GlobalFoundries Announces New York Advanced Packaging and Photonics Center for AI and Critical Technologies

GlobalFoundries Unveils Plans for Advanced Packaging and Photonics Center

GlobalFoundries (GF), a leading semiconductor manufacturer, has announced plans to establish a new center for advanced packaging and testing of U.S.-made essential chips within its New York manufacturing facility 1

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. This initiative, supported by investments from the State of New York and the U.S. Department of Commerce, aims to create a first-of-its-kind facility that will enable the entire semiconductor production process to be conducted onshore in the United States 2

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Meeting Growing Demand for AI and Critical Technologies

The New York Advanced Packaging and Photonics Center is designed to address the increasing demand for GF's silicon photonics and other essential chips required for critical end markets, including artificial intelligence (AI), automotive, aerospace and defense, and communications 3

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. The growth in AI is driving the adoption of silicon photonics and 3D and heterogeneously integrated (HI) chips to meet power, bandwidth, and density requirements in data centers and edge devices.

Key Offerings of the New Center

The center is expected to provide:

1. Advanced packaging, assembly, and testing for GF's differentiated silicon photonics platform.
2. Full turnkey advanced packaging, bump, assembly, and testing for aerospace and defense customers under GF's Trusted Foundry accreditation.
3. New production capabilities for advanced packaging, wafer-to-wafer bonding, assembly, and testing of 3D and HI chips using GF's 12LP+, 22FDX®, and other leading platforms 1

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Investment and Economic Impact

GF's overall investment in the New York Advanced Packaging and Photonics Center is expected to reach $575 million, with an additional $186 million allocated for research and development over the next decade 4

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. This initiative is projected to create approximately 100 new full-time GF jobs in New York over the next five years.

Government Support and Funding

The project has garnered significant support from both state and federal governments:

• New York state will provide up to $20 million in new support for the center.
• The U.S. Department of Commerce will contribute up to $75 million in direct funding.
• These investments are in addition to previously announced support, including $550 million from the New York State Green CHIPS program and funding under the federal CHIPS and Science Act 2

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Strategic Importance and Industry Impact

Dr. Thomas Caulfield, president and CEO of GF, emphasized the strategic importance of the new center, stating that it responds to customer demands for greater supply chain diversity and advanced packaging solutions 3

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. The center aims to play a vital role in the growth of New York's semiconductor manufacturing ecosystem and provide an end-to-end U.S.-based solution for chips made at GF's New York facility.

Expanding U.S. Semiconductor Capabilities

This initiative represents a significant step in expanding advanced packaging capabilities within the United States. Currently, most advanced packaging in the semiconductor industry takes place in Asia. The new center will enable GF to offer a complete onshore solution, from manufacturing to packaging and testing, enhancing the security and reliability of chip production for critical applications 1

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