onsemi Embedded Power Platform Delivers Up to 5x Power Density for AI Chips and EVs

onsemi Unveils Embedded Power Platform with Silicon Wafer Architecture

onsemi announced its Embedded Power Platform (EPP), a breakthrough semiconductor architecture that replaces traditional PCB substrates with silicon wafers to achieve 3-5x higher power density compared to current solutions1

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. The platform transforms the silicon wafer itself into the package foundation, enabling seamless integration of silicon, silicon carbide (SiC), and gallium nitride (GaN) technologies within a single wafer-level architecture4

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. This approach allows multiple devices including FETs, drivers and controllers to be embedded together in one package and co-optimized for electrical, thermal and mechanical performance3

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Hassane El-Khoury, President and CEO of onsemi, stated that "For decades, the semiconductor and the package have been treated as separate technologies. EPP changes that by making the silicon itself part of the system architecture"3

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. The technology leverages onsemi's standard 12-inch silicon wafer manufacturing capabilities, bringing key integration processes into the precision and control of the semiconductor fab4

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Power Density Solutions Target $213 Billion Market Opportunity

onsemi outlined a long-term growth strategy targeting a $213 billion market opportunity by 2030 across automotive, industrial, AI data center and emerging applications2

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. The Embedded Power Platform sits at the center of this strategy alongside the company's high-voltage portfolio and Treo platform, which provides analog, digital and high-voltage capabilities for system monitoring and control2

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El-Khoury emphasized that "As AI, electrification and automation continue to scale, power density is emerging as one of the defining engineering challenges of this decade"2

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. The platform-based model enables onsemi to deploy common technologies across multiple end markets, with high-voltage technology developed for automotive electrification also supporting industrial energy systems and AI data centers2

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Electric Vehicle Applications Gain 4x Power Density and 15% Lower Losses

For automotive electrification, the Embedded Power Platform addresses critical challenges in electric vehicle traction inverters including efficiency losses, thermal limitations, development complexity and system size1

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. EPP delivers up to 4x higher power density and 15% lower power losses compared to conventional approaches, enabling smaller, lighter and more efficient inverter designs1

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The scalable architecture supports a single inverter platform spanning low-end to high-end vehicle applications, allowing automakers to reuse a common design across multiple vehicle models and power classes1

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. This approach reduces R&D and manufacturing costs, accelerates qualification and development cycles to as little as four months, and improves vehicle range while bringing new vehicle programs to market faster1

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Subaru Partnership Marks Early Adoption for Future EVs

Subaru Corporation has been announced as one of the first early engagement partners for EPP, working with onsemi to evaluate how the platform could support future electrified vehicle architectures3

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. Through this collaboration, Subaru will gain early access to engineering samples, simulation models and technical expertise as the companies explore opportunities to improve vehicle performance, streamline development and accelerate innovation4

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. Subaru will utilize EPP for its upcoming EVs, receiving EPP engineering samples and simulation models from onsemi1

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AI Infrastructure Benefits from 50% Size Reduction and 20% Cooling Improvement

For AI infrastructure, the Embedded Power Platform addresses the growing challenge of rack power increases that force more space and cooling capacity to be dedicated to power delivery, conversion and protection systems, limiting compute capacity within racks1

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. In an early EPP-based solid-state circuit-breaker design, the solution was approximately 50% smaller and 20% cooler than existing designs1

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By reducing packaging overhead and using the full EPP footprint to conduct heat, the platform supports more compact power systems, improves thermal management and enables greater power density in AI data centers1

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. The technology will be utilized for solid-state circuit breakers in data centers, reducing product size by up to 50% and lowering temperatures by 20%1

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Technical Advantages Enable Complete Power System Co-Design

The Embedded Power Platform replaces the traditional sequential development model with a common platform that can be co-designed, co-simulated and co-optimized1

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. This enables complete power-system co-design, allowing electrical, thermal and mechanical characteristics to be evaluated and optimized together from day one4

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The shorter connections required to connect power modules to the base board result in a reduction in power losses caused by current flow and voltage fluctuations1

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. Heat dissipation represents another area where EPP leads over traditional methods due to better thermal characteristics from the use of a silicon wafer as the package substrate1

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. The result is higher power density, improved system performance, reduced development complexity and faster time-to-market4

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Strategic Rollout Targets 2026 Sampling with Key Customers

EPP is expected to begin sampling in 2026 with strategic customers and ecosystem participants across automotive and AI applications3

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. Additional partners for EPP are expected this year, with wider sampling to key customers planned for later this year1

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. The platform is designed for applications across automotive, industrial and AI data center markets, with system integration capabilities that address the increasing demands of AI chips and EVs3

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