Intel lands major Google order for 3 million AI chips as Nvidia tests advanced manufacturing

Reviewed byNidhi Govil

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Intel secured a landmark order from Google to manufacture over 3 million Tensor Processing Units by 2028, while Nvidia evaluates Intel's cutting-edge 18A process for future chips. The deals signal a strategic shift as tech giants seek alternatives to TSMC's strained capacity, potentially marking a turning point for Intel's struggling foundry business.

Intel Secures Breakthrough Google TPU Order

Intel has landed a significant order from Google to manufacture more than 3 million Tensor Processing Units by 2028, marking a rare vote of confidence in the struggling American chipmaker's foundry ambitions

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. The deal comes after months of testing Intel's advanced packaging technology and represents a firm commitment rather than exploratory interest

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. Google's proprietary AI chips power model training and inference for major customers including Apple and Meta, making this production bet particularly meaningful for Intel's contract manufacturing credentials

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Source: Market Screener

Source: Market Screener

Morgan Stanley estimates that Alphabet will produce more than 6 million TPUs across 2027 and 2028 combined, suggesting the Intel foundry business relationship could scale substantially beyond the initial order

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. The Google TPU order addresses Intel's long-standing challenge of securing actual production commitments rather than goodwill gestures, providing the commercial validation its turnaround strategy desperately needed.

Nvidia Testing Intel Process as TSMC Backup

Nvidia is evaluating Intel's most advanced 18A process through early trials, including multiproject wafer runs, though no formal order has been placed yet

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. The graphics chip giant is specifically testing whether Intel can produce a processor that integrates four GPU dies into a single package, tied to its Feynman series GPU architecture planned for 2028

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. While Nvidia testing Intel's manufacturing process represents cautious interest rather than commitment, it signals that even the world's most valuable chipmaker is seriously exploring alternatives to relying entirely on TSMC.

Supply Chain Diversification Drives Strategic Shift

The driver behind both deals is scarcity and strategic risk. TSMC, the Taiwanese giant that manufactures virtually every leading-edge AI chip, is straining to keep up with demand, with the squeeze worst in advanced-packaging lines that stitch silicon and memory together

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. For companies designing the world's most sought-after AI chips, relying on a single supplier in a single country has become a strategic liability

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. SK Hynix is reportedly testing whether its high-bandwidth memory works reliably with Intel's packaging technology, further validating the supply chain diversification trend

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Intel CEO Lip-Bu Tan recently indicated that AI inference workloads were driving sharp demand surges for Intel's data center CPUs, layering additional growth momentum on top of foundry developments

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. The near-term opening for AI chip manufacturing lies in packaging rather than the most advanced chipmaking, where Intel still trails TSMC

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Market Response and Strategic Implications

Source: ET

Source: ET

INTC stock surged over 12% on Monday following the reports, defying a broader market selloff where the S&P 500 fell 2.6% and the Nasdaq dropped 4.2%

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. The counter-trend strength reflects genuine re-rating rather than sentiment, as investors priced in commercial validation that Intel's foundry strategy had been missing for years. Intel has secured several financial and industrial endorsements in recent months, including from the Trump administration, Nvidia as an equity stakeholder, and SoftBank

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. Tesla CEO Elon Musk announced in April that the EV maker plans to use Intel's next-generation 14A manufacturing process for chips at its Terafab project in Austin

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. Partnering with Intel now serves not only to diversify supply chains but also to bolster semiconductor production on US soil, an objective encouraged by American authorities

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