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Besi posts sharp rise in quarterly orders
July 23 (Reuters) - BE Semiconductor Industries (Besi) (BESI.AS), opens new tab on Thursday reported a 128.8% rise in its quarterly orders, driven by demand for data centre, photonics and AI power management applications. Besi posted orders of 292.9 million euros ($334.8 million)for the second quarter, up from 128 million euros a year earlier. ($1 = 0.8748 euros) Reporting by Ozan Ergenay in Gdansk, editing by Bartosz Dabrowski Our Standards: The Thomson Reuters Trust Principles., opens new tab
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Besi orders more than double as AI and hybrid bonding tech drive demand
Besi's quarterly orders more than doubled, fueled by AI and hybrid bonding technology. The company saw increased customer adoption of its advanced chip packaging solutions. Demand for AI applications continues to drive growth in data centers. Besi anticipates revenue growth between ten and fifteen percent. This strong performance aligns with other semiconductor sector reports. BE Semiconductor Industries (Besi) on Thursday reported quarterly orders significantly above last year's level, fuelled by strong demand for AI, hybrid bonding, photonics and data centres. Investors are betting on rising demand for Besi's hybrid bonding solutions, a chip-packaging technology that enables two chips to be directly bonded together, citing the company's first-mover advantage as AI-driven demand accelerates. The Dutch semiconductor equipment maker said its order bookings, an important indicator for future growth, more than doubled to €292.9 million ($334.8 million) in the second quarter, compared with €128 million a year ago. The number of customers using Besi's hybrid bonding technology increased to 21 in the quarter from 15 at the end of last year, as the technology gained traction in logic, memory, co-packaged optics and consumer applications and drove capacity expansions among customers, it said. "We see order momentum continuing in the third quarter due to ongoing demand strength for current and future AI applications as well as improvement in Besi's traditional mainstream end-user markets," CEO Richard Blickman said in a statement. He added customers were indicating that AI-related spending remains on a multi-year growth path, as demand for agentic AI applications fuels increased purchases of central processing units and advanced packaging equipment for data centres. Besi expects revenue to grow between 10% and 15% in the third quarter, compared with the €249.9 million reported for the April-June period. Initial earnings reports from Alphabet , ASML and TSMC also point to continued strength in the semiconductor sector, driven by booming demand for AI chips.
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Besi reports strong Q2 earnings on AI-driven chip packaging demand By Investing.com
Investing.com-- Dutch semiconductor equipment maker BE Semiconductor Industries (Besi) (AS:BESI) reported sharply higher second-quarter earnings on Thursday, driven by strong demand for artificial intelligence-related chip packaging equipment, and forecast further revenue growth in the current quarter. Besi said second-quarter net income jumped 177.3% from a year earlier to 89.0 million euros, while revenue rose 68.7% to 249.9 million euros. Get premium insights on key tech earnings with InvestingPro subscription -- now at 60% off Orders climbed 128.8% to 292.9 million euros, supported by broad-based growth led by AI computing, datacenter, photonics and hybrid bonding applications. Chief Executive Richard Blickman said demand continued to be fueled by expanded AI infrastructure spending, a modest recovery in smartphone and automotive markets, and disciplined cost management. He said AI-related systems accounted for roughly 60% of first-half orders, up from about 50% a year earlier, while customers continued investing in hybrid bonding capacity for next-generation AI devices. For the third quarter, Besi expects revenue to rise 10% to 15% from the second quarter, supported by its order backlog and continued demand for AI applications. The company forecast gross margins of 63% to 65%, compared with 65.7% in the second quarter due to a less favorable product mix, while operating expenses are expected to be flat or rise by up to 5%.
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Dutch semiconductor equipment maker Besi reported quarterly orders more than doubled to €292.9 million, driven by surging AI demand and hybrid bonding technology adoption. The company's customer base for advanced chip packaging expanded to 21 customers, with AI-related systems now accounting for 60% of first-half orders as data center infrastructure spending accelerates.
BE Semiconductor Industries (Besi), a Dutch semiconductor equipment maker, reported a sharp 128.8% rise in quarterly orders on Thursday, reaching €292.9 million ($334.8 million) for the second quarter compared to €128 million a year earlier
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. The surge reflects intensifying AI demand across data centers, photonics, and AI power management applications, positioning the company at the forefront of semiconductor equipment innovation2
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Source: ET
Besi's second-quarter net income jumped 177.3% from a year earlier to €89.0 million, while revenue rose 68.7% to €249.9 million
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. This robust performance underscores how AI-driven chip packaging demand is reshaping the semiconductor landscape, with customers accelerating investments in advanced manufacturing capabilities to meet the computing requirements of next-generation AI devices.Investors are betting heavily on Besi's hybrid bonding technology, a chip-to-chip bonding process that enables two chips to be directly bonded together without traditional intermediary layers. The number of customers using this advanced packaging solution increased to 21 in the quarter from 15 at the end of last year
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. The technology gained traction across logic, memory, co-packaged optics, and consumer applications, driving capacity expansions among customers who recognize its first-mover advantage as AI applications proliferate.
Source: Reuters
CEO Richard Blickman emphasized that customers are indicating AI-related spending remains on a multi-year growth path, as demand for agentic AI applications fuels increased purchases of central processing units and advanced packaging equipment for data centers
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. AI-related systems accounted for roughly 60% of first-half orders, up from about 50% a year earlier, while customers continued investing in hybrid bonding capacity specifically for next-generation AI devices3
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The surge in orders reflects expanded AI infrastructure spending across the industry, with data center demand serving as a primary catalyst. Blickman noted that order momentum is expected to continue in the third quarter due to ongoing demand strength for current and future AI applications, as well as improvement in Besi's traditional mainstream end-user markets
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. This demand pattern aligns with broader semiconductor sector strength, as initial earnings reports from Alphabet, ASML, and TSMC also point to continued momentum driven by booming demand for AI chips2
.For the third quarter, Besi expects revenue to grow between 10% and 15% compared with the €249.9 million reported for the April-June period
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. The company forecast gross margins of 63% to 65%, compared with 65.7% in the second quarter due to a less favorable product mix, while operating expenses are expected to remain flat or rise by up to 5%3
. This guidance suggests management remains confident in sustained demand despite some margin pressure from product mix shifts, as the company balances growth investments with disciplined cost management to capitalize on the multi-year AI buildout cycle ahead.Summarized by
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