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Cerebras Systems, Ranovus win $45 million US military deal to speed up chip connections
SAN FRANCISCO, April 1 (Reuters) - Cerebras Systems, a Silicon Valley-based AI chip company, and Canadian chip startup Ranovus said on Tuesday that they had been awarded a $45 million contract from the U.S. military to speed up connections between computing chips. Cerebras, which aims to challenge
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Cerebras wins DARPA contract to build AI system with co-packaged optics - SiliconANGLE
Cerebras wins DARPA contract to build AI system with co-packaged optics Cerebras Systems Inc., the creator of a wafer-scale chip with nearly one million cores, has won a hardware development contract from the U.S. Defense Advanced Research Projects Agency. Reuters reported that the agreement is
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Cerebras Systems and Ranovus have been awarded a $45 million contract by DARPA to develop a high-performance AI computing system using wafer-scale chips and co-packaged optics technology.

Cerebras Systems, a Silicon Valley-based AI chip company, and Canadian chip startup Ranovus have been awarded a $45 million contract from the U.S. Defense Advanced Research Projects Agency (DARPA)
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. The contract aims to develop a high-performance computing system that will significantly speed up connections between computing chips, potentially revolutionizing AI processing capabilities.At the heart of this project is Cerebras' WSE-3 chip, a wafer-scale processor optimized for AI workloads. Unlike conventional chips that are slightly larger than a postage stamp, the WSE-3 is about the size of a dinner plate, measuring roughly a foot wide
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. This massive chip boasts impressive specifications:Cerebras claims that this design allows for more efficient AI processing compared to traditional graphics cards, as the large onboard memory can often store all data generated during AI model processing, reducing the need for external data transfers
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.A key aspect of the DARPA project is the integration of Ranovus' "wafer scale co-packaged optics" technology with Cerebras' chips. This innovation aims to use light, rather than electrical signals, to transfer information between chips more quickly and with lower power consumption
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. The co-packaged optics technology eliminates the need for standalone pluggable transceivers by integrating them directly into the processors, potentially increasing efficiency and network capacity in AI clusters2
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The collaboration between Cerebras and Ranovus under the DARPA contract has ambitious objectives:
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.This contract comes at a significant time for Cerebras, as the company has already filed for an initial public offering and is positioning itself to challenge Nvidia in the AI chip market
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. The project also highlights the growing interest in optical computing solutions, with various startups seeking funding to tackle the challenge of integrating optical connections with computing chips1
.Cerebras is also involved in another DARPA project called the DRBE program, which aims to create a virtual environment for testing wireless communications systems
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. This multi-faceted engagement with DARPA underscores the company's growing importance in advanced computing research and development.Summarized by
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