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Google reportedly taps AMD to design next-generation TPU -- hybrid AI ASIC could integrate on-package CPU cores for reinforcement learning
Google has teamed up with AMD to develop one of its 10th-generation TPUs, according to a note by SemiAnalysis (via Sean). Analysts at SemiAnalysis believe Google may be interested in AMD's CPU cores for CPU-heavy workloads. If accurate, the collaboration would mark AMD's first major involvement in
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Google reportedly taps AMD for 10th-generation TPU project
Google is working with AMD on a 10th-generation Tensor Processing Unit project, according to a client note from semiconductor research firm SemiAnalysis cited by Tom's Hardware. The note said "market chatter suggests" Google is working with AMD on a TPU project in the v10 generation. Neither
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Google is reportedly collaborating with AMD to develop its 10th-generation TPU, marking AMD's first major involvement in a custom AI accelerator project. The hybrid design may integrate on-package CPU cores alongside tensor compute chiplets to handle reinforcement learning and agentic AI workloads that demand more general-purpose processing power.
Google is working with AMD on a 10th-generation TPU project, according to semiconductor research firm SemiAnalysis
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. This collaboration would mark AMD's first major involvement in a custom AI accelerator project and signals a potential shift in how Google approaches AI hardware innovation. Market chatter suggests Google is exploring a hybrid AI ASIC design that combines its proprietary Tensor Processing Unit technology with on-package CPU cores, a departure from conventional accelerator-heavy designs1
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Source: Tom's Hardware
Google has developed nine generations of TPUs with Broadcom as the primary silicon designer and maintains a long-term supply agreement running through at least 2031
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. Given Google's extensive expertise in accelerator architecture, analysts believe the company needs something only a CPU maker like AMD could provide. SemiAnalysis points to AMD's strong intellectual property portfolio, particularly in advanced packaging and CPU cores, as key attractions1
. AMD already has experience building hybrid designs through its Instinct MI300A, which packs both x86 and accelerator chiplets in a single package1
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.The reported collaboration stems from Google and its customers pushing for TPUs with on-package CPU cores specifically for reinforcement learning and agentic AI workloads
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. While conventional large language model training remains overwhelmingly accelerator-heavy, reinforcement learning for reasoning and agentic models requires considerably more general-purpose compute around accelerator operations1
. Google has already begun increasing CPU resources in its latest systems. The TPU 8i systems pair one Google Axion CPU with every two TPUs, doubling the ratio used with seventh-generation hardware that deployed one Xeon Emerald Rapid processor for every four TPUs1
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SemiAnalysis indicates that in some configurations, a 1:1 ratio of CPUs to accelerators may be optimal, suggesting the future of AI could be far more CPU-heavy than current architectures
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. Bringing CPU cores directly into the TPU package represents a logical next step, as reducing the distance between general-purpose and tensor compute chiplets can improve performance and reduce power consumption1
. A hypothetical Google design could combine Google-developed TPU compute chiplets with AMD CPU and HBM in a tightly integrated package built by AMD1
. Neither Google nor AMD has publicly commented on the collaboration, and the scope of AMD's role remains unclear2
. Watch for official announcements that could reshape expectations around AI infrastructure requirements and signal broader industry shifts toward hybrid compute architectures.Summarized by
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