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Intel Crescent Island PCB leak gives us our first look at the Xe3P GPU and its 160GB LPDDR5X memory design
Back in February 2026, Intel released an introductory video indicating that its next-generation Xe3P architecture would follow the Xe2 architecture. Later, it was reported that Xe3P would not appear in consumer Celestial gaming graphics cards, and Intel canceled the product entirely. Instead, Intel plans to use the architecture in Crescent Island. Crescent Island is Intel's next data-center GPU, targeting AI inference rather than a consumer Arc graphics card. Intel confirmed the product in October, featuring the Xe3P graphics architecture, 160GB of LPDDR5X memory, and targeting air-cooled data centers and workstations optimized for AI inference workloads. Now, the upcoming Crescent Island accelerator has appeared in a first PCB leak from YuuKi_AnS, spotted by Wccftech. The leaked PCB gives us a look at the large Xe3P GPU die and its LPDDR5X memory configuration. The GPU chip itself occupies a significant portion of the PCB and is notably larger than Intel's current flagship, the Xe2-based BMG-G31. The leaked PCB reportedly features 20 LPDDR5X memory sites - 12 on the front and 8 on the back - supporting a total of 160GB of LPDDR5X memory. Intel chose LPDDR5X over HBM as a cost-effective alternative that avoids the power-supply strain HBM would impose on the system. NVIDIA and AMD are already shipping data center AI hardware with high-end HBM memory like HBM3E, and neither is shy about teasing HBM4 for upcoming chips like Rubin and MI400. But HBM is getting harder to come by thanks to surging demand, and prices are climbing. Leveraging LPDDR5X memory could give Intel a significant cost advantage without sacrificing the performance needed for inference workloads. The new architecture is also built to handle a wide mix of data types, which should be a win for tokens-as-a-service providers and anyone running inference at scale. Other than that, the pictures show a high-end PCB design with 18 VRM positions, 13 of which appear populated. A USB-C port is visible on the side, presumably for testing, and a 12V-2x6 power connector is located at the rear of the PCB. The PCB leak does not confirm final clocks, power limits, or performance figures. Intel has not announced pricing or launch timing, other than confirming that customer sampling is planned for the second half of 2026.
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Intel's Crescent Island PCB Leaks, Showing a Massive Xe3P GPU, 16-Pin Connector, 160GB LPDDR5X as Intel Sidesteps the HBM Shortage
Intel's next-generation Crescent Island PCIe graphics card has been pictured in the first PCB leak, giving us a look at the large Xe3P GPU & support for LPDDR5X memory. The first pictures of Intel's Crescent Island PCIe accelerator's PCB have been leaked by YuuKi_AnS. Crescent Island is the latest and upcoming Inference accelerator designed for AI workflows, offering competitive value. The leaked PCB gives us an idea of what the graphics card will look like. Starting first with the GPU itself, which looks massive and much larger than Intel's current flagship, the Xe2-based BMG-G31. The Crescent Island GPU is based on the Xe3P architecture, the one following the current Xe3 architecture. The BGA pad shows the massive scope of the chip. Surrounding the GPU are 12 sites for the memory, which are much smaller than standard GDDR modules. This is due to the fact that Crescent Island features LPDDR5X memory & is designed to be a cost-effective option versus the more expensive HBM standards. There are 12 sites on the front & 8 sites on the back for a total of 20 LPDDR5X sites, totalling up to 160 GB capacity. That's 8 GB per module. Other than that, you are looking at a high-end PCB design with 13 VRMs, which seem to be the ones that will be populated, while the actual total count is 18. Power is provided through a single 16-pin connector featured on the back of the board. YuuKi provides additional details, such as a side USB Type-C port, which seems to be for testing purposes. Currently, the Intel Crescent Island GPU is still a few months away from launch, but based on this PCB looks much closer to the final version. The Intel Crescent Island GPU is based on the brand-new Xe3P architecture, which is the same graphics architecture that was teased by the company last week during its Panther Lake and Xe3 deep dives. The new architecture will be a further upgrade over the Xe3 architecture, and for clients, the architecture will be featured on a next-gen Arc family, the Arc C-Series. But Xe3P is going to be even more scalable, from client iGPUs to data center AI GPUs. The new data center GPU code-named Crescent Island is being designed to be power and cost-optimized for air-cooled enterprise servers and to incorporate large amounts of memory capacity and bandwidth, optimized for inference workflows. Key features include: Intel Crescent Island will be both power- and cost-optimized. It