Schneider Electric and AMD release blueprint to fast-track AI data center builds with 246 kW racks

Schneider Electric and AMD unveil AI data center reference design By Investing.com

SAN FRANCISCO - Schneider Electric and AMD announced today a jointly developed reference design for the AMD Helios rackscale solution aimed at deploying high-density AI data center environments. The reference design supports AI racks with power densities up to 246 kW and modular AI clusters with up to 10.4 MW IT load capacity for large-scale deployments, according to a press release statement. The design is built for the Helios rackscale solution, which uses AMD Instinct MI455X GPUs, 6th Gen AMD EPYC CPUs, and AMD Pensando Vulcano NICs. The collaboration addresses four technical areas: facility power, facility cooling, IT space, and lifecycle software. The design incorporates liquid cooling using Motivair by Schneider Electric CDU-based and hybrid air/liquid approaches capable of removing up to 84% of heat. "Today organizations require comprehensive, AI-ready reference designs that can take them from planning to deployment faster and with less risk," said Manish Kumar, Executive Vice President, Secure Power & Data Centers at Schneider Electric. Forrest Norrod, executive vice president and general manager of AMD's Data Center Solutions Business Group, said the collaboration provides "a practical blueprint to accelerate high-density AI deployments, reduce integration risk and scale with greater confidence and efficiency." The design includes electrical and thermal validation using ETAP and EcoStruxure IT Design CFD simulation tools, along with integrated Electrical Digital Twin capabilities for infrastructure performance management. The companies state the design can achieve power usage effectiveness as low as approximately 1.12 at full load. The reference design has been validated to ANSI standards for U.S. deployments. The companies plan to extend the framework to support IEC standards for global implementations. This article was generated with the support of AI and reviewed by an editor. For more information see our T&C.

Schneider Electric and Amd Release First Helios Platform Reference Design to Accelerate Ai Factory Deployment

Schneider Electric S.E. and AMD announced a jointly developed and validated reference design for the AMD Helios rackscale solution that provides a scalable blueprint for deploying high-density AI environments faster and with reduced risk and complexity. The reference design marks the first milestone of the collaboration between Schneider Electric and AMD and delivers upon the companies? joint focus to create an easier path to AI Factory deployment. The new reference design is the first ever developed to support high-density AI workloads on the Helios rackscale solution, which is powered by AMD Instinct? MI455X GPUs, 6th Gen AMD EPYC? CPUs, AMD Pensando? Vulcano NICs and the open ROCm? software ecosystem. AMD Helios is designed to deliver breakthrough AI performance through advances in compute, interconnect bandwidth, memory capacity and system-level integration, allowing customers to run larger, more complex AI workloads faster while optimizing power and efficiency. As AI workloads push data center infrastructure to unprecedented limits, reference designs provide data center architects and operators with tested, scalable designs proven to handle new power densities, thermal requirements and operational complexity. By modeling data center physical infrastructure performance, these pre-validated blueprints help shorten the planning process by defining how power, cooling, and IT infrastructure should be organized to build a reliable, scalable, and AI-ready data center. The AMD Helios reference design includes information on four technical areas: facility power, facility cooling, IT space, and lifecycle software. The new collaboration brings together AMD AI platform innovation and Schneider Electric?s expertise in power, cooling, and digital infrastructure, creating a more tightly integrated approach to deploying both greenfield AI factories and high-density retrofit environments. The reference design supports: Modular, multi-cluster environments, featuring AI clusters of up to 10.4 MW IT capacity for greenfield deployments High-density AI workloads up to 246 kW per rack Advanced liquid cooling using Motivair by Schneider Electric CDU-based and hybrid air/liquid approaches capable of removing up to 84% of heat A digital-first infrastructure approach, which includes: Electrical and thermal design validated using ETAP and EcoStruxure? IT Design CFD simulation tools that enable real-time monitoring and analytics, AI-driven predictive maintenance, and system-level optimization across power, cooling, and IT Integrated Electrical Digital Twin capabilities to model, analyze, and manage infrastructure performance Support from AVEVA?s Unified Operations Center for real-time monitoring and operational visibility Power and cooling infrastructure deployments that adhere to AMD Helios platform requirements for reduced integration complexity and deployment risk Better energy efficiency, with ability to achieve PUE as low as ~1.12 at full load.