Nvidia RTX laptop at CES 2026

Technology7 sources

Nvidia's $5 billion Intel investment already gains $2.5B as AI chip partnership takes shape

Nvidia completed its $5 billion investment in Intel, purchasing 214 million shares at $23.28 each. With Intel stock now trading at $36.68, Nvidia's stake has surged to $7.58 billion. The partnership will jointly develop next-generation chips for data centers and PCs, integrating Nvidia GPUs with Intel CPUs via high-speed NVLink technology.

Business3 sources

Nvidia's $5 billion Intel investment already gains $2.5B as AI chip partnership takes shape

Business3 sources

SK hynix 256 GB DDR5 module slashes Intel Xeon power consumption by 18%, saving data centers millions

SK hynix announced its 256 GB DDR5 RDIMM based on 32Gb DRAM has passed Intel's certification for Xeon 6 platform, marking an industry first. The new server memory modules deliver 18% lower power consumption and 16% better inference performance, potentially saving hyperscale data centers millions of dollars through reduced energy costs.

Technology2 sources

SK hynix 256 GB DDR5 module slashes Intel Xeon power consumption by 18%, saving data centers millions

Technology2 sources

Rapidus unveils glass interposer tech to challenge TSMC's dominance in AI chips production

Japan's state-backed chipmaker Rapidus has developed a prototype glass interposer that could cut AI chip production costs significantly. The company plans mass production by 2028, using 600mm glass substrates that yield 10 times more interposers than traditional silicon wafers. This breakthrough positions Rapidus to compete directly with TSMC as Japan invests heavily to rebuild its semiconductor industry.

Technology3 sources

Rapidus unveils glass interposer tech to challenge TSMC's dominance in AI chips production

Technology3 sources

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