Intel hires former SK hynix chief Seok-Hee Lee to lead advanced packaging push for AI chips
Intel has appointed Seok-Hee Lee, former CEO of SK hynix and SK On, as executive vice president of Intel Foundry to oversee advanced packaging, system integration, and back-end technology development. The hire comes as Intel splits advanced packaging into a dedicated business unit, aiming to capture billions in revenue from hyperscaler customers building next-generation AI systems.