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Trane Technologies and Eaton Unveil AI Data Center Reference Design
Trane Technologies announced a strategic collaboration integrating advanced thermal management and electrical system architectures to help accelerate AI-factory deployment, enhance efficiency and lower costs. Trane Technologies announced a strategic collaboration integrating advanced thermal management and electrical system architectures to help accelerate AI-factory deployment, enhance efficiency and lower costs. The new reference design is included in both the Trane Continuum Rubin DSX and Eaton Beam Rubin DSX platforms, built in alignment with the NVIDIA DSX platforms, with Eaton's technology helping provide power distribution for the Trane platform. By combining the expertise of both companies into coordinated reference designs, data center customers can help accelerate development cycles through pre-coordinated thermal and electrical power systems from grid to chip. The companies' approach breaks down traditional systems-in-silos architectures, enabling power distribution and cooling systems to exchange leading indicators, respond more dynamically to needs and enhance data center performance. "AI and high-performance computing are transforming the demands placed on data centers, and customers want solutions that can keep pace with their needs," said Mauro J. Atalla, Senior Vice President, Chief Technology and Sustainability Officer, Trane Technologies. "By combining our advanced thermal management solutions with Eaton's innovative power management solutions, we're delivering a coordinated design that helps customers accelerate deployment, improve efficiency and confidently plan to scale for the future." "We're advancing the industry standard for speed of deployment by progressing reference designs into unified systems teams can deploy repeatedly. Aligned with the NVIDIA DSX platform, we're integrating our medium-voltage power systems and white space thermal management solutions with Trane's advanced thermal management system architecture to help accelerate AI-factory deployment at scale," said Michael Regelski, Senior Vice President and Chief Technology Officer, Electrical Sector, Eaton. The Eaton and Trane Technologies reference design is built to work smoothly with the NVIDIA Omniverse DSX Blueprint for AI data centers. The combined approach establishes a more consistent, predictable method for planning and delivering electrical, thermal and digital control infrastructure required for AIādriven environments. The coordinated architecture simplifies setup, reduces risk during deployment, and improves overall performance for today's technologies. It is also designed to evolve as emerging liquid cooling technologies and direct current architectures become mainstream. "AI factories demand tightly coordinated power, cooling and compute infrastructure to operate efficiently at scale. By aligning with the NVIDIA Omniverse DSX Blueprint, Trane Technologies and Eaton are helping customers reduce complexity and accelerate deployment of next-generation AI data centers," said Vladimir Troy, Vice President of AI Infrastructure at NVIDIA. "This new integrated approach supports the robust, scalable foundations enterprises need to unlock the full potential of generative and reasoning AI and turn data into faster, smarter outcomes."
[2]
Trane Technologies and Eaton Launch Industry-First Reference Design for Efficient AI Data Centers
Trane Technologies today announced a strategic collaboration integrating advanced thermal management and electrical system architectures to help accelerate AI-factory deployment, enhance efficiency and lower costs. Trane Technologies and Eaton are introducing a first-of-its kind reference design that replaces a traditionally slow, manual and siloed design process with a unified, intelligent system for power and cooling for next-generation data centers. By advancing medium-voltage designs for higher-power density AI factories, the companies can achieve combined energy efficiency gains of up to 15%, cut copper use by as much as 80% and reduce installation costs by up to 30% compared to conventional, low-voltage designs, while enabling faster deployment and reducing complexity. As global data center capacity may almost triple by 2030, with AI driving about 70% of that growth, the reference design provides a more resource-efficient approach to scaling data center infrastructure. The new reference design is included in both the TraneĀ® Continuum Rubin DSX and Eaton Beam Rubin DSX platforms, built in alignment with the NVIDIA DSX platforms, with Eaton's technology helping provide power distribution for the Trane platform. By combining the expertise of both companies into coordinated reference designs, data center customers can help accelerate development cycles through pre-coordinated thermal and electrical power systems from grid to chip. The companies' approach breaks down traditional systems-in-silos architectures, enabling power distribution and cooling systems to exchange leading indicators, respond more dynamically to needs and enhance data center performance. "AI and high-performance computing are transforming the demands placed on data centers, and customers want solutions that can keep pace with their needs," said Mauro J. Atalla, Senior Vice President, Chief Technology and Sustainability Officer, Trane Technologies. "By combining our advanced thermal management solutions with Eaton's innovative power management solutions, we're delivering a coordinated design that helps customers accelerate deployment, improve efficiency and confidently plan to scale for the future." "We're advancing the industry standard for speed of deployment by progressing reference designs into unified systems