Intel bets billions on advanced packaging as Google and Amazon eye alternatives to TSMC bottleneck
Intel is in talks with Google and Amazon to provide advanced chip packaging services worth billions annually, positioning itself as an alternative to capacity-constrained TSMC. The chipmaker's CFO projects packaging revenue exceeding $1 billion, up from hundreds of millions, as AI demand creates a critical bottleneck in chip production. Intel's EMIB technology competes directly with TSMC's CoWoS as tech giants scramble for custom AI chip capacity.