SK hynix Showcases Advanced AI Memory Solutions at CES 2025, Including 16-layer HBM3E and 122TB SSD

SK hynix Unveils Cutting-Edge AI Memory Solutions at CES 2025

SK hynix, a leading South Korean memory manufacturer, is set to showcase its latest artificial intelligence (AI) memory solutions at the Consumer Electronics Show (CES) 2025 in Las Vegas. The company aims to highlight its technological prowess as a "Full Stack AI Memory Provider" with a range of innovative products designed to meet the growing demands of AI applications 1

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16-layer HBM3E: Pushing the Boundaries of High Bandwidth Memory

At the forefront of SK hynix's exhibition is the 16-layer High Bandwidth Memory 3E (HBM3E) chip, first announced in November 2024. This advanced memory solution offers:

• 48GB capacity per stack (3GB per individual die)
• Up to 384GB in an 8-stack configuration
• 18% boost in AI learning and 32% improvement in inference performance compared to 12-layer versions
• Advanced mass reflow-molded underfill (MR-MUF) process for enhanced thermal performance and reduced chip warping 1

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The 16-layer HBM3E represents a significant leap in memory technology, potentially enabling more powerful AI accelerators and data center applications.

High-Capacity Enterprise SSDs for AI Data Centers

Addressing the increasing storage demands of AI data centers, SK hynix will introduce new enterprise SSD solutions, including:

• The 122TB 'D5-P5336' enterprise SSD, developed by subsidiary Solidigm
• Claimed to be the highest capacity currently available in its category
• Superior power and space efficiency 1

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These high-capacity SSDs are poised to set new standards in data storage solutions for AI-driven infrastructures.

Innovations for On-Device AI and Edge Computing

SK hynix is also focusing on solutions for on-device AI in edge devices such as PCs and smartphones:

• LPCAMM23 and ZUFS 4.04: Designed to enhance data processing speed and power efficiency
• LPCAMM2 module and soldered LPDDR5/6 memory using 1cnm-node technology for laptops and handheld consoles 1

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These innovations aim to facilitate the integration of AI capabilities directly into consumer electronics, broadening the scope of AI applications in everyday devices.

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SK Hynix Accelerates HBM4 Development to Meet Nvidia's Demand, Unveils 16-Layer HBM3E

SK Hynix Begins Mass Production of Advanced 12-Layer HBM3E Memory

Next-Generation Data Center Technologies

SK hynix will showcase advanced technologies for future data center infrastructures:

• Compute Express Link (CXL) and Processing-In-Memory (PIM) technologies
• Modularized solutions like CMM-Ax and AiMX
• CXL memory module combining scalability with computational capabilities 1

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These technologies are expected to boost performance and energy efficiency in next-generation server platforms.

Future Developments and Market Position

SK hynix is not resting on its laurels, with plans for future advancements including:

• Mass production of sixth-generation HBM (HBM4) in the second half of 2025
• Development of PCIe 6.0 SSDs and high-capacity QLC eSSDs for AI servers
• UFS 5.0 for mobile devices 1

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With these developments, SK hynix aims to solidify its position as a leader in the AI memory market, addressing diverse customer needs and staying ahead of technological advancements.

As AI continues to drive transformation across industries, SK hynix's comprehensive lineup of memory solutions showcased at CES 2025 demonstrates the company's commitment to innovation and its pivotal role in shaping the future of AI technology 5

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