Nordson Electronics Solutions Revolutionizes Semiconductor Manufacturing with Advanced Panel-Level Packaging

Nordson's Breakthrough in Semiconductor Manufacturing

Nordson Electronics Solutions, a leader in electronics manufacturing technologies, has developed a groundbreaking solution for panel-level packaging (PLP) in semiconductor manufacturing. This innovation, created in collaboration with Powertech Technology, Inc. (PTI), one of the world's top Outsourced Semiconductor Assembly and Test (OSAT) companies, has achieved underfill yields exceeding 99% 1

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The Technology Behind the Innovation

The heart of this advancement lies in Nordson's ASYMTEK Vantage® Series fluid dispensing system, equipped with the ASYMTEK IntelliJet® Jetting system. This precision technology has demonstrated remarkable capabilities:

1. Achieving high-quality, void-free underfill results at scale
2. Mitigating warpage and optimizing fluid flow
3. Decreasing cycle time by almost 30%

These improvements are crucial as the semiconductor industry transitions from 300-mm wafers to panels, managing the complexity of larger die sizes and higher-density designs while maintaining manufacturability and cost efficiency 2

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Meeting Industry Demands

PTI is leveraging this PLP technology to meet the semiconductor industry's growing demands, particularly in:

1. Artificial Intelligence (AI)
2. High-Performance Computing (HPC)
3. Chiplet-based architectures

The importance of underfilling in semiconductor packaging has grown significantly since the adoption of flip-chips in the 1990s. As applications become more demanding, especially in high-performance CPUs, GPUs, and advanced architectures like 2.5D/3D ICs, underfilling plays a crucial role in enhancing mechanical reliability and thermal performance 1

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Collaborative Effort and Support

The success of this project was bolstered by Nordson's distributor, Jetinn Global Equipment Ltd., which invested in demonstration equipment and provided expert technical support. This collaborative approach has been instrumental in bringing this innovative solution to fruition 2

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Nordson's Role in the Electronics Industry

Nordson Electronics Solutions, through its ASYMTEK, MARCH, and SELECT brands, has been at the forefront of providing innovative solutions for the electronics manufacturing industry for over 40 years. Their expertise spans fluid dispensing, conformal coating, plasma treatment, and selective soldering solutions, crucial for protecting sensitive electronics and ensuring long-term reliability 1

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Implications for the Semiconductor Industry

This advancement in PLP technology represents a significant step forward for the semiconductor industry. As the demand for more complex and powerful chips continues to grow, driven by emerging technologies like AI and HPC, solutions that can improve yields and efficiency while managing increasing complexity will be crucial. Nordson's innovation could play a pivotal role in shaping the future of semiconductor manufacturing, enabling the production of more advanced and reliable electronic components.