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3M joins coalition to standardize optical connectivity for AI By Investing.com
ST. PAUL, Minn. - 3M (NYSE:MMM) announced today it has joined a multi-source agreement with technology companies to develop open specifications for expanded beam optical connectivity in AI infrastructure. The move comes as the $74.8 billion industrial conglomerate trades near its 52-week low, down 10% year-to-date, though InvestingPro analysis suggests the stock remains undervalued at current levels. The coalition includes Accelink, Aperion, AMD, Amphenol, Arista Networks, Cisco, Meta, Molex, Nexthop-ai, Oracle, Senko, Source Photonics, Sumitomo, TE Connectivity, viaPhoton, and Xscape Photonics. The group will collaboratively develop standardized specifications for expanded beam optical connector solutions, according to a press release statement. Expanded beam optical technology provides advantages in reliability, ease of maintenance, and performance in high-density environments. The technology addresses challenges as AI data center deployments expand. "As AI workloads scale, the physical layer of data centers is being pushed to new limits -- requiring optical connectivity solutions that are not only high-performance, but also interoperable and scalable across a growing ecosystem," said Alex An, vice president of 3M's data center vertical. Oracle serves as co-chair in the formation of the expanded beam optical multi-source agreement. Rajagopal Subramaniyan, senior vice president of OCI networking at Oracle, said strict connector hygiene requirements slow network builds and add operational overhead for ongoing link triage. "Expanded beam technology can overcome these bottlenecks, enabling more resilient cluster topologies and future rack-scale optical architectures," Subramaniyan said. The multi-source agreement provides a framework for members to contribute to a shared specification covering multiple expanded beam optical connector configurations. The initial technical working group has begun development of the first connector specification. The agreement remains open to additional members across the data center and networking ecosystem. Information is available at www.ebomsa.org. In other recent news, 3M Company reported its first-quarter earnings for 2026, revealing an earnings per share (EPS) of $2.14, which exceeded analysts' expectations of $1.98. However, the company's revenue was slightly below projections, coming in at $6 billion compared to the anticipated $6.01 billion. Despite the revenue miss, the company noted strong operational improvements and strategic initiatives that contributed to its performance. Jefferies responded to the earnings beat by raising its price target for 3M from $160 to $170, while maintaining a Hold rating, highlighting that non-operating items added approximately $0.13 to the earnings surprise. RBC Capital, however, lowered its price target for 3M to $133 from $134, citing concerns over PFAS liabilities, but kept an Underperform rating. Barclays, on the other hand, reiterated its Overweight rating on the stock with a price target of $185. These developments reflect differing analyst perspectives on 3M's financial health and future prospects. This article was generated with the support of AI and reviewed by an editor. For more information see our T&C.
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3M Joins AI Infrastructure Partnership on Expanded Beam Optical Connectivity
3M established an agreement with a group of technology companies focused on expanded beam optical connectivity to be used in AI infrastructure. Expanded beam optical technology aims to eliminate dust and other contamination in data centers, reducing the need for connector inspection or cleaning. It is "increasingly seen as a critical enabler for AI infrastructure, offering advantages in reliability, ease of maintenance and performance in high-density environments," 3M said. The agreement "is designed to accelerate deployment of high-performance optical interconnects required to support the rapid scaling of AI data centers." Companies participating in the agreement include AMD, Cisco, Meta and Oracle, in addition to several others. Write to Nicholas G. Miller at [email protected]
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3M has entered a multi-source agreement with major technology companies including AMD, Cisco, Meta, and Oracle to develop open specifications for expanded beam optical connectivity in AI infrastructure. The coalition aims to address reliability and maintenance challenges as AI data centers scale, with expanded beam technology eliminating dust contamination issues that slow network builds.
3M has joined a multi-source agreement with leading technology companies to develop open specifications for expanded beam optical connectivity in AI infrastructure
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. The coalition includes AMD, Cisco, Meta, Oracle, Arista Networks, Amphenol, Accelink, Aperion, Molex, Nexthop-ai, Senko, Source Photonics, Sumitomo, TE Connectivity, viaPhoton, and Xscape Photonics. This AI infrastructure partnership represents a coordinated effort to standardize optical connectivity for AI as data center demands intensify1
.The $74.8 billion industrial conglomerate's entry into this space comes at a time when the physical layer of AI data centers faces unprecedented pressure from scaling AI workloads. Oracle serves as co-chair in the formation of the expanded beam optical multi-source agreement, with the initial technical working group already beginning development of the first connector specification
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.Expanded beam optical technology aims to eliminate dust and other contamination in AI data centers, reducing the need for connector inspection or cleaning
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. This capability addresses a significant operational overhead issue that currently slows network builds. Rajagopal Subramaniyan, senior vice president of OCI networking at Oracle, explained that strict connector hygiene requirements create bottlenecks that expanded beam technology can overcome, enabling more resilient AI infrastructure and future rack-scale optical architectures1
.The technology is increasingly seen as a critical enabler for AI infrastructure, offering advantages in reliability, ease of maintenance, and performance in high-density environments
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. As Alex An, vice president of 3M's data center vertical, noted, AI workloads push the physical layer to new limits, requiring high-performance optical connectivity solutions that are interoperable and scalable across a growing ecosystem1
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The multi-source agreement provides a framework for members to contribute to a shared specification covering multiple expanded beam optical connector configurations
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. This collaborative approach is designed to accelerate deployment of high-performance optical interconnects required to support the rapid scaling of AI data centers2
.The agreement remains open to additional members across the data center and networking ecosystem, with information available at www.ebomsa.org
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. The participation of technology companies spanning chip makers, networking equipment providers, and cloud infrastructure operators signals broad industry recognition that standardized optical solutions are essential for the next phase of AI expansion. As data centers continue to densify and AI clusters grow larger, the ability to deploy reliable, maintainable optical connections without constant cleaning protocols could significantly reduce operational overhead and enable more ambitious network topologies that support scaling AI workloads efficiently.Summarized by
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