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Taiwan's second-largest chipmaker starts mass production in Singapore; Citi sees improving outlook
Taiwan's second-largest contract chipmaker, United Microelectronics Corporation (UMC), announced Tuesday its first mass-produced silicon photonics wafers manufactured within its Singapore facility. UMC is aiming to address the growing demand for high-speed optical interconnects in AI and
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Silith Technology Pte. Ltd and United Microelectronics Corporation Achieve Mass Production Milestone for Silicon Photonics
Silith Technology Pte. Ltd. and United Microelectronics Corporation announced the first mass-production wafer delivery of photonic ICs from United Microelectronics Corporation?s Singapore fab, advancing the partnership between the two companies to scale next-generation silicon photonics
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United Microelectronics Corporation announced its first mass-produced silicon photonics wafers from its Singapore facility, partnering with SILITH Technology to deliver high-speed optical interconnects for AI infrastructure. Citi analysts project a 13% quarter-on-quarter sales jump for the second quarter of 2026, while UMC's June sales surged 22.85% year-on-year to $719.21 million, signaling strong momentum in the semiconductor manufacturing sector.
United Microelectronics Corporation (UMC), Taiwan's second-largest contract chipmaker, announced Tuesday the first mass production of silicon photonics wafers at UMC's Singapore fab
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. The milestone addresses surging demand for high-speed AI optical interconnects in AI and hyperscaler data centers, positioning the company to capture a growing market valued at $3.71 billion in 2026 according to Polaris Market Research1
.Collaborating with Silith Technology, a local fabless chip design company, the joint team brought the 12-inch silicon photonics platform from development to production readiness in just 18 months
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. The platform combines Silith Technology's proprietary photonics design expertise with United Microelectronics Corporation's advanced process integration capabilities and proven silicon-on-insulator (SOI) manufacturing capabilities2
.The production platform has already demonstrated production-level performance with high yield and reliability, securing qualification by a cloud infrastructure customer for volume deployment
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. This early validation signals strong market acceptance for ultra-high-speed data transmission solutions critical to next-generation AI infrastructure.United Microelectronics Corporation plans to make its own 12-inch silicon photonics platform available for customer product development by 2027
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. Building on the commercialization of Silith Technology's 200G/lane silicon photonics products, the companies are extending their roadmap to support next-generation 400G/lane optical interconnects2
. The collaboration includes development of a 400G/lane pure-silicon photonics platform leveraging high-speed silicon Mach-Zehnder Modulators (MZMs) to enable 400G/lane transmission while preserving the manufacturability, scalability, and cost advantages of a CMOS-compatible silicon platform2
.Analysts at Citi see an improving outlook for the chipmaker in the second half of the year, forecasting a 13% quarter-on-quarter sales jump in the second quarter of 2026 and a gross margin recovery
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. Supporting this optimism, UMC recently reported strong financial performance, with June sales jumping 22.85% year-on-year to NT$23.12 billion ($719.21 million), and first-half cumulative sales rising 11.28%1
. The company's stock fell nearly 5% in Taiwan during Tuesday's session before paring losses to trade 1.6% lower1
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UMC is part of a broader wave of Taiwanese tech firms expanding their manufacturing footprint in Singapore as the city-state grows into a major regional hub for the global semiconductor supply chain
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. This growing ecosystem includes King Yuan Electronics Corp and Vanguard International Semiconductor Corporation, a chipmaker backed by TSMC, which recently partnered with Netherlands-based NXP Semiconductors to build a $7.8 billion manufacturing plant in the city state1
.United Microelectronics Corporation is also collaborating with ecosystem partners to develop thin-film lithium niobate (TFLN)-based solutions for future ultra-high-bandwidth optical interconnects
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. Combined with advanced packaging technologies, these complementary silicon photonics and TFLN platforms will enable optical-engine modules supporting co-packaged optics, optical I/O, and other highly integrated architectures for next-generation AI infrastructure2
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