Samsung Secures NVIDIA Partnership for Next-Gen HBM4 Memory, Plans 2026 Mass Production
5 Sources
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Samsung readying mass production of next-gen HBM4 memory in 2026, 24Gb GDDR7 dies, 128GB+ DDR5
TL;DR: Samsung will begin mass production of next-gen 1c DRAM-based HBM4 memory, 24Gb GDDR7 dies, and 128GB+ DDR5 products in 2026, targeting AI and server markets. The company reported record Q3 2025 memory sales driven by strong AI demand and plans to expand 2nm GAA chip production and fab
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Samsung Electronics says it is in talks with Nvidia to supply next-generation HBM4 chips
Samsung, which plans to market the new chip next year, did not specify when it aims to ship the latest version of its HBM chip, a key building block of artificial intelligence chipsets. Samsung Electronics said on Friday it is in "close discussion" to supply its next-generation high-bandwidth
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Samsung Strikes a Crucial Deal with NVIDIA For Next-Gen HBM4 AI Memory, Validating Its Process as the Industry's Fastest With 11 Gbps Speeds
Samsung has secured a crucial 'HBM4 supply' deal with NVIDIA, as both firms announce their collaboration on cutting-edge technologies to drive the AI hype. The Korean giant has achieved a massive feat with its upcoming HBM4 technology, as the firm becomes one of the first manufacturers to secure a
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Samsuing Preps For Mass Production On Next-Gen HBM4 Memory in 2026: 24Gb GDDR7, And 128GB+ DDR5 Products In The Plans Too
Samsung is also set to begin production of next-gen HBM4 memory, 24 Gb GDDR7 DRAM & 128 GB+ products in 2026. Samsung has announced its Q3 2025 earnings report, highlighting a 15.4% increase in revenue versus the previous quarter. The South Korean technology company posted a revenue of KRW 86.1
[5]
Samsung Electronics in talks with Nvidia to supply next-generation HBM4 chips
SEOUL -- Samsung Electronics said on Friday it is in "close discussion" to supply its next-generation high-bandwidth memory (HBM) chips, or HBM4, to Nvidia, as the South Korean chipmaker scrambles to catch up with rivals in the AI chip race. Samsung, which plans to market the new chip next year,
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Samsung announces partnership with NVIDIA for HBM4 memory supply and plans mass production in 2026. The Korean chipmaker aims to regain market position with 11 Gbps HBM4 technology and expanded AI memory solutions.
Samsung Announces Strategic Partnership with NVIDIA
Samsung Electronics has secured a pivotal partnership with NVIDIA for the supply of next-generation HBM4 (High Bandwidth Memory) chips, marking a significant milestone in the South Korean chipmaker's efforts to regain its competitive edge in the AI memory market
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. The announcement comes as Samsung scrambles to catch up with rivals, particularly SK Hynix, which currently dominates NVIDIA's HBM supply chain.The partnership was formalized during NVIDIA CEO Jensen Huang's visit to Korea for the Asia-Pacific Economic Cooperation CEO Summit, where he met with Samsung Chairman Jay Y. Lee over dinner
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. NVIDIA confirmed the collaboration in a statement, noting "key supply collaboration for HBM3E and HBM4" without providing additional details2
.Technical Superiority of Samsung's HBM4 Technology
Samsung's HBM4 memory represents a significant technological advancement, featuring processing speeds of up to 11 gigabits-per-second (Gbps), substantially exceeding the JEDEC standard of 8Gbps
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. Built with the company's 6th-generation 10-nanometer-class DRAM and a 4nm logic base die, this technology positions Samsung as offering the fastest HBM4 solution currently available in the market3
.The superior performance characteristics make Samsung's HBM4 particularly attractive for NVIDIA's upcoming Rubin AI lineup and AMD's Instinct MI400 series AI GPUs
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. This technological edge has enabled Samsung to secure an early position in NVIDIA's supply chain, marking a considerable achievement in the competitive DRAM manufacturing landscape3
.Mass Production Timeline and Market Strategy
Samsung has outlined an ambitious production schedule, planning to begin mass production of HBM4 memory in 2026 alongside other advanced memory solutions including 24Gb GDDR7 dies and 128GB+ DDR5 products
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. The company aims to provide stable supply of its next-generation 2nm Gate-All-Around (GAA) production technology and HBM4 base die by 20264
.The strategic focus extends beyond HBM4, with Samsung planning to expand sales of high-value-added products including DDR5, LPDDR5x, and high-density QLC SSDs to meet growing AI application demands
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. Additionally, the company will begin operations at its new fabrication facility in Taylor, Texas, as part of its capacity expansion strategy4
.Related Stories
Financial Performance and Market Recovery
Samsung's memory business has shown remarkable recovery, posting record Q3 2025 quarterly sales with a 15.4% revenue increase compared to the previous quarter
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. The strong performance was driven by robust demand for HBM3E memory and server SSDs, reflecting the continuing wave of AI-driven market demand4
.Following the NVIDIA partnership announcement, Samsung's share price surged as much as 4.32% and has risen nearly 60% since July as investors anticipate the company's enhanced position in the AI memory market
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. Analysts view the HBM4 launch as a crucial test of Samsung's ability to regain market leadership and potentially secure significant market share that it was unable to achieve with previous HBM series products.References
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