teams can deploy repeatedly. Aligned with the NVIDIA DSX platform, we're integrating our medium-voltage power systems and white space thermal management solutions with Trane's advanced thermal management system architecture to help accelerate AI-factory deployment at scale," said Michael Regelski, Senior Vice President and Chief Technology Officer, Electrical Sector, Eaton. The Eaton and Trane Technologies reference design is built to work smoothly with the NVIDIAĀ® Omniverse⢠DSX Blueprint for AI data centers. The combined approach establishes a more consistent, predictable method for planning and delivering electrical, thermal and digital control infrastructure required for AIādriven environments. The coordinated architecture simplifies setup, reduces risk during deployment, and improves overall performance for today's technologies. It is also designed to evolve as emerging liquid cooling technologies and direct current architectures become mainstream. "AI factories demand tightly coordinated power, cooling and compute infrastructure to operate efficiently at scale. By aligning with the NVIDIA Omniverse DSX Blueprint, Trane Technologies and Eaton are helping customers reduce complexity and accelerate deployment of next-generation AI data centers," said Vladimir Troy, Vice President of AI Infrastructure at NVIDIA. "This new integrated approach supports the robust, scalable foundations enterprises need to unlock the full potential of generative and reasoning AI and turn data into faster, smarter outcomes."
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Trane Technologies and Eaton introduced an industry-first reference design that integrates thermal management and power distribution systems for AI data centers. The unified approach achieves up to 15% energy efficiency gains, reduces copper use by 80%, and cuts installation costs by 30% compared to conventional designs while accelerating deployment timelines.
Trane Technologies and Eaton announced a strategic collaboration that replaces traditional siloed design processes with an integrated system for power and cooling in next-generation AI data centers
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. This industry-first reference design addresses the mounting infrastructure challenges as global data center capacity approaches a near tripling by 2030, with AI driving approximately 70% of that growth2
.The collaboration delivers the Trane Continuum Rubin DSX and Eaton Beam Rubin DSX platforms, both built in alignment with NVIDIA DSX platforms
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. By advancing medium-voltage designs for higher-power density AI factories, the companies achieve combined energy efficiency gains of up to 15%, slash copper use by as much as 80%, and reduce installation costs by up to 30% compared to conventional low-voltage designs2
.The AI data center reference design fundamentally changes how power and cooling systems interact. Instead of operating as separate entities, the integrated architecture enables power distribution and thermal management systems to exchange leading indicators and respond dynamically to operational needs
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. This coordinated approach delivers pre-coordinated thermal and electrical power systems from grid to chip, helping customers accelerate development cycles while enhancing overall data center performance2
.Mauro J. Atalla, Senior Vice President, Chief Technology and Sustainability Officer at Trane Technologies, emphasized the transformation: "AI and high-performance computing are transforming the demands placed on data centers, and customers want solutions that can keep pace with their needs. By combining our advanced thermal management solutions with Eaton's innovative power management solutions, we're delivering a coordinated design that helps customers accelerate deployment, improve efficiency and confidently plan to scale for the future"
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.The reference design works seamlessly with the NVIDIA Omniverse DSX Blueprint for AI data centers, establishing a consistent method for planning and delivering electrical, thermal, and digital control infrastructure required for AI-driven environments
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. Vladimir Troy, Vice President of AI Infrastructure at NVIDIA, noted that "AI factories demand tightly coordinated power, cooling and compute infrastructure to operate efficiently at scale"1
.Michael Regelski, Senior Vice President and Chief Technology Officer, Electrical Sector at Eaton, explained the deployment advantage: "We're advancing the industry standard for speed of deployment by progressing reference designs into unified systems teams can deploy repeatedly. Aligned with the NVIDIA DSX platform, we're integrating our medium-voltage power systems and white space thermal management solutions with Trane's advanced thermal management system architecture to help accelerate AI-factory deployment at scale"
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The coordinated architecture simplifies setup, reduces risk during AI-factory deployment, and improves overall performance for current high-performance data centers
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. Critically, the design evolves as emerging liquid cooling technologies and direct current architectures become mainstream, ensuring long-term viability for enterprises building scalable AI infrastructure2
. This approach supports the robust foundations enterprises need to unlock the full potential of generative and reasoning AI, turning data into faster, smarter outcomes while managing the resource intensity of high-performance computing workloads1
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