Samsung and Nvidia discuss next-generation chips including HBM4E and HBM5 in Seoul meeting

Samsung memory chief, Nvidia CEO discuss next-generation HBM cooperation - The Korea Times

Jun Young-hyun, right, head of Samsung Electronics' device solutions division, poses with Jensen Huang, CEO of Nvidia, at a hotel in Seoul, Monday. Courtesy of Samsung Electronics The head of Samsung Electronics' memory business said Monday he met with Nvidia CEO Jensen Huang and discussed long-term cooperation in next-generation high-bandwidth memory (HBM) products. Jun Young-hyun, who leads Samsung Electronics' device solutions division, made the remarks to reporters after meeting Huang during his visit to Korea to meet industry leaders to explore broader cooperation opportunities across the artificial intelligence (AI) ecosystem. "We have maintained cooperation with CEO Huang for a long period, and we have had very productive discussions so far," Jun said. A key focus of the talks was long-term collaboration on next-generation HBM technologies, including HBM4E and HBM5, as well as cooperation in the foundry business, Jun said. HBM chips are advanced memory semiconductors that work alongside AI processors to provide the massive bandwidth needed for AI training and inference, making them a critical component of modern AI systems. Jun added that in the shorter term, Samsung Electronics will make efforts to supply sufficient HBM4 products to Nvidia, which accounts for a dominant share of the global AI accelerator market. Their meeting came as Samsung seeks to strengthen its position in the rapidly growing HBM market, where demand is being driven by the expansion of AI data centers and the deployment of increasingly powerful AI models. Responding to a question about Huang's previous remark that SK hynix, Samsung's Korean rival, will remain Nvidia's biggest memory partner, Jun replied that the company will "work hard on what we do" and prove it with results.

Samsung and Nvidia discuss chip cooperation in Seoul meeting By Investing.com

Investing.com -- Samsung Electronics' chip division head Jun Young-hyun met with Nvidia CEO Jensen Huang in Seoul on Monday to discuss cooperation in next-generation foundry chips. The two companies are currently working together on autonomous driving chips and AI accelerator chips, Jun said. He added that Samsung and Nvidia explored cooperation on future generations of semiconductor products during their meeting. Jun said the companies held detailed talks on long-term cooperation, including high-bandwidth memory HBM4E and HBM5 chips. The executives also discussed short-term cooperation in HBM4 and foundry operations. Samsung is collaborating with Nvidia on autonomous driving chips for 4-nanometer and 8-nanometer nodes, as well as on Nvidia's accelerator chip, according to Jun. Jun serves as co-CEO of Samsung Electronics and leads the company's semiconductor division. This article was generated with the support of AI and reviewed by an editor. For more information see our T&C.

Samsung Elec's chip chief says he discussed next-generation foundry with Nvidia CEO

SEOUL, June 8 (Reuters) - Samsung Electronics' co-CEO and head of its chip division, Jun Young-hyun, said on Monday he discussed cooperation in next-generation foundry chips with Nvidia CEO Jensen Huang during a meeting in Seoul. Jun said Samsung and Nvidia are currently collaborating on autonomous driving chips and Groq AI accelerator chips, and also discussed cooperation on future generations of semiconductor products. He added that the two companies had extensive discussions on long-term cooperation, including in high-bandwidth memory (HBM) 4E and HBM5 chips. In March, Huang unveiled Nvidia's new AI inference processor based on technology from chip startup Groq, adding that Samsung would manufacture Groq's LP30 chips, which are scheduled to be shipped in the second half of this year. (Reporting by Hyunjoo Jin, Joyce Lee and Heekyong Yang; Editing by Emelia Sithole-Matarise)