Google orders over 3 million AI chips from Intel as TSMC capacity crunch forces industry shift

Reviewed byNidhi Govil

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Google has placed a massive order with Intel for more than 3 million Tensor Processing Units to be manufactured in 2028, marking a significant validation of Intel's foundry ambitions. The deal comes as TSMC's advanced packaging lines remain sold out through 2027, forcing major AI players to diversify chip suppliers and consider Intel as a credible TSMC alternative.

Google TPU Order Signals Major Win for Intel Foundry

Google has placed an order with Intel to manufacture more than 3 million of its Tensor Processing Units in 2028, according to The Information, citing four people familiar with the matter

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. The deal represents a significant commercial validation for Intel's contract manufacturing arm after months of testing Intel's advanced chip packaging technology

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. Morgan Stanley estimates Google will produce more than 6 million TPUs across 2027 and 2028 combined, suggesting the Intel Foundry relationship could scale substantially beyond the initial order

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Source: Tom's Hardware

Source: Tom's Hardware

These Google-designed AI chips power the company's model training and inference workloads, and Google now sells TPU computing access to major customers including Apple and Meta

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. The INTC stock surged 9.16% on the news, defying a broader market selloff where the S&P 500 fell 2.6% and the Nasdaq dropped 4.2%

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Source: ET

Source: ET

Nvidia Tests Intel's 18A Process for Future GPU Architecture

Nvidia is evaluating whether Intel can build a future processor that fuses four GPU dies into one unit, tied to its Feynman architecture due in 2028

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. The company is running early trials using Intel's most advanced 18A process through multiproject wafer runs, though no order has been placed yet

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. The fact that Nvidia, the world's most valuable chipmaker, is seriously testing Intel's manufacturing process rather than defaulting entirely to TSMC marks a credibility inflection point for Intel's foundry ambitions

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. D.A. Davidson analyst Gil Luria told Reuters, "Beyond the standard need to diversify, Google and Nvidia are even more motivated than usual to work with Intel. Supporting Intel supports US-based manufacturing, which is important for the relationship with the US administration"

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Source: Market Screener

Source: Market Screener

TSMC Capacity Crunch Opens Door for Intel as TSMC Alternative

TSMC's leading-edge wafer lines and its CoWoS packaging are both at capacity, with CEO C.C. Wei stating at the company's annual shareholders' meeting that "it will be a long time before we can meet customer demand"

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. The semiconductor manufacturer told the Semiconductor Industry Association that TSMC's advanced-node capacity falls "about three times short" of demand

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. Nvidia is expected to account for about 60% of global CoWoS demand this year, with Broadcom and AMD absorbing another 26% between them

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. The supply chain bottleneck has pushed major AI chip designers to diversify chip suppliers rather than wait for capacity that TSMC says will be short for years

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SK Hynix Tests Intel's EMIB Packaging for HBM Integration

SK hynix is testing whether its high-bandwidth memory works reliably with Intel's packaging technology, specifically evaluating whether Intel can run AI chip manufacturing to the standard that AI accelerators demand

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. Intel's embedded multi-die interconnect bridge, or EMIB, is the only alternative AI chip makers can realistically qualify at volume before the end of the decade, as TSMC's CoWoS is oversubscribed for more than two years

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. SK held a 57% share of HBM revenue in Q4 2025, and UBS expects it to take roughly 70% of the HBM4 supplied for Nvidia's Rubin platform this year

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Bernstein analysts estimate EMIB packaging costs a few hundred dollars per chip against $900 to $1,000 for CoWoS on a Rubin-class processor

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. Intel's EMIB-T variant adds through-silicon vias to the bridge die for vertical power delivery and is set to enter production fab rollout this year, supporting HBM3, HBM3E, HBM4, and future HBM5 stacks

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. An official validation from SK hynix would convert Intel's packaging from "tested" to "trusted" status in the industry

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