will be targeted at air-cooled data center solutions and will be aimed at AI inference workloads. According to Intel, the Xe3P graphics architecture used for Crescent Island will be optimized for performance per watt. The card itself will feature a massive 160 GB memory capacity based on the LPDDR5X standard. Interestingly, Intel is going with LP5X. Competitors such as NVIDIA and AMD are offering their data center AI solutions with top-grade HBM memory, such as HBM3E, and already talking about HBM4 for next-gen parts such as Rubin and MI400. But at the same time, sourcing HBM has become difficult due to increased demand, and that has also led to higher prices. Leveraging LPDDR5X memory can give Intel a big edge in the cost/performance segment. Furthermore, the architecture will support a broad range of data types that are ideal for "Tokens-as-a-service" providers and inference use cases. Intel is already evaluating its open and unified software stack for heterogeneous AI systems with its existing Arc Pro B-series lineup, so future iterations will be able to access these optimizations early on. Intel is currently targeting customer sampling for its Crescent Island GPU for the 2H of 2026, so we'll definitely learn more about the GPU in the coming months.
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A leaked PCB of Intel's upcoming Crescent Island accelerator shows a massive Xe3P GPU paired with 160GB LPDDR5X memory across 20 modules. The data-center GPU targets AI inference workloads and sidesteps the HBM shortage with a cost-effective alternative, positioning Intel to compete in the AI hardware market with customer sampling planned for second half of 2026.

Intel's upcoming data-center GPU has surfaced in a PCB leak that offers the first detailed look at the company's Xe3P GPU architecture and its unconventional memory approach. The Intel Crescent Island accelerator, leaked by YuuKi_AnS and spotted by Wccftech, reveals a massive chip design paired with 160GB LPDDR5X memory distributed across 20 modules—12 on the front and 8 on the back, with each module providing 8GB capacity
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. The Xe3P GPU die itself occupies a significant portion of the PCB and appears notably larger than Intel's current flagship, the Xe2-based BMG-G31, suggesting substantial computational capability for AI inference tasks2
.Intel's decision to equip Crescent Island with LPDDR5X memory rather than high-bandwidth memory represents a strategic pivot in the AI hardware market. While competitors NVIDIA and AMD ship data center AI hardware with HBM3E and already discuss HBM4 for upcoming chips like Rubin and MI400, Intel chose a different path
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. The company selected LPDDR5X as a cost-effective solution that avoids the power-supply strain HBM would impose on systems while addressing the growing HBM shortage driven by surging demand and climbing prices1
. This approach could give Intel a significant cost advantage in the inference accelerator segment without sacrificing the performance needed for AI inference workloads at scale1
.The leaked PCB reveals a high-end design with 18 VRM positions, 13 of which appear populated, indicating robust power delivery for demanding workloads
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. Power is supplied through a single 16-pin connector located at the rear of the board, while a USB-C port visible on the side is presumably for testing purposes2
. Intel confirmed in October that Crescent Island targets air-cooled data centers and workstations optimized for AI inference, emphasizing power efficiency and cost optimization1
. The Xe3P architecture will support a broad range of data types, making it particularly suitable for Tokens-as-a-service providers and anyone running inference at scale1
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The PCB leak suggests Intel is much closer to finalizing Crescent Island, with customer sampling planned for the second half of 2026
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. Intel is already evaluating its open and unified software stack for heterogeneous AI systems with its existing Arc Pro B-series lineup, meaning future iterations will access these optimizations early2
. The Xe3P architecture, which follows the current Xe3 architecture, will scale from client integrated GPUs to data center AI GPUs, with plans to feature in a next-generation Arc C-Series for consumers2
. While Intel previously canceled Xe3P for consumer Celestial gaming graphics cards, the architecture's focus on enterprise servers and inference workloads positions the company to compete in a segment where cost-per-performance matters more than raw bandwidth. Watch for pricing announcements and performance benchmarks as customer sampling approaches, which will determine whether Intel's memory strategy can truly challenge established players in the AI hardware market.Summarized by
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